Machining device and method
10973684 · 2021-04-13
Assignee
Inventors
Cpc classification
G02B27/0927
PHYSICS
H01S3/0071
ELECTRICITY
International classification
B23K26/06
PERFORMING OPERATIONS; TRANSPORTING
H01S3/13
ELECTRICITY
H01S3/00
ELECTRICITY
G02B27/09
PHYSICS
Abstract
The aim of the invention is to machine a material by application of non-linear radiation. The aim is achieved by modifying the laser radiation emitted by a laser beam source with the aid of a polarization modulator in such a way that laser radiation focused into the material is polarized in a linear fashion, the direction of polarization varying across the cross section of the beam.
Claims
1. A machining device configured to machine a material by non-linear absorption of machining pulsed laser radiation, the device comprising: a pulsed laser radiation source emitting a beam of pulsed laser radiation, the beam having a gauss-shaped beam cross-section when emitted from the pulsed laser radiation source, focusing optics configured to focus the beam for non-linear absorption into or onto the material to generate multiphoton interaction between the laser radiation and the material; and a modulator which is located in a beam path before the focusing optics and which modifies a distribution of an optical parameter of intensity or polarization across the gauss-shaped beam cross-section resulting in the focusing optics producing a first focus size reduced below a second focus size, the second focus size being that which the focusing optics would generate without the modulator.
2. The machining device as claimed in claim 1, wherein the optical parameter modified is intensity and the modulator comprises an intensity modulator that attenuates beam intensity near an optical axis of the focusing optics.
3. The machining device as claimed in claim 2, wherein the intensity modulator blocks out beam components near an optical axis of the focusing optics.
4. The machining device as claimed in claim 2, wherein the intensity modulator redistributes energy over the beam cross-section to remove energy from regions near an optical axis of the focusing optics.
5. The machining device as claimed in claim 2, wherein the intensity modulator is adjustable, with respect to the modification of the distribution of intensity over the beam cross-section.
6. The machining device as claimed in claim 2, wherein the intensity modulator is adjustable, with respect to the variation of the optical parameter over the beam cross-section, and wherein the machining device further comprises a control unit which adjusts the variation of the optical parameter during operation of the machining device.
7. The machining device as claimed in claim 1, wherein the optical parameter is polarization and the modulator comprises a polarization modulator introducing a polarization which varies across the beam cross-section.
8. The machining device as claimed in claim 7, wherein the modulator is adjustable, with respect to the modification of the distribution of polarization over the beam cross-section.
9. The machining device as claimed in claim 7, wherein the polarization modulator is adjustable, with respect to the variation of the optical parameter over the beam cross-section, and wherein the machining device further comprises a control unit which adjusts the variation of the optical parameter during operation of the machining device.
10. The machining device as claimed in claim 1, further comprising a scanner which modifies a spatial position of the focus in or on the material.
11. The machining device as claimed in claim 10, wherein the modulator is arranged between the laser radiation source and the scanner.
12. The machining device as claimed in claim 1, wherein the modulator is included in the laser radiation source.
13. The machining device as claimed in claim 12, wherein the pulse repetition frequency is above 450 kHz.
14. The machining device as claimed in claim 1, wherein the laser radiation source emits pulsed laser radiation with a pulse duration of less than 10,000 fs.
15. The machining device as claimed in claim 14, wherein the pulse duration is less than 500 fs.
16. The machining device as claimed in claim 1, wherein the laser radiation source operates at a pulse repetition frequency of more than 100 kHz.
17. The machining device as claimed in claim 1, wherein the focusing optics is further configured to focus the beam to a vicinity of a surface of the material to be machined, with a distance of the focus from the surface lying approximately in a range of the Rayleigh length of the radiation.
18. A method for machining a material, comprising: providing a pulsed laser beam of gauss-shaped beam cross-section, utilizing focusing optics to focus the beam into or onto the material; modifying, before focusing, a distribution of an optical parameter of intensity or polarization across the beam cross-section resulting in the focusing optics producing a first focus size reduced below a second focus size, the second focus size being that which the focusing optics would generate without the modifying; and selecting parameters of the laser radiation, the modifying and the focusing such that a non-linear absorption with multiphoton interaction between the laser radiation and the material occurs.
