Multilayer films and laminates containing slip agents

Abstract

The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer. The present disclosure also provides a laminate containing said sealant layer.

Claims

1. A coextruded multilayer film comprising at least two layers comprising: a sealant layer comprising (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; (C) a saturated primary fatty acid amide having a melting point greater than 100° C., the unsaturated primary fatty acid amide and the saturated primary fatty acid amide having a weight ratio of from 3:1 to 1:6; and a second layer in contact with the sealant layer, the second layer comprising a second ethylene-based polymer.

2. The coextruded multilayer film of claim 1, wherein the unsaturated primary fatty acid amide is selected from the group consisting of erucamide, oleamide, and combinations thereof.

3. The coextruded multilayer film of claim 1, wherein the saturated primary fatty acid amide is selected from the group consisting of behenamide, palmitamide, stearamide, and combinations thereof.

4. The coextruded multilayer film of claim 1, wherein the first ethylene-based polymer is selected from the group consisting of an ethylene homopolymer, an ethylene/α-olefin copolymer, and combinations thereof.

5. The coextruded multilayer film of claim 1, wherein the sealant layer further comprises a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C.

6. The coextruded multilayer film of claim 1, wherein the sealant layer comprises from 0.01 wt % to 5 wt % of a combined amount of the unsaturated primary fatty acid amide and the saturated primary fatty acid amide, based on the total weight of the sealant layer.

7. A laminate comprising the coextruded multilayer film of claim 1.

8. A laminate comprising: a first film comprising a sealant layer comprising: (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; (C) a saturated primary fatty acid amide having a melting point greater than 100° C., the unsaturated primary fatty acid amide and the saturated primary fatty acid amide having a weight ratio of from 3:1 to 1:6; and a second film, wherein the first film is laminated to the second film.

9. The laminate of claim 8, wherein the unsaturated primary fatty acid amide is selected from the group consisting of erucamide, oleamide, and combinations thereof.

10. The laminate of claim 8, wherein the saturated primary fatty acid amide is selected from the group consisting of behenamide, palmitamide, stearamide, and combinations thereof.

11. The laminate of claim 8, wherein the first ethylene-based polymer is selected from the group consisting of an ethylene homopolymer, an ethylene/α-olefin copolymer, and combinations thereof.

12. The laminate of claim 8, wherein the sealant layer further comprises a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C.

13. The laminate of claim 8, wherein the sealant layer has a Laminate 55° C. Cure coefficient of friction (COF) from 0.01 to less than 0.4.

14. The laminate of claim 8, wherein the second film comprises a substrate layer comprising a component selected from the group consisting of a second ethylene-based polymer, a propylene-based polymer, polyamide, polyester, ethylene vinyl alcohol copolymer, polyethylene terephthalate, ethylene vinyl acrylate copolymer, ethylene methyl acrylate copolymer, ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene acrylic acid copolymer, ethylene methacrylic acid copolymer, an ionomer of ethylene acrylic acid, an ionomer of methacylic acid, maleic anhydride grafted ethylene-based polymer, a metal foil, and combinations thereof.

15. The laminate of claim 8, further comprising a third film, wherein the third film is laminated to the second film.

Description

DETAILED DESCRIPTION

(1) The present disclosure provides a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer.

(2) The multilayer film contains two layers, or more than two layers. For example, the multilayer film can have two, three, four, five, six, seven, eight, nine, ten, eleven, or more layers. In an embodiment, the multilayer film contains only two layers, or only three layers.

(3) 1. Sealant Layer

(4) The coextruded multilayer film contains a sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; (C) a saturated primary fatty acid amide having a melting point greater than 100° C.; (D) optionally, a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C.; and (E) optionally, an additive. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6.

(5) The sealant layer has two opposing surfaces. In an embodiment, the sealant layer is a continuous layer with two opposing surfaces.

(6) A. First Ethylene-Based Polymer

(7) The sealant layer contains a first ethylene-based polymer. The ethylene-based polymer has a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min. Nonlimiting examples of suitable ethylene-based polymer include LDPE and linear polyethylene. Nonlimiting examples of linear polyethylene include LLDPE, ULDPE, VLDPE, EPE, ethylene/α-olefin multi-block copolymers (also known as OBC), m-LLDPE, substantially linear, or linear, plastomers/elastomers, and combinations thereof. Nonlimiting examples of suitable ethylene-based polymer also include ethylene/α-olefin interpolymer and ethylene/α-olefin copolymer. Nonlimiting examples of suitable α-olefins include C.sub.3-C.sub.20 α-olefins, or C.sub.4-C.sub.20 α-olefins, or C.sub.3-C.sub.10 α-olefins, or C.sub.4-C.sub.10 α-olefins, or C.sub.4-C.sub.8 α-olefins. Representative α-olefins include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene and 1-octene. In an embodiment, the ethylene-based polymer is an ethylene/1-octene interpolymer.

(8) In an embodiment, the ethylene-based polymer contains greater than 50 wt % units derived from ethylene, or from 51 wt %, or 55 wt %, or 60 wt % to 70 wt %, or 80 wt %, or 90 wt %, or 95 wt %, or 99 wt %, or 100 wt % units derived from ethylene; and a reciprocal amount of units derived from an α-olefin comonomer, or from less than 50 wt %, or 49 wt %, or 45 wt %, or 40 wt % to 30 wt %, or 20 wt %, or 10 wt %, or 5 wt %, or 1 wt %, or 0 wt % units derived from an α-olefin comonomer, based on the weight of the ethylene-based polymer.

(9) The ethylene-based polymer has a density from 0.865 g/cc, or 0.870 g/cc, or 0.875 g/cc, or 0.880 g/cc, or 0.885 g/cc, or 0.890 g/cc, or 0.895 g/cc, or 0.900 g/cc, or 0.910 g/cc, or 0.915 g/cc to 0.920 g/cc, or 0.925 g/cc, or 0.930 g/cc.

(10) The ethylene-based polymer has a melt index from 0.5 g/10 min, or 1.0 g/10 min to 1.5 g/10 min, or 2.0 g/10 min, or 3.0 g/10 min, or 4.0 g/10 min, or 5.0 g/10 min, or 8.0 g/10 min, or 10 g/10 min, or 15 g/10 min, or 20 g/10 min, or 25 g/10 min.

(11) In an embodiment, the ethylene-based polymer is a LLDPE. The LLDPE is an ethylene homopolymer or an ethylene/α-olefin copolymer consisting of units derived from ethylene and a C.sub.3-C.sub.10 α-olefin comonomer, or a C.sub.4-C.sub.8 α-olefin comonomer, or a C.sub.6-C.sub.8 α-olefin comonomer. In an embodiment, the LLDPE has density from 0.910 g/cc, or 0.915 g/cc, or 0.920 g/cc to 0.925 g/cc, or 0.930 g/cc; and a melt index from 0.5 g/10 min, or 1.0 g/10 min to 1.5 g/10 min, or 2.0 g/10 min, or 3.0 g/10 min, or 4.0 g/10 min, or 5.0 g/10 min, or 8.0 g/10 min, or 10 g/10 min, or 15 g/10 min, or 20 g/10 min, or 25 g/10 min. In an embodiment, the ethylene-based polymer is a LLDPE that is an ethylene/1-octene copolymer.

(12) In an embodiment, the ethylene-based polymer is a LDPE. The LDPE is an ethylene homopolymer or an ethylene/α-olefin copolymer consisting of units derived from ethylene and a C.sub.3-C.sub.10 α-olefin comonomer, or a C.sub.4-C.sub.8 α-olefin comonomer, or a C.sub.6-C.sub.8 α-olefin comonomer. In an embodiment, the LDPE has density from 0.915 g/cc, 0.916 g/cc to 0.918 g/cc, or 0.920 g/cc, or 0.925 g/cc, or 0.930 g/cc; and a melt index from 0.5 g/10 min, or 1.0 g/10 min, or 1.5 g/10 min, or 2.0 g/10 min, or 3.0 g/10 min, or 4.0 g/10 min, or 5.0 g/10 min, or 8.0 g/10 min to 10 g/10 min, or 11 g/10 min, or 15 g/10 min, or 20 g/10 min, or 25 g/10 min.

