SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF

Abstract

This invention application provides a method for manufacturing a SOI substrate, and the method comprising: providing a first semiconductor substrate; growing a first insulating layer on a top surface of the first semiconductor substrate for forming a first wafer; irradiating the first semiconductor substrate via a ion beam for forming a deuterium and helium co-doping layer to a pre-determined depth from a top surface of the first insulating layer; growing a second insulating layer on a top surface of the second semiconductor substrate for form a second wafer; bonding the first wafer with the second wafer; annealing the first wafer and second wafer; separating a part of the first wafer from the second wafer; and forming a deuterium and helium co-doping semiconductor layer on the second wafer.

Claims

1. A manufacturing method of silicon on insulator substrate, comprising the steps of: providing a first semiconductor substrate; growing a first insulating layer on a top surface of the first semiconductor substrate for forming a first wafer; irradiating the first semiconductor substrate via a ion beam for forming a deuterium and helium co-doping layer to a pre-determined depth from a top surface of the first insulating layer; providing a second substrate; growing a second insulating layer on a top surface of the second semiconductor substrate for forming a second wafer; bonding the first wafer with the second wafer in a face to face manner; annealing the first wafer and second wafer; separating a part of the first wafer from the second wafer; and forming a deuterium and helium co-doping semiconductor layer on the second wafer.

2. The method according to claim 1, wherein a material of the first semiconductor substrate includes IV group element, silicon-germanium (SiGe), III-V group compound, III group-nitrogen compound, or II-VI group compound.

3. The method according to claim 1, wherein the pre-determined depth is between 0.1 μm and 5 μm.

4. The method according to claim 1, wherein the deuterium and helium co-doping layer is implanted at the first semiconductor substrate through a deuterium and helium ions co-beam, and an accelerated voltage of the deuterium and helium ions co-beam is between 1 kev and 100 kev, and a doping dosage of the deuterium and helium ions co-beam is between 10.sup.16 ions/cm.sup.2 and 2×10.sup.17 ions/cm.sup.2.

5. The method according to claim 1, wherein a material of the second semiconductor substrate includes IV group element, silicon-germanium (SiGe), III-V group compound, III group-nitrogen compound, or II-VI group compound.

6. The method according to claim 1, wherein the first wafer is boned with the second wafer face to face at a temperature between 200 degrees centigrade and 400 degrees centigrade.

7. The method according to claim 1, wherein the step of bonding the first wafer with the second wafer further includes: wetting the first insulating layer and the second insulating layer; contacting the first insulating layer with the second insulating layer; and pressing the first insulating layer and the second insulating layer for bonding the first insulating layer on the second insulating layer.

8. The method according to claim 1, wherein the step of annealing the first wafer and second wafer further includes: heating the first wafer and the second wafer to a temperature between 600 degrees centigrade and 900 degrees centigrade; and cooling the first wafer and the second wafer to a temperature between 200 degrees centigrade and 600 degrees centigrade

9. The method according to claim 8, wherein time for cooling the first wafer and the second wafer is between 30 minutes and 120 minutes.

10. The method according to claim 1, wherein a thickness of the deuterium and helium co-doping semiconductor layer is between 50 Å and 50000 Å.

11. The method according to claim 1, further comprising a step of heating the second wafer to 10000 degrees centigrade once again after separating a part of the first wafer from the second wafer.

12. The method according to claim 11, wherein time for heating the first wafer and the second wafer once again is between 30 minutes and 8 hours.

13. A silicon on insulator substrate, comprising: a semiconductor substrate; an insulating layer grown on a top surface of the semiconductor substrate; and a deuterium and helium co-doping semiconductor layer grown on a top surface of the insulating layer.

14. The silicon on insulator substrate according to claim 13, wherein a material of the semiconductor substrate includes IV group element, silicon-germanium (SiGe), III-V group compound, III group-nitrogen compound, or II-VI group compound.