19. The method as claimed in claim 18, wherein the optical parameter is intensity and further comprising modifying to attenuate beam intensity near an optical axis of the focusing optics.
20. The method as claimed in claim 19, wherein the modifying comprises blocking out beam components near the optical axis.
21. The method as claimed in claim 19, wherein the modifying further comprising redistributing energy over the beam cross-section to remove energy from regions near an optical axis of the focusing optics.
22. The method as claimed in claim 18, wherein the optical parameter is polarization and the modifying further comprises introducing a polarization which varies across the beam cross-section.
23. The method as claimed in claim 18, wherein the modifying further comprises adjusting the distribution of intensity or polarization during machining.
24. The method as claimed in claim 23, further comprising closed-loop controlling a quality parameter of machining, with variation of distribution of the parameter of the intensity or polarization being used as a manipulated variable in the closed-loop control.
25. The method as claimed in claim 18, further comprising shifting a spatial position of the focus in or on the material at least two-dimensionally.
26. The method as claimed in claim 18, further comprising emitting the pulsed laser beam to have a pulse duration of less than 10,000 fs.
27. The method as claimed in claim 26, further comprising emitting the pulsed laser beam to have the pulse duration less than 500 fs.
28. The method as claimed in claim 18, further comprising emitting the pulsed laser beam to have a pulse repetition frequency of more than 100 kHz.
29. The method as claimed in claim 28, further comprising emitting the pulsed laser beam to have the pulse repetition frequency above 450 kHz.
30. The method as claimed in claim 18, the focusing further comprising focusing the beam to a vicinity of a surface of the material to be machined, with a distance of the focus from the surface lying approximately in the range of the Rayleigh length of the radiation.
31. The method as claimed in claim 18, further comprising forming at least one cut surface in the material by sequential arrangement of optical breakthroughs generated by the non-linear absorption.
32. The method as claimed in claim 31, further comprising forming the cut surfaces to be located in the material and to have a cutting line extending up to a surface of the material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The invention will be explained in more detail below, by way of example and with reference to the drawings, wherein:
(2)
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DETAILED DESCRIPTION
(17)
(18) Using the laser-surgical instrument 1 a visual deficiency of the eye 6 of the patient is remedied by removing material from the cornea such that the diffractive characteristic of the cornea is changed to a desired extent. In doing so, material is removed from the stroma of the cornea, said stroma being located below the epithelium and the Bowman membrane as well as above the Decemet membrane and the endothelium.
(19) The laser-surgical instrument 1 machines a material which is actually transparent to laser radiation. The pulsed laser radiation of the treatment beam 2 is therefore irradiated such that non-linear absorption occurs in order to generate the optical breakthrough.
(20) Material removal is achieved by focusing the high-energy pulsed treatment beam 2 of the laser-surgical instrument 1 into the stroma, thereby generating optical breakthroughs. Each single optical breakthrough initiates a plasma bubble so that tissue is separated. By suitable deflection of the treatment beam 2, plasma bubbles are sequentially arranged during treatment, which bubbles then circumscribe a partial volume of the stroma, namely the material to be removed. Due to the treatment beam 2, the laser-surgical instrument 1 acts like a surgical knife which, without injuring the surface of the cornea, cuts material directly within the transparent cornea of the eye. If the cut is guided up to the surface of the cornea by further generating optical breakthroughs, the material of the stroma isolated by the cut profile can be pulled out laterally and removed from the cornea.
(21) As shown in
(22)
(23) The structure of a laser treatment instrument is shown in simplified form in
(24) The inhomogeneous linear polarization conditions are characterized in that the polarization vector {right arrow over (P)} of the field does not have a uniform direction across the cross-section of the collimated laser beam.