(13) The sealant layer may contain more than one ethylene-based polymer. In an embodiment, the sealant layer includes at least two ethylene-based polymers, wherein each ethylene-based polymer differs from one another compositionally, structurally, and/or physically. For example, the sealant layer may contain an LLDPE and a LDPE.

(14) In an embodiment, the sealant layer contains from 70 wt %, or 75 wt %, or 80 wt %, or 85 wt %, or 90 wt % to 93 wt %, or 94 wt %, or 95 wt %, or 98 wt %, or 99 wt %, or 99.5 wt %, or 99.99 wt % ethylene-based polymer, based on the total weight of the sealant layer. In another embodiment, the sealant layer contains from 94 wt %, or 95 wt %, or 99 wt % to 99.99 wt % ethylene-based polymer, based on the total weight of the sealant layer.

(15) In an embodiment, the ethylene-based polymer is selected from LLDPE, LDPE, and combinations thereof. The sealant layer contains from 85 wt %, or 90 wt %, or 92 wt % to 93 wt %, or 94 wt % LLDPE; and from 1 wt %, or 2 wt %, or 3 wt %, or 4 wt %, or 5 wt %, or 6 wt %, or 7 wt % to 8 wt %, or 9 wt %, or 10 wt % LDPE, based on the total weight of the sealant layer.

(16) The ethylene-based polymer may comprise two or more embodiments disclosed herein.

(17) B. Unsaturated Primary Fatty Acid Amide

(18) The sealant layer contains an unsaturated primary fatty acid amide having a melting point of 100° C. or less. An “unsaturated primary fatty acid amide” is a molecule having the Structure (I):

(19) ##STR00001##
wherein R is a C.sub.3 to C.sub.24 alkyl moiety that is mono-unsaturated or poly-unsaturated. In an embodiment, R is a C.sub.11 to C.sub.24, or a C.sub.15 to C.sub.23 alkyl moiety, or a C.sub.17 to C.sub.21 alkyl moiety that is mono-unsaturated or poly-unsaturated. A “mono-unsaturated” alky moiety is an alkyl that has one double bond (a C═C bond), with all of the remainder carbon atoms being linked via single bonds (C═C bonds). A “poly-unsaturated” alky moiety is an alkyl that has at least two double bonds (C═C bonds). In an embodiment, R is selected from a C.sub.17 alkyl moiety and a C.sub.21 alkyl moiety that is mono-unsaturated or poly-unsaturated. In an embodiment, R is mono-unsaturated. Nonlimiting examples of suitable unsaturated primary fatty acid amides include erucamide, oleamide, and combinations thereof.

(20) In an embodiment, in the unsaturated primary fatty acid amide of the Structure (I), R is a C.sub.21 alkyl moiety that is mono-unsaturated. In a further embodiment, the unsaturated primary fatty acid amide is erucamide. Erucamide has the following Structure (II):

(21) ##STR00002##

(22) In an embodiment, in the unsaturated primary fatty acid amide of the Structure (I), R is a C.sub.17 alkyl moiety that is mono-unsaturated. In a further embodiment, the unsaturated primary fatty acid amide is oleamide. Oleamide has the following Structure (III):

(23) ##STR00003##

(24) The unsaturated primary fatty acid amide has a melting point of 100° C. or less. In an embodiment, the unsaturated primary fatty acid amide has a melting point from 40° C., or 50° C., or 60° C., or 65° C., or 70° C., or 75° C. to 80° C., or 85° C., or 90° C., or 95° C., or 100° C. In an embodiment, the unsaturated primary fatty acid amide is erucamide, which has a melting point of 75° C.-80° C. In another embodiment, the unsaturated primary fatty acid amide is oleamide, which has a melting point of 70° C.

(25) The sealant layer may contain more than one unsaturated primary fatty acid amide. In an embodiment, the sealant layer includes at least two unsaturated primary fatty acid amides, wherein each unsaturated primary fatty acid amide differs from one another compositionally, structurally, and/or physically.

(26) In an embodiment, the sealant layer contains from 0.0016 wt % (16 parts per million (ppm)), or 0.0075 wt % (75 ppm), or 0.04 wt % (400 ppm), or 0.06 wt % (600 ppm) to 0.12 wt % (1200 ppm), or 0.18 wt % (1800 ppm), or 0.83 wt % (8300 ppm), or 1.0 wt % (10000 ppm), or 2.0 wt % (20000 ppm), or 3.0 wt % (30000 ppm), or 3.83 wt % (38300 ppm) unsaturated primary fatty acid amide, based on the total weight of the sealant layer.

(27) The unsaturated primary fatty acid amide may comprise two or more embodiments disclosed herein.

(28) C. Saturated Primary Fatty Acid Amide

(29) The sealant layer contains a saturated primary fatty acid amide having a melting point greater than 100° C. A “saturated primary fatty acid amide” is a molecule having the Structure (IV):

(30) ##STR00004##
wherein R.sup.1 is a C.sub.3 to C.sub.27 alkyl moiety that is saturated. In an embodiment, R.sup.1 is a C.sub.11 to C.sub.25, or a C.sub.15 to C.sub.23 alkyl moiety, or a C.sub.15 to C.sub.21 alkyl moiety that is saturated. A “saturated” alky moiety is an alkyl in which all carbon atoms are linked to one another via single bonds (C—C bonds). In other words, a saturated alkyl moiety excludes carbon atoms linked via double bonds (C═C bonds). In an embodiment, R.sup.1 is selected from a C.sub.17 alkyl moiety and a C.sub.21 alkyl moiety that is saturated. Nonlimiting examples of suitable saturated primary fatty acid amides include behenamide, palmitamide, stearamide, and combinations thereof.

(31) In an embodiment, in the saturated primary fatty acid amide of the Structure (IV), R.sup.1 is a C.sub.21 alkyl moiety that is saturated. In a further embodiment, the saturated primary fatty acid amide is behenamide. Behenamide has the following Structure (V):

(32) ##STR00005##

(33) In an embodiment, in the saturated primary fatty acid amide of the Structure (IV), R.sup.1 is a C.sub.15 alkyl moiety that is saturated. In a further embodiment, the saturated primary fatty acid amide is palmitamide.

(34) In an embodiment, in the saturated primary fatty acid amide of the Structure (IV), R.sup.1 is a C.sub.17 alkyl moiety that is saturated. In a further embodiment, the saturated primary fatty acid amide is stearamide.

(35) The saturated primary fatty acid amide has a melting point greater than 100° C. In an embodiment, the saturated primary fatty acid amide has a melting point from greater than 100° C. to 150° C., or from 101° C., or 102° C., or 103° C., or 104° C., or 105° C., or 106° C. to 113° C., or 115° C., or 120° C., or 125° C., or 130° C., or 135° C., or 140° C., or 145° C., or 150° C. In an embodiment, the saturated primary fatty acid amide is behenamide, which has a melting point of 108° C.-113° C. In another embodiment, the saturated primary fatty acid amide is palmitamide, which has a melting point of 106° C.-107° C. In another embodiment, the saturated primary fatty acid amide is stearamide, which has a melting point of 109° C.

(36) The sealant layer may contain more than one saturated primary fatty acid amide. In an embodiment, the sealant layer includes at least two saturated primary fatty acid amides, wherein each saturated primary fatty acid amide differs from one another compositionally, structurally, and/or physically.

(37) In an embodiment, the sealant layer contains from 0.0025 wt % (25 ppm), or 0.0083 wt % (83 ppm), or 0.01 wt % (100 ppm), or 0.06 wt % (600 ppm) to 0.12 wt % (1200 ppm), or 0.18 wt % (1800 ppm), or 1.0 wt % (10000 ppm), or 1.25 wt % (12500 ppm), or 2.0 wt % (20000 ppm), or 3.0 wt % (30000 ppm), or 4.0 wt % (40000 ppm), or 4.1 wt % (41000 ppm) saturated primary fatty acid amide, based on the total weight of the sealant layer.

