ELECTRONIC MODULE FOR POWER CONTROL

Abstract

An electronic module for power control includes a carrier element, at least one power switching element having a cooling surface, and a cooling body. The at least one power switching element may be electrically connected to the carrier element. In an assembled state of the electronic module, the cooling body may be thermally conductively connected directly to the cooling surface of the power switching element. When a busbar is present, the busbar may be arranged between the carrier element and the at least one power switching element thereby producing an electrical connection between the carrier element and the at least one power switching element.

Claims

1. An electronic module for power control comprising: a carrier element, at least one power switching element having a cooling surface, with the at least one power switching element being electrically connected to the carrier element, and a cooling body that is thermally conductively connected directly to the cooling surface of the power switching element, and a busbar arranged between the carrier element and the at least one power switching element producing an electrical connection between the carrier element and the at least one power switching element.

2. The electronic module of claim 1, wherein the busbar is a part of the carrier element.

3. The electronic module of claim 1, wherein the busbar is applied to the carrier element and is electrically connected to the carrier element.

4. The electronic module of claim 1, further comprising a housing, which encloses the at least one power switching element and the busbar and the carrier element and the cooling body at least partly in an oil-tight fashion.

5. The electronic module of claim 4, wherein the housing is formed from a moulding compound.

6. The electronic module of claim 1, wherein the cooling body, on a side facing away from the cooling surface, has a cooling structure for linking to a further cooler.

7. The electronic module of claim 1, wherein the cooling body is at least partially realized from copper or a copper alloy.

8. The electronic module of claim 1, wherein the cooling body is cohesively connected to the cooling surface.

9. The electronic module of claim 1, where in the cooling body is soldered and/or adhesively bonded to the cooling surface.

10. The electronic module of claim 2, further comprising a housing, which encloses the at least one power switching element and the busbar and the carrier element and the cooling body at least partly in an oil-tight fashion.

11. The electronic module of claim 2, wherein the cooling body, on a side facing away from the cooling surface, has a cooling structure for linking to a further cooler.

12. The electronic module of claim 2, wherein the cooling body is cohesively connected to the cooling surface.

13. An electronic module for power control comprising: a carrier element, at least one power switching element having a cooling surface, with the at least one power switching element being electrically connected to the carrier element, and a cooling body that is thermally conductively and cohesively connected directly to the cooling surface of the power switching element and on a side facing away from the cooling surface, has a cooling structure for linking to a further cooler, a busbar arranged between the carrier element and the at least one power switching element producing an electrical connection between the carrier element and the at least one power switching element, and a housing, which encloses the at least one power switching element and the busbar and the carrier element and the cooling body at least partly in an oil-tight fashion.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG. 1 shows electronic module for power control according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

[0020] FIG. 1. shows a schematic cross-sectional illustration of an electronic module 100 for power control in accordance with one exemplary embodiment of the present disclosure. The electronic module 100, for example a component of an electronic control unit or of power electronics for an (electric) vehicle, comprises a carrier element 102, also called circuit carrier, which on one side is populated with one or more busbars 101 and also with a first power switching element 104 having a first cooling surface 106. The cooling surface 106 serves for dissipating heat via a top side of the power switching element 104 facing away from the carrier element 102, which is also referred to as top side cooling. The power switching element 104 is realized as MOSFET output stages, for example.

[0021] In the exemplary embodiment illustrated, the busbars 101 are applied on a top side of the carrier element 102. In this case, the busbars 101 are fixedly connected to the carrier element 102, such that the busbars 101 are prevented from slipping or detaching from the carrier element 102. Moreover, the busbars 101 are connected to electrical conductor tracks (not illustrated) that are optionally present in the carrier element 102.

[0022] The power switching element 104 is applied on the busbars 101 in such a way that an electrical connection between the connecting pins of the power switching element 104 and the busbars 101 is as free of losses as possible. In this case, the securing is affected by means of soldering, welding or other connection techniques for producing an electrical connection that are familiar to a person skilled in the art.

[0023] By way of example, the cooling surface 106 is thermally conductively connected to a cooling body 126 in each case by soldering at a soldering point. Alternatively, the cooling surface 106 is cohesively connected to the cooling body 126 by adhesive bonding. By way of example, a plurality of power switching elements 104 can be present, which are likewise thermally conductively connected by their cooling surfaces 106 to a contacting side 120 of the cooling body 126. Consequently, the cooling surfaces 106 of the plurality of power switching elements 104 are thermally coupled to one another via the cooling body 126. By virtue of the fact that the cooling body 126 also extends over regions of the carrier element 102 that lie between the plurality of power switching elements 104, the heat dissipation via the cooling body 126 can be effected particularly efficiently since a total surface area of the cooling body 126 turns out to be significantly larger in comparison with a total surface area of the cooling surfaces 106 of the plurality of power switching elements 104 or a total surface area of cooling laminae applied separately to respectively one of the power switching elements 104.

[0024] A second contacting side 124 of the cooling body 126, situated opposite the contacting side 120, serves for forming a cooling structure 130, e.g. a meandering channel or a PinFin structure for thermally conductive contacting to a further cooling body (not illustrated). A seal 140 is formed on the second contacting side 124 of the cooling body 126. Said seal serves to ensure that, in the assembled state of the electronic module 100 on a further cooling body, the cooling medium flowing through the cooling structure cannot escape. The inlet and outlet of the cooling medium into and out of the cooling structure are moreover not illustrated. The cooling body 126 is embodied for example as a component of a water cooler.

[0025] The housing 200 is formed for example by the electronic module 101 being encapsulated by injection moulding with a suitable housing material, for example a thermosetting plastic or some other suitable plastic or plastic-containing composite material.

[0026] If an exemplary embodiment includes an and/or linkage between a first feature and a second feature, then this can be interpreted such that the exemplary embodiment has both the first feature and the second feature in accordance with one embodiment and either only the first feature or only the second feature in accordance with a further embodiment.

[0027] While example, non-limiting embodiment has been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. It should also be appreciated that the exemplary embodiment is only an example, and is not intended to limit the scope, applicability, or configuration of the disclosure in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing the exemplary embodiment. It should be understood that various changes can be made in the function and arrangement of elements without departing from the scope of the disclosure as set forth in the appended claims and the legal equivalents thereof.