(25) For physical characterization of such polarization conditions it should be noted first that for a collimated laser beam the field strength can be approximated conventionally as a planar wave. The position of the field strength vector can then be represented for linearly polarized light in any x, y coordinate system in which the wave propagates in the direction of z:={E.sub.0x,E.sub.0y}exp .sub.i
(26) For simplification, the standardized polarization vector {right arrow over (P)} of the field can now be introduced, the amplitude of the field strength being determined completely by the amplitude function √{square root over (E.sub.0x.sup.2+E.sub.0y.sup.2)}. Although said amplitude function drops rapidly for a Gauss beam, the following equation applies to the polarization vector, regardless of the specific amplitude distribution:
(27)
(28) Thus, the field strength results as:=√{square root over (E.sub.0x.sup.2+E.sub.0y.sup.2)}.Math.
.Math.exp i(wt−kz)
(29) The polarization vector is a function of x and y. If=
(x,y)=const.
(30) then this is a homogeneously linearly polarized field such as that which is emitted by most lasers, for example by a helium-neon laser. If=
(x,y)≠const.
(31) then the corresponding field of radiation is inhomogeneously linearly polarized.
(32) After an inhomogeneously linear polarization has thus been imposed on the laser radiation 2, the latter passes through a deflecting unit 12, which is symbolized here in the form of two deflecting mirrors being independently tiltable about orthogonal axes. Together with the adjustable objective 3, the focused laser beam 8 can thus be three-dimensionally shifted within the volume of the transparent material 13, thus allowing to form three-dimensional structures in the material, for example the wave guide structure 14 as shown. The pulsed laser radiation 2 emitted by the radiation source 9 is non-linearly absorbed by the material 13, thus causing a permanent change in material properties within the spatial region machined. As an alternative or in addition to the effect of the deflecting unit 12 and the adjustable objective 13, it is certainly also possible to move the object with the transparent material 13 itself relative to the objective 3. This may be of interest in particular if structures are to be generated whose extent goes at least partially beyond the positions achievable by the deflecting unit 12 or the length of adjustment of the objective 3.
(33) Due to the inhomogeneously linear polarization of the focused laser beam 8, a focus is obtained in the transparent material 13, which focus has smaller dimensions than would actually expected due to the beam path and in particular due to the objective 3. The precision of machining is thus increased. The same goes for the instrument 1 of
(34) The focus reduction achieved by the polarization modulator 10 may differ according to the beam path and in particular according to the type of transparent material 13. For optimization, it is therefore conveniently envisaged that the quality of machining, for example the size of the spatial region in which a non-linear interaction is determined, is measured and an optimization is effected by varying the setting of the polarization modulator 10. For example, the size of a plasma bubble generated in the material 13 or in the cornea 4 can be measured and minimization can be effected by adjusting the polarization modulator 10 which is controlled by a control device (not shown). Alternatively, the radiation emitted by the laser source 9 can also be gradually reduced by suitable control of the polarization modulator 10 until a minimal radiation power or pulse duration is present which is still sufficient for the desired non-linear interaction.
(35) The effect of the polarization modulator 10 is shown by way of example in
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(38) In order to form one of the inhomogeneous linear polarization conditions of
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(42) The intensity modulator 24 modifies the beam profile of the treatment beam 2 such that the radiation intensity near the optical axis is attenuated. Therefore, the intensity modulator 24 is located in a plane conjugated with the focal plane in the construction shown in
(43) The element 25 in the construction of
(44) The same result is obtained with the construction of the element 25 shown in
(45) Those radiation components passing through the region 29 are separated from the treatment beam 2 and only the reflected components are bundled in the focus. Instead of being fully transparent, the circular region 29 may also be partially reflective, which again results in attenuation in the core region of the treatment laser beam 2.
(46) An exemplary result for the beam profile obtainable with the element 25 is shown in
(47) As a result, the treatment beam 2 is no longer Gauss-shaped in profile after the intensity modulator 24, which likewise leads to an improved quality of focus as does the polarization modulation already explained with respect to the first embodiment.
(48) A further possibility of realizing the intensity modulator 24 is shown in
(49) The effect of the Powell asphere 33 is primarily due to its cone shape, as viewed in cross-section.
(50) In a further advanced embodiment, the instrument 1 may use both a polarization modulator 10 according to one of the described constructions and an intensity modulator 24 in one of the described constructions. Conveniently, the polarization modulator may also realize an amplitude modulation at the same time. For this purpose, the rings 19 of