(38) The saturated primary fatty acid amide may comprise two or more embodiments disclosed herein.

(39) D. Optional Diprotic Fatty Acid

(40) In an embodiment, the sealant layer includes a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. A “diprotic fatty acid” is a fatty acid having two ionizable hydrogen atoms per molecule. A nonlimiting example of a suitable diprotic fatty acid is a dicarboxyl fatty acid. In an embodiment, the diprotic fatty acid is a dicarboxyl fatty acid. Nonlimiting examples of suitable dicarboxyl fatty acids include succinic acid, hexanedioic acid, octanedioic acid, decanedioic acid, and dodecanedioic acid.

(41) The diprotic fatty acid has a melting point greater than 100° C. In an embodiment, the diprotic fatty acid has a melting point from greater than 100° C. to 250° C., or from 101° C., or 105° C., or 110° C., or 120° C., or 130° C., or 140° C., or 150° C., or 160° C., or 170° C., or 180° C. to 185° C., or 190° C., or 200° C., or 210° C., or 220° C., or 230° C., or 240° C., or 250° C.

(42) The diprotic fatty acid has a decomposition temperature greater than 200° C. In an embodiment, the diprotic fatty acid has a decomposition temperature from greater than 200° C. to 500° C., or from 201° C., or 210° C., or 220° C., or 225° C., or 230° C., or 235° C. to 240° C., or 245° C., or 250° C., or 270° C., or 300° C., or 310° C., or 320° C., or 330° C., or 350° C., or 380° C., or 400° C., or 450° C., or 500° C.

(43) In an embodiment, the diprotic fatty acid is succinic acid, which has a melting point of 184° C. and a decomposition temperature of 235° C. Succinic acid has the following Structure (VI):

(44) ##STR00006##

(45) In an embodiment, the sealant layer contains from 0.0025 wt % (25 ppm), or 0.0050 wt % (50 ppm), or 0.01 wt % (100 ppm), or 0.02 wt % (200 ppm) to 0.06 wt % (600 ppm), or 0.12 wt % (1200 ppm), or 0.18 wt % (1800 ppm), or 1.0 wt % (10000 ppm), or 2.0 wt % (20000 ppm), or 3.0 wt % (30000 ppm), or 4.0 wt % (40000 ppm) diprotic fatty acid, based on the total weight of the sealant layer.

(46) The diprotic fatty acid may comprise two or more embodiments disclosed herein.

(47) E. Optional Additive(s)

(48) In an embodiment, the sealant layer includes one or more optional additives. Nonlimiting examples of suitable additives include antiblock agents, antioxidants, antistatic agents, stabilizing agents, nucleating agents, colorants, pigments, ultra violet (UV) absorbers or stabilizers, flame retardants, compatibilizers, plasticizers, fillers, processing aids, antifog additive, crosslinking agents (e.g., peroxides), and combinations thereof.

(49) In an embodiment, the sealant layer includes an antiblock agent. An “antiblock agent” is a compound that minimizes, or prevents, blocking (i.e., adhesion) between two adjacent layers of film by creating a microscopic roughening of the film layer surface, which reduces the available contact area between adjacent layers. The antiblock agent may be organic or inorganic. Nonlimiting examples of suitable antiblock agents include silica, talc, calcium carbonate, and combinations thereof. In an embodiment, the antiblock agent is silica (SiO.sub.2). The silica may be organic silica or synthetic silica. In an embodiment, the antiblock agent is synthetic silica. In an embodiment, the sealant layer contains from 0 wt %, or 0.10 wt % (1000 ppm), or 0.20 wt % (2000 ppm), or 0.25 wt % (2500 ppm) to 0.3 wt % (3000 ppm), or 0.4 wt % (4000 ppm), or 0.5 wt % (5000 ppm), or 1.0 wt % (10000 ppm), or 1.5 wt % (15000 ppm), or 2.0 wt % (20000 ppm) antiblock agent, based on the total weight of the sealant layer.

(50) In an embodiment, the sealant layer contains from 0 wt %, or 0.01 wt %, or 0.05 wt %, or 0.1 wt %, or 0.2 wt % to 0.3 wt %, or 0.4 wt %, or 0.5 wt %, or 1.0 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt %, or 5.0 wt % additive, based on the total weight of the sealant layer.

(51) The additive may comprise two or more embodiments disclosed herein.

(52) In an embodiment, the sealant layer contains from 0.01 wt %, or 0.10 wt %, or 0.20 wt % to 0.24 wt %, or 0.25 wt %, or 0.30 wt %, or 0.35 wt %, or 0.40 wt %, or 0.45 wt %, or 0.50 wt %, or 0.80 wt %, or 1.0 wt %, or 1.5 wt %, or 2.0 wt %, or 2.5 wt %, or 3.0 wt %, or 3.5 wt %, or 4.0 wt %, or 4.5 wt %, or 5 wt % of a combined amount of the unsaturated primary fatty acid amide and the saturated primary fatty acid amide, based on the total weight of the sealant layer.

(53) The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. In an embodiment, the unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1, or 1:1 to 1:3, or 1:5, or 1:6.

(54) In an embodiment, the sealant layer has a pre-lamination COF from 0.01, or 0.05, or 0.10 to 0.17, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.39, or less than 0.40.

(55) In an embodiment, the sealant layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 90 μm, or 100 μm, or 120 μm, or 150 μm.

(56) The sealant layer may comprise two or more embodiments disclosed herein.

(57) 2. Second Layer

(58) The multilayer film includes a second layer. The second layer contains a second ethylene-based polymer.

(59) The second layer has two opposing surfaces. In an embodiment, the second layer is a continuous layer with two opposing surfaces.

(60) The second layer is in contact with the sealant layer. The second layer may be in direct contact or in indirect contact with the sealant layer. In an embodiment, the second layer directly contacts the sealant layer. The term “directly contacts,” as used herein, is a layer configuration whereby the second layer is located immediately adjacent to the sealant layer and no intervening layers, or no intervening structures, are present between the sealant layer and the second layer.

(61) In another embodiment, the second layer indirectly contacts the sealant layer. The term “indirectly contacts,” as used herein, is a layer configuration whereby an intervening layer, or an intervening structure, is present between the sealant layer and the second layer.

(62) The second ethylene-based polymer may be any ethylene-based polymer disclosed herein. The second ethylene-based polymer may be the same or different than the ethylene-based polymer of the sealant layer. In an embodiment, the second ethylene-based polymer is the same as the ethylene-based polymer of the sealant layer. In another embodiment, the second ethylene-based polymer is different than the ethylene-based polymer of the sealant layer.

(63) In an embodiment, the second ethylene-based polymer is a LLDPE, a LDPE, or a combination thereof. In a further embodiment, the LLDPE is an ethylene/1-octene copolymer. In an embodiment, the second layer contains from 5 wt %, or 10 wt %, or 20 wt %, or 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt % to 90 wt %, or 95 wt %, or 99 wt % LLDPE; and a reciprocal amount of LDPE, or from 1 wt %, or 5 wt %, or 10 wt %, or 20 wt % to 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt %, or 90 wt %, or 95 wt % LDPE, based on the total weight of the second layer.

(64) In an embodiment, the second layer contains one or more optional additives. The additive may be any additive disclosed herein. In an embodiment, the second layer contains from 0 wt %, or 0.01 wt % to 0.5 wt %, or 1.0 wt %, or 3.0 wt %, or 5.0 wt % additive, based on the total weight of the second layer.

(65) In an embodiment, the second layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 100 μm, or 120 μm, or 150 μm.

(66) The second layer may be a substrate layer or a core layer. In an embodiment, the second layer is a core layer. A “core layer” is a layer of a film structure that is an inner layer. In other words, neither surface of a core layer is an outermost surface of the film. In an embodiment, the second layer is a substrate layer. A “substrate layer” is a layer of a film structure that may be an inner layer or a skin layer. A “skin layer” is an outermost layer of a film structure. In other words, at least one surface of a skin layer is an outermost surface of the film.