15. The silicon on insulator substrate according to claim 13, wherein a thickness of the deuterium and helium co-doping semiconductor layer is between 50 Å and 50000 Å.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Exemplary embodiments will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:

[0011] FIG. 1 is a flowchart of a method for manufacturing a silicon on insulator substrate according to one embodiment of the present invention; and

[0012] FIGS. 2A-2H are cross-sectional views of a process for manufacturing a silicon on insulator substrate.

DETAILED DESCRIPTION

[0013] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, in which like reference numbers indicate like features. Persons having ordinary skill in the art will understand other varieties for implementing example embodiments, including those described herein.

[0014] FIG. 1 provides a method for manufacturing a silicon on insulator substrate according to one embodiment of this invention, and the manufacture method comprises:

[0015] Step 101 (S101): providing a first semiconductor substrate;

[0016] Step 102 (S102): growing a first insulating layer on a bottom surface of the first semiconductor substrate for forming a first wafer;

[0017] Step 103 (S103): Deuterium and helium being used for source gases, and irradiating the first semiconductor substrate via a deuterium and helium ions co-beam for forming a deuterium and helium co-doping layer to a pre-determined depth from a top surface of the first insulating layer;

[0018] Step 104 (S104): providing a second semiconductor substrate;

[0019] Step 105 (S105): growing a second insulating layer on a top surface of the second semiconductor substrate for forming a second wafer;

[0020] Step 106 (S106): bonding the first wafer with the second wafer in a face to face manner;

[0021] Step 107 (S107): annealing the first wafer and the second wafer;

[0022] Step 108 (S108): separating a part of the first wafer from the second wafer; and

[0023] Step 109 (S109): forming a deuterium and helium co-doping semiconductor layer on the second wafer;

[0024] Step 110 (S110): reusing the separated part of the first wafer.

[0025] In order to describe the method for manufacturing the silicon on insulator more specifically, FIGS. 2A-2G provide cross-sectional views of a process for manufacturing a silicon on insulator substrate.

[0026] The first step is referred to FIG. 2A, a first semiconductor substrate 100 is provided, wherein the material of the first semiconductor substrate 100 may include IV group element, silicon-germanium (SiGe), III-V group compound, III group-nitrogen compound, or II-VI group compound. In one embodiment, the material of the first semiconductor substrate 100 is single crystal silicon. In another embodiment, when the material of the first semiconductor substrate 100 is SiGe, and the weight percent of germanium is between 5%˜90%.

[0027] The next process is referred to FIG. 2B, a first insulating layer 104 is grown on a top surface 102 of the first semiconductor substrate 100 for forming a first wafer 106, wherein the material of the first insulating layer 104 may include silicon dioxide, silicon nitride, or aluminum nitride. In one embodiment, the material of the first insulating layer is silicon dioxide and the thickness of the first insulating layer 104 may be between 0.1 nm and 500 nm.

[0028] The next process is referred to FIG. 2C, helium and deuterium can be processed by an electric field for producing a helium plasma and a deuterium plasma, and a helium and deuterium ions co-beam may be generated through taking helium ions of a helium plasma and deuterium ions of a deuterium plasma. The first wafer 106 is illuminated by a helium and deuterium ions co-beam 108 for implanting a deuterium and hydrogen co-doping layer 112 at a pre-determined depth H from a top surface 110 of the first insulating layer 110. The pre-determined depth H may be controlled by an accelerated energy of the helium and deuterium ions co-beam 108 and an incidence angle of the hydrogen and deuterium ions co-beam 108, wherein the accelerated energy of the hydrogen and deuterium ions co-beam 108 may be controlled by an accelerated voltage and a doped concentration. In one embodiment, the pre-determined depth H is between 0.1 μm and 5 μm, an accelerated voltage of the hydrogen and deuterium ions co-beam 108 is between 1 keV and 100 keV, and a doping dosage of the hydrogen and deuterium ions co-beam 108 is between 10.sup.16 ions/cm.sup.2 and 2×10.sup.17 ions/cm.sup.2.

[0029] The next step is referred to FIG. 2D, a second semiconductor substrate 200 is provided, wherein the material of the second semiconductor substrate 200 may includes IV group element, silicon-germanium (SiGe), III-V group compound, III group-nitrogen compound, or II-VI group compound. In one embodiment, the material of the second semiconductor substrate 200 is single crystal silicon.

