RIGID BOARD PLASTIC FLOORING AND ITS PRODUCTION METHOD

20210206143 · 2021-07-08

    Inventors

    Cpc classification

    International classification

    Abstract

    The invention relates to a rigid board plastic flooring comprising a wear layer, a decoration layer, a first connecting layer and a bottom layer which are connected in sequence, and also relates to the production method thereof. The bottom layer of the flooring is prepared using extrusion molding without adding plasticizer. The product is therefore more environmentally friendly. The edge of the click product is not easily damaged during storage and transportation as the bottom layer comprises a plastic hard board and the strength of the click profile is strong.

    Claims

    1. A method of producing a rigid board plastic flooring comprising the steps of: extruding a bottom layer; overlapping sequentially a back embossment board, the bottom layer a first connecting layer, a decoration layer, a wear layer to form a sandwich; hot pressing the sandwich with temperature and pressure apply a UV treatment to a top surface of the sandwich; annealing the sandwich; cooling the product to ambient temperature; and cutting the sandwich to size.

    2. The method of claim 5, wherein the bottom layer is a sound and shock absorbing layer connected to the bottom with a second connecting layer.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0026] The particular features and advantages of the invention as well as other objects will become apparent from the following description taken in connection with the accompanying drawing in which:

    [0027] FIG. 1 is structure diagram 1 of rigid board plastic flooring.

    [0028] FIG. 2 is structure diagram 2 of rigid board plastic flooring.

    [0029] FIG. 3 is structure diagram of click profile.

    DETAILED DESCRIPTION OF THE INVENTION

    [0030] The following further explains the invention by combining the figures:

    [0031] As shown in FIG. 1, the product comprises a wear layer 1, a decoration layer 2, a connecting layer 3 and a bottom layer 4, which are connected in sequence. The surface layer shall include a transparent wear layer of 0.1-1.0 mm thickness and can be prepared from transparent polymer materials such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc. The second layer includes a decoration layer and this can be prepared from polymer materials such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc. The third layer includes a connecting layer of 0.01-0.5 mm thickness and 5-300 g/m.sup.2 in terms of gram weight and can be prepared from the membrane or cloth which is not adhesive at room temperature and can stick the upper layer and the lower layer together when heated to 50-200° C. Moreover, the fourth layer shall include a bottom layer of 2.0-10.0 mm thickness made from polymer hard board such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc.

    [0032] As shown in FIG. 2, the product comprises a wear layer 1, decoration layer 2, a first connecting layer 31, bottom layer 4, a second connecting layer 32 and a sound and shock-absorbing layer 5 which are connected in order. The surface layer includes a transparent wear layer of 0.1-1.0 mm thickness and can be prepared from transparent polymer materials such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc. The second layer includes a decoration layer and can be prepared from polymer materials such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc. The third layer includes a first connecting layer of 0.01-0.5 mm thickness and 5-300 g/m.sup.2 in terms of gram weight and is prepared from membrane or cloth which is non-adhesive at room temperature and can stick the upper layer and the lower layer together when heated to 50-200° C. The fourth layer shall involve a bottom layer of 2.0-10.0 mm thickness and can be a polymer hard board, such as PP, PE, PVC, PET, ABS, PC, POM, PMMA, PS, PEEK, PTFE, PVDF, etc. The fifth layer involves a second connecting layer of 0.01-0.5 mm thickness and 5-300 g/m.sup.2 in terms of gram weight and can be prepared from material identical to that of the first connecting layer, that is, membrane or cloth which is not adhesive at room temperature and can stick the upper layer and the lower layer together when heated to 50-200° C. Otherwise, it can be different from that of the first connecting layer, that is, double-component glue, such as epoxy resin adhesive, polyurethane adhesive and acrylate adhesive. Moreover, the sixth layer shall include a sound and shock-absorbing layer, which can be cork or foamed material. The foamed material will be a low-foamed material, which can be PE foamed material, EVA foamed material, EPDM foamed material, PP foamed material, PVC foamed material, PU foamed material, SBR foamed material or NBR foamed material of 0.1-5.0 mm thickness.

    [0033] The invention also relates to a method of producing rigid board plastic flooring, wherein the bottom layer is molded by using the extruding process; the wear layer, decoration layer, first connecting layer and bottom layer shall be subjected to hot press under a certain temperature and pressure; the bottom layer comprises the PVC powder, processing agent, internal lubricant, external lubricant, the rare-earth stabilizer and the calcium carbonate with percentages of 9.5-61.75%, 0-5.5%, 0.4-0.5%, 0.1-0.6%, 2.0-2.5% and 33.25-85.50% respectively.

    [0034] 1) As for structure 1, the production method is as follows: [0035] a. Hot press: Overlap a back embossment board, the bottom layer, the first connecting layer, the decoration layer, the wear layer and the embossment board in sequence and implement hot press under a certain temperature and pressure; [0036] b. UV coating and annealing: Implement UV treatment to the surface of the semi-finished product which has already been stuck together, therefore increasing the abrasion resistance and the product then gains a certain glossiness. Then implement annealing to the product and cool it when the product has been heated to certain temperature, therefore the product has nice physical property. [0037] c. Cutting: Cut to size as required according to the needs of the customer. [0038] d. Trimming/beveling/profiling the click product (see FIG. 3): Make the appearance of the product to be a resemblance of wood/stone flooring by trimming/beveling/profiling the click product according to the requirements of the customer.

    [0039] 2) As for structure 2, the production method is as follows: [0040] a. Hot press: Overlap a back embossment board, the bottom layer, the first connecting layer, the decoration layer, the wear layer and the embossment board in the right order and implement hot press under a certain temperature and pressure; [0041] b. UV coating and annealing: Implement UV treatment to the surface of the semi-finished product after step a, wherein the abrasion resistance is increased and the product has gained a certain glossiness. Then implement annealing to the product and cool it when the product is heated to certain temperature. The product therefore has a nice physical property. [0042] c. Stick the sound and shock-absorbing layer to the bottom surface of the bottom layer by using the second connecting layer. [0043] d. Cutting: Cut the product to size as required by the customer. [0044] e. Trimming/beveling/profiling the click product (see FIG. 3): Make the appearance of the product to be a resemblance of wood/stone flooring by trimming/beveling/profiling the click product according to the requirements of the customer.

    [0045] In conclusion, the bottom layer of the flooring product shall be prepared by using extrusion molding, without adding plasticizer. Therefore, the product is more environmentally friendly; the edge of the click product is not easily damaged during storage and transportation because the bottom layer includes a polymer hard board and the click product produced is strong.

    [0046] The above-mentioned example is a better version of the product and does not limit the technical solution of the invention. Moreover, the technical solution which can be implemented on the basis of the above-mentioned description without creative additions shall be deemed as belonging to the protected scope of the utility model.