(67) The second layer may comprise two or more embodiments disclosed herein.

(68) 3. Optional Third Layer

(69) In an embodiment, the multilayer film includes an optional third layer. The third layer contains a third ethylene-based polymer.

(70) The third layer has two opposing surfaces. In an embodiment, the third layer is a continuous layer with two opposing surfaces. The third layer is in contact with the second layer. The third layer may be in direct contact or in indirect contact with the second layer. In an embodiment, the third layer directly contacts the second layer. In another embodiment, the third layer indirectly contacts the second layer.

(71) The third ethylene-based polymer may be any ethylene-based polymer disclosed herein. The third ethylene-based polymer may be the same or different than the first ethylene-based polymer of the sealant layer, and the third ethylene-based polymer may be the same or different than the second ethylene-based polymer of the second layer. In an embodiment, the third ethylene-based polymer is the same as the second ethylene-based polymer of the second layer. In another embodiment, the third ethylene-based polymer is different than the second ethylene-based polymer of the second layer.

(72) In an embodiment, the third ethylene-based polymer is a LLDPE, a LDPE, or a combination thereof. In an embodiment, the third layer contains from 5 wt %, or 10 wt %, or 20 wt %, or 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt % to 90 wt %, or 99 wt % LLDPE; and a reciprocal amount of LDPE, or from 1 wt %, or 5 wt %, or 10 wt %, or 20 wt % to 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt %, or 90 wt %, or 95 wt % LDPE, based on the total weight of the third layer.

(73) In an embodiment, the third layer contains one or more optional additives. The additive may be any additive disclosed herein. In an embodiment, the third layer contains from 0 wt %, or 0.01 wt % to 0.5 wt %, or 1.0 wt %, or 3.0 wt %, or 5.0 wt % additive, based on the total weight of the third layer.

(74) In an embodiment, the third layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 100 μm, or 120 μm, or 150 μm.

(75) The third layer may be a substrate layer or a core layer. In another embodiment, the third layer is a substrate layer.

(76) The third layer may comprise two or more embodiments disclosed herein.

(77) In an embodiment, the multilayer film has the following Structure (VII):
sealant layer/second layer  Structure (VII).

(78) In an embodiment, the sealant layer and the third layer are skin layers on opposing sides of the second layer, which is a core layer. In a further embodiment, the sealant layer is in direct contact with the second layer, and the second layer is in direct contact with the third layer. In an embodiment, the multilayer film has the following Structure (VIII):
sealant layer/second layer/third layer  Structure (VIII).

(79) In an embodiment, the multilayer film consists essentially of, or consists of, the sealant layer and the second layer. In another embodiment, the multilayer film consists essentially of, or consists of, the sealant layer, the second layer, and the third layer.

(80) In an embodiment, the multilayer film has a thickness from 15 μm, or 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm to 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 95 μm, or 100 μm, or 150 μm, or 200 μm, or 250 μm, or 300 rm.

(81) In an embodiment, the multilayer film contains, consists essentially of, or consists of:

(82) (1) a sealant layer containing, consisting essentially of, or consisting of:

(83) (A) from 75 wt %, or 80 wt %, or 85 wt %, or 90 wt % to 93 wt %, or 94 wt %, or 95 wt %, or 98 wt %, or 99 wt %, or 99.5 wt %, or 99.99 wt % of the first ethylene-based polymer (such as LLDPE and/or LDPE), based on the total weight of the sealant layer, the first ethylene-based polymer having (i) a density from 0.865 g/cc to 0.930 g/cc, or from 0.900 g/cc, or 0.910 g/cc, or 0.915 g/cc to 0.920 g/cc, or 0.925 g/cc, or 0.930 g/cc; and (ii) a melt index from 0.5 g/10 min to 25 g/10 min, or from 0.5 g/10 min, or 1.0 g/10 min to 1.5 g/10 min, or 2.0 g/10 min, or 3.0 g/10 min, or 5.0 g/10 min, or 8.0 g/10 min;

(84) (B) from 0.0016 wt %, or 0.0075 wt %, or 0.04 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 0.83 wt %, or 1.0 wt %, or 2.0 wt %, or 3.0 wt %, or 3.83 wt % unsaturated primary fatty acid amide (such as erucamide and/or oleamide), based on the total weight of the sealant layer, the unsaturated primary fatty acid amide having a melting point from 65° C., or 70° C., or 75° C. to 80° C., or 85° C., or 90° C.;

(85) (C) from 0.0025 wt %, or 0.0083 wt %, or 0.01 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 1.0 wt %, or 1.25 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt %, or 4.1 wt % saturated primary fatty acid amide (such as behenamide), based on the total weight of the sealant layer, the saturated primary fatty acid amide having a melting point from 101° C., or 103° C., or 106° C. to 113° C., or 115° C., or 120° C.;

(86) (D) optionally, from 0.0025 wt %, or 0.0050 wt %, or 0.01 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 1.0 wt %, or 1.25 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt % diprotic fatty acid (such as succinic acid), based on the total weight of the sealant layer, the diprotic fatty acid having (i) a melting point greater from 110° C., or 130° C., or 150° C., or 170° C., or 180° C. to 185° C., or 190° C., or 200° C., or 210° C., or 220° C., or 230° C.; and (ii) a decomposition temperature from 220° C., or 225° C., or 230° C., or 235° C. to 240° C., or 245° C., or 250° C., or 270° C., or 300° C., or 310° C., or 320° C., or 330° C.;

(87) (E) optionally, from 0 wt %, or 0.01 wt %, or 0.05 wt %, or 0.1 wt %, or 0.2 wt % to 0.3 wt %, or 0.4 wt %, or 0.5 wt %, or 1.0 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt %, or 5.0 wt % additive (such as an antiblock agent), based on the total weight of the sealant layer; and the unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1, or 1:1 to 1:3, or 1:5, or 1:6; and

(88) (2) a second layer in contact with the sealant layer, the second layer containing a second ethylene-based polymer (such as LLDPE, LDPE, or a combination thereof); and

(89) (3) optionally, a third layer in contact with the second layer, the third layer containing a third ethylene-based polymer (such as LLDPE, LDPE, or a combination thereof); and the multilayer film has one, some, or all of the following properties: (i) the sealant layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 50 μm, or 60 μm, or 70 μm, or 80 μm, or 90 μm; and/or (ii) the sealant layer contains from 0.01 wt %, or 0.10 wt %, or 0.20 wt % to 0.24 wt %, or 0.25 wt %, or 0.30 wt %, or 0.35 wt %, or 0.40 wt %, or 0.45 wt %, or 0.50 wt %, or 0.80 wt %, or 1.0 wt %, or 1.5 wt %, or 2.0 wt %, or 2.5 wt %, or 3.0 wt %, or 3.5 wt %, or 4.0 wt %, or 4.5 wt %, or 5 wt % of a combined amount of the unsaturated primary fatty acid amide and the saturated primary fatty acid amide, based on the total weight of the sealant layer; and/or (iii) the sealant layer has a pre-lamination COF from 0.01, or 0.05, or 0.10 to 0.17, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.39, or less than 0.40; and/or (iv) the second layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 50 μm, or 60 μm, or 70 μm, or 80 μm, or 90 μm; and/or (v) the third layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 50 μm, or 60 μm, or 70 μm, or 80 μm, or 90 μm; and/or (vi) the multilayer film has a thickness of from 20 μm, or 30 μm, or 40 μm, or 50 μm to 55 μm, or 60 μm, or 70 μm, or 80 μm, or 90 μm, or 100 μm, or 150 μm, or 200 μm, or 250 μm.

(90) It is understood that the sum of the components in each of the layers disclosed herein, including the foregoing layers, yields 100 weight percent (wt %), based on the total weight of each respective layer.

(91) In an embodiment, the coextruded multilayer film excludes non-migratory slip agents, such as silicone.

(92) Some methods, for example, used to construct films are by cast coextrusion or blown coextrusion methods. Combinations of these methods are also possible. In an embodiment, the multilayer film is a coextruded blown film.