[0030] The next process is referred to FIG. 2E, a second insulating layer 204 is grown on a top surface 202 of the second semiconductor substrate 200 for forming a second wafer 206, wherein the material of the second insulating layer 204 may include silicon dioxide, silicon nitride, or aluminum nitride. In one embodiment, the material of the second insulating layer 204 is silicon dioxide and the thickness of the second insulating layer 204 may be between 0.05 nm and 10 nm.

[0031] The next step is referred to FIG. 2F, the first wafer 106 is bonded with the second wafer 206 in a face to face manner. In one embodiment, the first wafer 106 is bonded with second wafer 206 through hydrophilic bonding process, wherein the first wafer 106 is bonded with second wafer 206 at a temperature between 200 degrees centigrade and 400 degrees centigrade. The detailed steps of hydrophilic bonding process further comprises the steps of: wetting the first insulating layer 104 and the second insulating layer 204; contacting the wetted first insulating layer 104 with the wetted second insulating layer 204; and pressing the first insulating layer 104 and the second insulating layer 204 for closely bonding the first insulating layer 104 with the second insulating layer 204.

[0032] The next step is referred to FIG. 2G, the first wafer 106 and the second wafer 206 are annealed, and the annealing process comprises the steps of: heating the first wafer 106 and the second wafer 206 to a temperature between 600 degrees centigrade and 900 degrees centigrade; cooling the first wafer 106 and the second wafer 206 to a temperature between 200 degrees centigrade and 600 degrees centigrade, wherein time for cooling the first wafer 106 and the second wafer 206 is between 30 minutes and 120 minutes. After annealing the first wafer 106 and the second wafer 206, the deuterium and helium co-doping layer 112 are transferred to a plurality of deuterium and helium co-doping bubbles 300.

[0033] The next step is referred to FIG. 2H, a part of the first wafer 106 is separated from the second wafer 206 for forming a deuterium and helium co-doping semiconductor layer 400, wherein the deuterium and helium co-doping semiconductor layer 400 is bonded with the first insulating layer 104 and a thickness of the deuterium and helium co-doping semiconductor layer 400 is between 50 Å and 50000 Å, and the deuterium and helium co-doping bubbles 300 are in the deuterium and helium co-doping semiconductor layer 400.

[0034] It is worth noting that the separated part of the first wafer 106 may further be preceded with chemical-mechanical polishing (CMP) and cleaned, so that the separated part of the first wafer 106 may be reused for economizing on cost. The second wafer 106 bonded with the deuterium and hydrogen co-doping semiconductor layer 400 may further be heated to 10000 degrees centigrade, and time for heating the second wafer 106 is between 30 minutes and 8 hours.

[0035] Because a dangling bond has a higher activity, a trap center may be produced to cause that an electron is bonded with an electron hole once again. Consequently a resilience of a semiconductor device to hot carrier effects is decreased. This invention provides a SOI substrate for manufacturing a semiconductor device. The SOI substrate can reduce a parasitic capacitance between a drain and a source of the semiconductor device, deuterium atoms (or deuterium ions) doped in the SOI substrate may be diffused into an interface between a gate oxide and the SOI substrate after growing the gate oxide on the SOI substrate, and deuterium atoms (or deuterium ions) are covalently bonded to semiconductor atoms for eliminating the dangling bond and increasing the resilience of the semiconductor device to hot carrier effects. Moreover, the method for manufacturing the SOI substrate doesn't need a very high deuterium pressure, and the cost for manufacturing the SOI substrate can be reduced substantially.

[0036] While various embodiments in accordance with the disclosed principles been described above, it should be understood that they are presented by way of example only, and are not limiting. Thus, the breadth and scope of exemplary embodiment(s) should not be limited by any of the above-described embodiments, but should be defined only in accordance with the claims and their equivalents issuing from this disclosure. Furthermore, the above advantages and features are provided in described embodiments, but shall not limit the application of such issued claims to processes and structures accomplishing any or all of the above advantages.