(93) The coextruded multilayer film may or may not be oriented. In an embodiment, the coextruded multilayer film is not an oriented film. In a further embodiment, the coextruded multilayer film is not biaxially oriented. In other words, the coextruded multilayer film is not stretched after extrusion. In another embodiment, the coextruded multilayer film is oriented (e.g., biaxially oriented).

(94) In an embodiment, the coextruded multilayer film is included in a laminate. In such embodiments, an outermost surface of the sealant layer is an outermost surface of the laminate.

(95) The coextruded multilayer film may comprise two or more embodiments disclosed herein.

(96) Laminate

(97) The present disclosure provides a laminate. The laminate includes a first film containing a sealant layer and a second film, wherein the first film is laminated to the second film. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6.

(98) The laminate contains at least two films, or more than two films. For example, the laminate can have two, three, four, five, six, seven, eight, nine, ten, eleven, or more films. In an embodiment, the laminate contains only two films, or only three films.

(99) In an embodiment, the laminate has the following Structure (IX):
first film/second film  Structure (IX).

(100) In an embodiment, the laminate includes a first film, an adhesive layer in contact with the first film, and a second film in contact with the adhesive layer. In an embodiment, the laminate has the following Structure (X):
first film/adhesive layer/second film  Structure (X)

(101) In an embodiment, the first film is a monolayer film containing a sealant layer and the second film is a monolayer film containing a substrate layer, and the laminate has the following Structure (XI):
sealant layer/adhesive layer/substrate layer  Structure (XI).

(102) In an embodiment, the laminate includes an optional third film laminated to the second film. In a further embodiment, the laminate includes an optional second adhesive layer in contact with the second film, and an optional third film in contact with the second adhesive layer. In an embodiment, the laminate has the following Structure (XII):
first film/adhesive layer/second film/second adhesive layer/third film  Structure (XII).
1. First Film

(103) The laminate includes a first film. The first film includes a sealant layer.

(104) The first film has two opposing surfaces. The first film may be a monolayer film or a multilayer film. In an embodiment, the first film is a multilayer film containing at least two layers, or more than two layers. For example, the first film can have two, three, four, five, six, seven, eight, nine, ten, or more layers. In an embodiment, the first film contains only one layer, or only three layers.

(105) In an embodiment, the first film is a multilayer film including an optional core layer in contact with the sealant layer and an optional third substrate layer in contact with the core layer. In an embodiment, the outermost surface of the third substrate is laminated to an outermost surface of the second film.

(106) A. Sealant Layer

(107) The first film contains a sealant layer. The sealant layer may be any sealant layer disclosed herein. In an embodiment, the sealant layer is a skin layer. In other words, an outermost surface of the sealant layer is an outermost surface of the first film, and further an outermost surface of the laminate.

(108) B. Optional Core Layer and Optional Third Substrate Layer

(109) In an embodiment, the first film is a multilayer film that includes a core layer and a third substrate layer.

(110) The core layer has two opposing surfaces. In an embodiment, the core layer is a continuous layer with two opposing surfaces. The core layer is in contact with the sealant layer. The core layer may be in direct contact or in indirect contact with the sealant layer. In an embodiment, the core layer directly contacts the sealant layer. In another embodiment, the core layer indirectly contacts the sealant layer.

(111) In an embodiment, the core layer contains a third ethylene-based polymer. The third ethylene-based polymer may be any ethylene-based polymer disclosed herein. The third ethylene-based polymer may be the same or different than the ethylene-based polymer of the sealant layer. In an embodiment, the third ethylene-based polymer is a LLDPE, a LDPE, or a combination thereof. In an embodiment, the core layer contains from 5 wt %, or 10 wt %, or 20 wt %, or 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt % to 90 wt %, or 95 wt %, or 99 wt % LLDPE; and a reciprocal amount of LDPE, or from 1 wt %, or 5 wt %, or 10 wt %, or 20 wt % to 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt %, or 90 wt %, or 95 wt % LDPE, based on the total weight of the core layer.

(112) In an embodiment, the core layer contains one or more optional additives. The additive may be any additive disclosed herein. In an embodiment, the core layer contains from 0 wt %, or 0.01 wt % to 0.5 wt %, or 1.0 wt %, or 3.0 wt %, or 5.0 wt % additive, based on the total weight of the core layer. In an embodiment, the core layer contains an additive that is a slip agent selected from an unsaturated primary fatty acid amide having a melting point of 100° C. or less; a saturated primary fatty acid amide having a melting point greater than 100° C.; a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C.; and combinations thereof.

(113) In an embodiment, the core layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 100 μm, or 120 μm, or 150 μm.

(114) The third substrate layer has two opposing surfaces. In an embodiment, the third substrate layer is a continuous layer with two opposing surfaces. The third substrate layer is in contact with the core layer and the second film. The third substrate layer may be in direct contact or in indirect contact with the core layer. In an embodiment, the third substrate layer directly contacts the core layer. In another embodiment, the third substrate layer indirectly contacts the core layer. The third substrate layer may be in direct contact or in indirect contact with the second film. In an embodiment, the third substrate layer directly contacts the second film. In another embodiment, the third substrate layer indirectly contacts the second film.

(115) In an embodiment, the third substrate layer contains a fourth ethylene-based polymer. The fourth ethylene-based polymer may be any ethylene-based polymer disclosed herein. The fourth ethylene-based polymer may be the same or different than the ethylene-based polymer of the sealant layer, and the fourth ethylene-based polymer may be the same or different than the third ethylene-based polymer of the core layer. In an embodiment, the fourth ethylene-based polymer is a LLDPE, a LDPE, or a combination thereof. In an embodiment, the third substrate layer contains from 5 wt %, or 10 wt %, or 20 wt %, or 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt % to 90 wt %, or 95 wt %, or 99 wt % LLDPE; and a reciprocal amount of LDPE, or from 1 wt %, or 5 wt %, or 10 wt %, or 20 wt % to 30 wt %, or 40 wt %, or 50 wt %, or 60 wt %, or 70 wt %, or 80 wt %, or 90 wt %, or 95 wt % LDPE, based on the total weight of the third substrate layer.

(116) In an embodiment, the third substrate layer contains one or more optional additives. The additive may be any additive disclosed herein. In an embodiment, the core layer contains from 0 wt %, or 0.01 wt % to 0.5 wt %, or 1.0 wt %, or 3.0 wt %, or 5.0 wt % additive, based on the total weight of the third substrate layer.

(117) In an embodiment, the third substrate layer has a thickness from 5 μm, or 8 μm, or 10 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 100 μm, or 120 μm, or 150 μm.

(118) In an embodiment, the third substrate layer is corona treated.

(119) The core layer and the third substrate layer may comprise two or more embodiments disclosed herein.

(120) The first film may comprise two or more embodiments disclosed herein.

(121) 2. Second Film

(122) The laminate includes a second film. The first film is laminated to the second film.

(123) The second film has two opposing surfaces. The second film may be a monolayer film or a multilayer film. In an embodiment, the second film is a monolayer film. In another embodiment, the second film is a multilayer film containing at least two layers, or more than two layers. In an embodiment, the second film contains only one layer, or only two layers, or only three layers.

(124) In an embodiment, the second film includes a substrate layer. The substrate layer has two opposing surfaces. In an embodiment, the substrate layer is a continuous layer with two opposing surfaces.

(125) The substrate layer is in contact with the first film. The substrate layer may be in direct contact or in indirect contact with the first film. In an embodiment, the substrate layer directly contacts the first film. In another embodiment, the substrate layer indirectly contacts the first film.

(126) In an embodiment, the substrate layer is in contact with an optional adhesive layer. The substrate layer may be in direct contact or in indirect contact with the adhesive layer. In an embodiment, the substrate layer directly contacts the adhesive layer. In another embodiment, the substrate layer indirectly contacts the adhesive layer.

(127) In an embodiment, the substrate layer contains a component selected from a second ethylene-based polymer, propylene-based polymer, polyamide (such as nylon), polyester, ethylene vinyl alcohol copolymer, polyethylene terephthalate (PET), ethylene vinyl acrylate copolymer, ethylene methyl acrylate copolymer, ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene acrylic acid copolymer, ethylene methacrylic acid copolymer, an ionomer of ethylene acrylic acid, an ionomer of methacylic acid, maleic anhydride grafted ethylene-based polymer, a polystyrene, a metal foil, and combinations thereof. In an embodiment, the substrate layer contains PET. In another embodiment, the substrate layer contains a second ethylene-based polymer. The second ethylene-based polymer may be any ethylene-based polymer disclosed herein. The second ethylene-based polymer may be the same or different than the ethylene-based polymer of the sealant layer.

(128) In an embodiment, the second film, or further the substrate layer, has a thickness from 5 μm, or 8 μm, or 10 μm, or 12 μm, or 15 μm to 20 μm, or 25 μm, or 30 μm, or 35 μm, or 40 μm, or 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 100 μm, or 150 μm.

(129) The substrate layer may comprise two or more embodiments disclosed herein.

(130) The second film may comprise two or more embodiments disclosed herein.

(131) 3. Optional Adhesive Layer

(132) In an embodiment, the laminate includes an adhesive layer. The adhesive layer is in contact with the first film and the second film.

(133) The adhesive layer has two opposing surfaces. In an embodiment, the adhesive layer is a continuous layer with two opposing surfaces. The adhesive layer is in contact with the first film. The adhesive layer may be in direct contact or in indirect contact with the first film. In an embodiment, the adhesive layer directly contacts the first film. In another embodiment, the adhesive layer indirectly contacts the first film.

(134) The adhesive layer contains an adhesive. Nonlimiting examples of suitable adhesives include polyurethane adhesives (e.g., MOR-FREE™ 706A/C-79, available from Rohm and Haas), polyacrylate adhesives (e.g., ROBOND™ L-168/CR3A, available from The Dow Chemical Company), and combinations thereof.

(135) In an embodiment, the adhesive layer has a dry coating weight of from 0.5 grams per square meter (g/m.sup.2), or 1.0 g/m.sup.2, or 1.5 g/m.sup.2, or 1.8 g/m.sup.2 to 1.9 g/m.sup.2, or 2.0 g/m.sup.2, or 2.5 g/m.sup.2, or 3.0 g/m.sup.2.

(136) The adhesive layer may comprise two or more embodiments disclosed herein.

(137) 4. Optional Third Film

(138) In an embodiment, the laminate includes a third film. The third film is laminated to the second film.

(139) The third film has two opposing surfaces. The third film may be a monolayer film or a multilayer film. In an embodiment, the third film is a monolayer film. In another embodiment, the third film is a multilayer film containing at least two layers, or more than two layers. In an embodiment, the third film contains only one layer, or only two layers, or only three layers.

(140) In an embodiment, the third film includes a second substrate layer. The second substrate layer may be any substrate layer disclosed herein.

(141) The second substrate layer is in contact with the second film. The second substrate layer may be in direct contact or in indirect contact with the second film. In an embodiment, the second substrate layer directly contacts the second film. In another embodiment, the second substrate layer indirectly contacts the second film.

(142) The second substrate layer may comprise two or more embodiments disclosed herein.

(143) The third film may comprise two or more embodiments disclosed herein

(144) 5. Optional Second Adhesive Layer

(145) In an embodiment, the laminate includes a second adhesive layer. The second adhesive layer is in contact with the second film. The second adhesive layer may be any adhesive layer disclosed herein.

(146) The second adhesive layer is in contact with the second film. The second adhesive layer may be in direct contact or in indirect contact with the second film. In an embodiment, the second adhesive layer directly contacts the second film. In another embodiment, the second adhesive layer indirectly contacts the second film. In an embodiment, the second adhesive layer is in contact with the optional third film. The second adhesive layer may be in direct contact or in indirect contact with the third film. In an embodiment, the second adhesive layer directly contacts the third film. In another embodiment, the second adhesive layer indirectly contacts the third film.

(147) The second adhesive layer may comprise two or more embodiments disclosed herein

(148) In an embodiment, the first film is a multilayer film with a sealant layer, a core layer, and a third substrate layer; and the second film is a monolayer film containing a substrate layer; and the laminate has the following Structure (XIII):
sealant layer/core layer/third substrate layer/adhesive layer/substrate layer  Structure (XIII).

(149) In an embodiment, the first film is a multilayer film with a sealant layer, a core layer, and a third substrate layer; and the second film is a monolayer film containing a substrate layer; the third film is a monolayer film containing a second substrate layer; and the laminate has the following Structure (XIV):
sealant layer/core layer/third substrate layer/adhesive layer/substrate layer/second adhesive layer/second substrate layer  Structure (XIV).

(150) In an embodiment, the sealant layer of the laminate has a Pre-Lamination COF from 0.01, or 0.05, or 0.10 to 0.17, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.39, or less than 0.40.

(151) In an embodiment, the sealant layer of the laminate has a COF of from 0.01, or 0.05, or 0.10 to 0.18, or 0.20, or 0.25, or 0.27, or 0.30, or 0.34, or 0.36, or 0.39, or less than 0.40 after curing at 40° C. for 48 hours (the “Laminate 40° C. Cure COF”). In an embodiment, the sealant layer of the laminate has a change in COF after 40° C. cure of less than 0.22, or less than 0.15, or less than 0.10. In another embodiment, the sealant layer of the laminate has a change in COF after 40° C. cure from −0.20, or −0.10, or −0.05, or 0 to 0.01, or 0.05, or 0.10, or 0.15, or 0.20, or 0.21. The change in COF after 40° C. cure is calculated in accordance with the following equation: COF Change after 40° C. Cure=Laminate 40° C. Cure COF−Pre-Lamination COF.

(152) In an embodiment, the sealant layer of the laminate has a COF from 0.01, or 0.05, or 0.10 to 0.15, or 0.17, or 0.19, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.36, or 0.38, or 0.39, or less than 0.40 after curing at 55° C. for 48 hours (the “Laminate 55° C. Cure COF”). High temperature cure (55° C. cure) is advantageous during the laminate production process because it allows for faster processing times. In an embodiment, the sealant layer of the laminate has a change in COF after 55° C. cure of less than 24, or less than 0.22, or less than 0.15, or less than 0.05. In another embodiment, the sealant layer of the laminate has a change in COF after 55° C. cure from −0.20, or −0.10, or −0.06, or 0 to 0.01, or 0.03, or 0.05, or 0.10, or 0.20, or 0.23. The change in COF after 55° C. cure is calculated in accordance with the following equation: COF Change after 55° C. Cure=Laminate 55° C. Cure COF−Pre-Lamination COF.

(153) In an embodiment, the laminate contains, consists essentially of, or consists of:

(154) (1) a first film containing

(155) (A) a sealant layer containing, consisting essentially of, or consisting of: (i) from 70 wt %, or 75 wt %, or 80 wt %, or 85 wt %, or 90 wt % to 93 wt %, or 94 wt %, or 95 wt %, or 98 wt %, or 99 wt %, or 99.5 wt %, or 99.99 wt % ethylene-based polymer (such as LLDPE and/or LDPE), based on the total weight of the sealant layer, the ethylene-based polymer having (a) a density from 0.865 g/cc to 0.930 g/cc, or from 0.900 g/cc, or 0.910 g/cc, or 0.915 g/cc to 0.920 g/cc, or 0.925 g/cc, or 0.930 g/cc; and (b) a melt index from 0.5 g/10 min to 25 g/10 min, or from 0.5 g/10 min, or 1.0 g/10 min to 1.5 g/10 min, or 2.0 g/10 min, or 3.0 g/10 min, or 4.0 g/10 min, or 5.0 g/10 min, or 8.0 g/10 min; (ii) from 0.0016 wt %, or 0.0075 wt %, or 0.04 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 0.83 wt %, or 1.0 wt %, or 2.0 wt %, or 3.0 wt %, or 3.83 wt % unsaturated primary fatty acid amide (such as erucamide and/or oleamide), based on the total weight of the sealant layer, the unsaturated primary fatty acid amide having a melting point from 65° C., or 70° C., or 75° C. to 80° C., or 85° C., or 90° C.; (iii) from 0.0025 wt %, or 0.0083 wt %, or 0.01 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 1.0 wt %, or 1.25 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt %, or 4.1 wt % saturated primary fatty acid amide (such as behenamide), based on the total weight of the sealant layer, the saturated primary fatty acid amide having a melting point from 101° C., or 103° C., or 106° C. to 113° C., or 115° C., or 120° C., or 125° C., or 130° C., or 135° C., or 140° C.; (iv) optionally, from 0.0025 wt %, or 0.0050 wt %, or 0.01 wt %, or 0.06 wt % to 0.12 wt %, or 0.18 wt %, or 1.0 wt %, or 1.25 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt % diprotic fatty acid (such as succinic acid), based on the total weight of the sealant layer, the diprotic fatty acid having (a) a melting point from 101° C., 110° C., or 130° C., or 150° C., or 170° C., or 180° C. to 185° C., or 190° C., or 200° C., or 210° C., or 220° C., or 230° C., or 240° C.; and (b) a decomposition temperature from 220° C., or 225° C., or 230° C., or 235° C. to 240° C., or 245° C., or 250° C., or 270° C., or 300° C., or 310° C., or 320° C., or 330° C., or 340° C., or 350° C.; (v) optionally, from 0 wt %, or 0.01 wt %, or 0.05 wt %, or 0.1 wt %, or 0.2 wt % to 0.3 wt %, or 0.4 wt %, or 0.5 wt %, or 1.0 wt %, or 2.0 wt %, or 3.0 wt %, or 4.0 wt %, or 5.0 wt % additive (such as an antiblock agent), based on the total weight of the sealant layer; the unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1, or 1:1 to 1:3, or 1:5, or 1:6; and

(156) (B) optionally, a core layer in contact with the sealant layer, the core layer containing a third ethylene-based polymer (such as LLDPE and/or LDPE);

(157) (C) optionally, a third substrate layer in contact with the core layer, the third substrate layer containing a fourth ethylene-based polymer (such as LLDPE and/or LDPE);

(158) (2) optionally, an adhesive layer in contact with the first film;

(159) (3) a second film containing a substrate layer in contact with the adhesive layer, the substrate layer containing a component selected from a second ethylene-based polymer, a propylene-based polymer, a polyamide (such as nylon), a polyester, PET, a metal foil, and combinations thereof; wherein the first film is laminated to the second film; and the laminate has one, some, or all of the following properties; and the laminate has one, some, or all of the following properties: (i) the sealant layer contains from 0.01 wt %, or 0.10 wt %, or 0.20 wt % to 0.24 wt %, or 0.25 wt %, or 0.30 wt %, or 0.35 wt %, or 0.40 wt %, or 0.45 wt %, or 0.50 wt %, or 0.80 wt %, or 1.0 wt %, or 1.5 wt %, or 2.0 wt %, or 2.5 wt %, or 3.0 wt %, or 3.5 wt %, or 4.0 wt %, or 4.5 wt %, or 5 wt % of a combined amount of the unsaturated primary fatty acid amide and the saturated primary fatty acid amide, based on the total weight of the sealant layer; and/or (ii) the sealant layer has a pre-lamination COF from 0.01, or 0.05, or 0.10 to 0.17, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.39, or less than 0.40; and/or (iii) the sealant layer has a Laminate 40° C. Cure COF of from 0.01, or 0.05, or 0.10 to 0.18, or 0.20, or 0.25, or 0.27, or 0.30, or 0.34, or 0.36, or 0.39, or less than 0.40; and/or (iv) the sealant layer of the laminate has a change in COF after 40° C. cure of from −0.20, or −0.10, or −0.05, or 0 to 0.01, or 0.05, or 0.10, or 0.15, or 0.20, or 0.21; and/or (v) the sealant layer has a Laminate 55° C. Cure COF of from 0.01, or 0.05, or 0.10 to 0.15, or 0.17, or 0.19, or 0.20, or 0.25, or 0.27, or 0.30, or 0.35, or 0.36, or 0.38, or 0.39, or less than 0.40; and/or (vi) the sealant layer of the laminate has a change in COF after 55° C. cure of from −0.20, or −0.10, or −0.06, or 0 to 0.01, or 0.03, or 0.05, or 0.10, or 0.15, or 0.20, or 0.23; and/or (vii) the laminate has a thickness of from 15 μm, or 20 μm, or 30 μm, or 40 μm, or 45 μm, or 50 μm to 55 μm, or 60 μm, or 65 μm, or 70 μm, or 75 μm, or 80 μm, or 85 μm, or 90 μm, or 95 μm, or 100 μm, or 150 μm, or 200 μm, or 250 μm, or 300 μm.

(160) In an embodiment, the unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 1:1 to 1:3, or 1:5, or 1:6, and the sealant layer of the laminate has one, some, or all of the following properties: (i) a pre-lamination COF from 0.01, or 0.05, or 0.10 to 0.17, or 0.20, or 0.25, or 0.27; and/or (ii) a Laminate 40° C. Cure COF of from 0.01, or 0.05, or 0.10 to 0.18; and/or (iii) a change in COF after 40° C. cure of from −0.10, or −0.05, or 0 to 0.01, or 0.05; and/or (iv) a Laminate 55° C. Cure COF of from 0.01, or 0.10 to 0.15, or 0.17, or 0.19, or 0.21; and/or (v) a change in COF after 55° C. cure of from −0.10, or −0.06, or 0 to 0.01, or 0.03, or 0.05.

(161) In an embodiment, the laminate excludes non-migratory slip agents, such as silicone.

(162) The first film, the second film, and the optional third film of the laminate may be a coextruded multilayer structure.

(163) Some methods, for example, used to construct laminates are by adhesive lamination, extrusion lamination, thermal lamination, dry lamination, and solvent-less lamination. Combinations of these methods are also possible.

(164) The first film, the second film, and the optional third film of the laminate may or may not be oriented. In an embodiment, one or more, or each of the first film, the second film, and the optional third film is not an oriented film. In another embodiment, one or more, or each of first film, the second film, and the optional third film is oriented (e.g., biaxially oriented).

(165) The laminate may comprise two or more embodiments disclosed herein.

(166) The present disclosure also provides an article containing the coextruded multilayer film and/or the laminate, such as a package. Nonlimiting examples of suitable packages include food packages, specialty packages, and detergent packages (liquid and powder). In an embodiment, a package is provided, the package formed from two opposing laminates. In an embodiment, the sealant layer of the first laminate is in contact with the sealant layer of the second laminate. In a further embodiment, a heat seal is formed from the opposing sealant layers to produce a package.

(167) By way of example, and not limitation, some embodiments of the present disclosure will now be described in detail in the following Examples.

Examples

(168) Materials used in the examples are provided in Table 1 below.

(169) TABLE-US-00001 TABLE 1 Material/Description Properties Source DOWLEX ™ 2045G MI (I2)(190° C./2.16 kg) = 1.0 g/10 min, The Dow Chemical (ethylene/1-octene Density = 0.920 g/cc Company copolymer)(LLDPE) DOW ™ 310E MI (I2)(190° C./2.16 kg) = 0.75 g/10 min, The Dow Chemical (ethylene homopolymer)(LDPE) Density = 0.923 g/cc Company Slip Concentrate 10090 5 wt % erucamide dispersed in LDPE A Ampacet Erucamide melting point = 79° C., LDPE A MI (I2)(190° C./2.16 kg) = 11 g/10 min, LDPE A Density = 0.916-0.918 g/cc AL-132503 Masterbatch 5 wt % behenamide dispersed in LDPE B Ampacet Behenamide melting point = 108-113° C., LDPE B MI (I2)(190° C./2.16 kg) = 10-11 g/10 min, LDPE B Density = 0.916-0.918 g/cc Antiblock 01 Masterbatch 10 wt % synthetic silica dispersed in LDPE C Ampacet LDPE C MI (I2)(190° C./2.16 kg) = 8 g/10 min, LDPE C Density = 0.916-0.918 g/cc
Coextruded 3-Layer Blown Film

(170) Coextruded 3-layer blown film samples are prepared using the materials of Table 1 using a Jinming Machinery blown film line. The extrusion parameters are as follows: 7-layer pancake die diameter=120 mm; die gap=1.5 mm; output=25 kg/hour; die temperature profile=200° C./200° C./200° C.; blow-up ratio (BUR)=2.3; layflat=43 cm; first haul-off speed=6.8-8.1 m/min; extruder diameter=30 mm; length/diameter (L/D)=30; extruder temperature profile=180° C./205° C./205° C./205° C./200° C. The resulting coextruded 3-layer blown film samples each has the following Structure (A): sealant layer/core layer/substrate layer A Structure (A).

(171) Each coextruded blown film samples has a thickness of 50 μm, and the thickness of each layer has a ratio of 1:1:1. Thus, the sealant layer, the core layer, and the substrate layer A each has a thickness of about 16.67 μm. The substrate layer A undergoes corona treatment with an on-line film surface energy of 40-42 dynes/cm. Split winding of the film occurs on-line. The layer configurations are provided below in Table 2.

(172) Seven days after the coextruded 3-layer blown film samples are formed, the coextruded 3-layer blown film samples are tested for pre-lamination COF. Before each specimen is tested, at least 10 meters of the beginning of the specimen film roll are discarded. At least two specimens of each sample are tested, and the average pre-lamination COF is reported. The results are reported in Table 2.

(173) Laminate

(174) The corona-treated 3-layer blown film samples having the Structure (A) are laminated with a PET film with a thickness of 12 μm and MOR-FREE™ 706A/C-79 (a solvent-less polyurethane adhesive available from Rohm and Haas) via a Labo Combi™ 400 laminator (a pilot coater) from Nordmeccanica Group. The lamination conditions are as follows: adhesive layer (MOR-FREE™ 706A/C-79) dry coating weight=1.8 g/m.sup.2; conduct pilot run speed=50 m/min; nip temperature=60° C. The resulting laminates have the following Structure (B): PET film substrate layer B/adhesive layer/substrate layer A/core layer/sealant layer.

(175) The laminates are cured in an oven at a temperature of 40° C. or 55° C. for 48 hours, and a film roll is formed. Three to six days after 40° C. cure or 55° C. cure, the laminate samples are tested for Laminate 40° C. Cure COF or Laminate 55° C. Cure COF, respectively. Before each specimen is tested, at least 10 meters of the beginning of the specimen film roll are discarded. At least two specimens of each sample are tested, and the average Laminate 40° C. Cure COF and Laminate 55° C. Cure COF are reported. The results are reported in Table 2. In Table 2, “CS” refers to Comparative Sample.

(176) As shown, a comparative laminate with an adhesive layer, a PET film substrate layer, and a film with a sealant layer containing (A) an ethylene-based polymer (DOWLEX™ 2045G and LDPE) and (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less (erucamide) (CS 2)—and no saturated primary fatty acid amide—exhibits a high Laminate 55° C. Cure COF of 0.48, and a high change in COF after 55° C. cure of 0.40.

(177) Moreover, a comparative laminate with an adhesive layer, a PET film substrate layer, and a film with a sealant layer containing (A) an ethylene-based polymer (DOWLEX™ 2045G and LDPE); (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less (erucamide); and (C) saturated primary fatty acid amide having a melting point greater than 100° C. (behenamide), the erucamide and the behenamide having a weight ratio of 5:1 (CS 3)—rather than the erucamide and the behenamide having a weight ratio of from 3:1 to 1:6—exhibits a high Laminate 55° C. Cure COF of 0.43, and a high change in COF after 55° C. cure of 0.34. Applicant surprisingly found that a laminate with an adhesive layer, a PET film substrate layer, and a film with a sealant layer containing (A) an ethylene-based polymer (DOWLEX™ 2045G and LDPE); (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less (erucamide); and (C) saturated primary fatty acid amide having a melting point greater than 100° C. (behenamide), the erucamide and the behenamide having a weight ratio of from 3:1 to 1:6 (Ex. 4-7) advantageously exhibits a Laminate 55° C. Cure COF of less than 0.40, and a change in COF after 55° C. cure of 0.23 or less.

(178) TABLE-US-00002 TABLE 2 CS 1 CS 2 CS 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Sealant Layer.sup.1 DOWLEX ™ 2045G (wt %).sup.2 97.25 92.21 92.21 92.21 92.21 92.21 92.21 Erucamide (wt %).sup.2 — 0.24 0.20 0.18 0.12 0.06 0.04 (from Slip Concentrate 10090) Behenamide (wt %).sup.2 — — 0.04 0.06 0.12 0.18 0.20 (from AL-132503 Masterbatch) Synthetic Silica (wt %).sup.2 0.25 0.25 0.25 0.25 0.25 0.25 0.25 (from Antiblock 01 Masterbatch) LDPE A (wt %).sup.2 — 4.80 4.00 3.60 2.40 1.20 0.80 (from Slip Concentrate 10090) LDPE B (wt %).sup.2 — — 0.80 1.20 2.40 3.60 4.00 (from AL-132503 Masterbatch) LDPE C (wt %).sup.2 2.50 2.50 2.50 2.50 2.50 2.50 2.50 (from Antiblock 01 Masterbatch) Core Layer.sup.4 DOWLEX ™ 2045G (wt %).sup.3 80 80 80 80 80 80 80 DOW ™ 310E (wt %).sup.3 20 20 20 20 20 20 20 Substrate Layer A.sup.5 DOWLEX ™ 2045G (wt %).sup.6 80 80 80 80 80 80 80 DOW ™ 310E (wt %).sup.6 20 20 20 20 20 20 20 Adhesive Layer MOR-FREE ™ 706A/C-79 (wt %).sup.7 100 100 100 100 100 100 100 PET Film Substrate Layer B.sup.8 PET (wt %).sup.9 100 100 100 100 100 100 100 Properties: Sealant Layer Weight Ratio of N/A N/A 5:1 3:1 1:1 1:3 1:5 Erucamide:Behenamide Pre-Lamination COF 0.49 ± 0.02 0.08 ± 0.02 0.09 ± 0.02 0.13 ± 0.02 0.12 ± 0.02 0.17 ± 0.02 0.25 ± 0.02 Laminate 40° C. Cure COF 0.49 ± 0.02 0.12 ± 0.02 0.21 ± 0.02 0.34 ± 0.02 0.17 ± 0.02 0.18 ± 0.02 COF Change after 40° C. Cure 0 0.04 0.12 0.21 0.05 0.01 Laminate 55° C. Cure COF 0.47 ± 0.02 0.48 ± 0.03 0.43 ± 0.03 0.36 ± 0.02 0.15 ± 0.02 0.17 ± 0.02 0.19 ± 0.02 COF Change after 55° C. Cure −0.02 0.40 0.34 0.23 0.03 0 −0.06 .sup.1The sealant layer is formed from the 3-layer blown film described above. The sealant layer has a thickness of about 16.67 μm .sup.2Based on the total weight of the sealant layer. .sup.3Based on the total weight of the core layer. .sup.4The core layer is formed from the 3-layer blown film described above. The core layer has a thickness of about 16.67 μm .sup.5The outer layer is formed from the 3-layer blown film described above. The outer layer has a thickness of about 16.67 μm .sup.6Based on the total weight of the substrate layer A. .sup.7The adhesive layer is formed from MOR-FREE ™ 706A/ C-79, having a dried coat weight of 1.8 g/m.sup.2. Weight percent is based on the total weight of the adhesive layer. .sup.8The PET film substrate layer B has a thickness of 12 μm. .sup.9Based on the total weight of the PET film substrate layer B.

(179) It is specifically intended that the present disclosure not be limited to the embodiments and illustrations contained herein, but include modified forms of those embodiments including portions of the embodiments and combinations of elements of different embodiments as come within the scope of the following claims.