Fluid supply device and fluid supply method

Abstract

A fluid supply device and a fluid supply method capable of stably supplying a supercritical fluid includes a fluid supply device for supplying a fluid in a liquid state before being changed to a supercritical fluid toward a processing chamber. The fluid supply device comprises a condenser that condenses and liquefies a fluid in a gas state, a tank that stores the fluid condensed and liquefied by the condenser, a pump that pressure-feeds the liquefied fluid stored in the tank toward the processing chamber, and a heating means provided to a flow path communicating with a discharge side of the pump and for partially changing the liquid in the flow path to a supercritical fluid.

Claims

1. A fluid supply device for supplying a fluid in a liquid state toward a processing chamber, comprising: a condenser that liquefies a fluid in a gas state; a tank that stores the fluid liquefied by the condenser; a pump that pressure-feeds the liquefied fluid stored in the tank toward the processing chamber; a flow path that branches from a branch point between the pump and a switch valve provided in a middle of a flow path from a discharge side of the pump to the processing chamber, the flow path thus branched being a branched flow path to return the liquefied fluid discharged from the pump to the condenser; a back pressure valve provided to the branched flow path and configured to release the liquefied fluid on the discharge side of the pump to a side of the condenser when a pressure of the liquefied fluid becomes a predetermined pressure or more; an extended heat transfer tube part having an increased heat transfer area and provided between the back pressure valve and the branch point in the branched flow path; and a heater provided to the extended heat transfer tube part and to partially change the liquefied fluid in the branched flow path to a supercritical fluid.

2. The fluid supply device according to claim 1, wherein the extended heat transfer tube part includes any one of a spiral tube, a helical tube, a corrugated tube, a plate-type tube, and a multi-tube-type tube, or a combination thereof.

3. The fluid supply device according to claim 1, wherein the fluid can be changed to a supercritical state.

4. A fluid supply method comprising using the fluid supply device described in claim 1 to supply the fluid in the liquid state toward the processing chamber.

5. A semiconductor manufacturing system that processes a substrate using a fluid supplied from the fluid supply device described in claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A is a configuration diagram of a fluid supply device according to an embodiment of the present invention, and is a diagram illustrating a state in which a fluid is circulating.

(2) FIG. 1B is a diagram illustrating a state in which a liquid is supplied to a processing chamber in the fluid supply device of FIG. 1A.

(3) FIG. 2 is a graph showing a state of carbon dioxide.

(4) FIG. 3 is a front view illustrating an example of an extended heat transfer tube part.

(5) FIG. 4A is a schematic configuration view illustrating another embodiment of the extended heat transfer tube part and a heating means.

(6) FIG. 4B is a schematic configuration view illustrating yet another embodiment of the extended heat transfer tube part and the heating means.

(7) FIG. 5 is a configuration diagram of a fluid supply device according to another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

(8) Embodiments of the present invention are described below with reference to the drawings.

First Embodiment

(9) FIG. 1A and FIG. 1B illustrate a fluid supply device according to an embodiment of the present invention. In the present embodiment, a case in which carbon dioxide is used as the fluid will be described.

(10) In FIG. 1A and FIG. 1B, 1 denotes a fluid supply device, 10 denotes an extended heat transfer tube part, 20 denotes a heating means (for example, a heater), 100 denotes a CO.sub.2 supply source, 110 denotes a switch valve, 120 denotes a check valve, 121 denotes a filter, 130 denotes a condenser, 140 denotes a tank, 150 denotes a pump, 160 denotes an automatic switch valve, 170 denotes a back pressure valve, and 500 denotes a processing chamber. Further, in the drawings, P denotes a pressure sensor, and TC denotes a temperature sensor. FIG. 1A illustrates a state in which the automatic switch valve 160 is closed, and FIG. 1B illustrates a state in which the automatic switch valve 160 is opened.

(11) In the processing chamber 500, a semiconductor substrate such as a silicon wafer is processed. It should be noted that while, in the present embodiment, a silicon wafer is exemplified as a processing target, the processing target is not necessarily limited thereto, and may be another processing target such as a glass substrate.

(12) The CO.sub.2 supply source 100 supplies carbon dioxide (for example, 20° C., 5.0 MPa) in a gas state to a main flow path 2. With reference to FIG. 2, the carbon dioxide supplied from the CO.sub.2 supply source 100 is in a state of P1 in FIG. 2. The carbon dioxide in this state is fed to the condenser 130 through the switch valve 110, the check valve 120, and the filter 121.

(13) In the condenser 130, the supplied carbon dioxide in a gas state is cooled and thus liquefied and condensed, and the liquefied and condensed carbon dioxide is stored in the tank 140. The carbon dioxide stored in the tank 140 is in a state (3° C., 5 MPa) such as indicated by P2 in FIG. 2. The carbon dioxide in a liquid state such as indicated by P2 in FIG. 2 is fed from a bottom portion of the tank 140 to the pump 150 and pressure-fed to a discharge side of the pump 150, and thus turns into a liquid state (20° C., 20 MPa) such as indicated by P3 in FIG. 2.

(14) The automatic switch valve 160 is provided in a middle of the main flow path 2 connecting the pump 150 and the processing chamber 500. A branching flow path 3 branches from an area between the pump 150 and the automatic switch valve 160 of the main flow path 2. The branching flow path 3 branches from the main flow path 2 between the pump 150 and the automatic switch valve 160, and is connected to the main flow path 2 again on an upstream side of the filter 121. The extended heat transfer tube part 10 and the back pressure valve 170 are provided to the branching flow path 3.

(15) When a pressure of the fluid (liquid) on the discharge side of the pump 150 becomes a setting pressure (for example, 20 MPa) or greater, the back pressure valve 170 releases the liquid to the filter 121 side. Accordingly, the pressure of the liquid on the discharge side of the pump 150 is prevented from exceeding the setting pressure.

(16) With the automatic switch valve 160 closed, the liquid pressure-fed from the pump 150 returns again to the condenser 130 and the tank 140 through the branching flow path 3, as illustrated in FIG. 1A.

(17) When the automatic switch valve 160 is opened, the carbon dioxide in a liquid state is pressure-fed to the processing chamber 500, as illustrated in FIG. 1B. The carbon dioxide in a liquid state thus pressure-fed is heated by a heating means (not illustrated) provided right before the processing chamber 500 or inside the processing chamber 500, and turns into a supercritical state (80° C., 20 MPa) such as indicated by P5 illustrated in FIG. 2.

(18) Here, the liquid discharged from the pump 150 pulsates considerably.

(19) When the liquid discharged from the pump 150 is supplied to the processing chamber 500, the main flow path 2 is filled with the liquid up to the processing chamber 500, and the branching flow path 3 is also filled with liquid up to the back pressure valve 170. Thus, when the liquid discharged from the pump 150 pulsates, the pressure of the carbon dioxide in a liquid state in the main flow path 2 and the branching flow path 3 periodically fluctuates.

(20) Carbon dioxide in a liquid state has poor compressibility. Thus, when the pressure of the carbon dioxide in a liquid state periodically fluctuates, a flow rate of the carbon dioxide in a liquid state supplied to the processing chamber 500 also greatly fluctuates accordingly. When the flow rate of the supplied carbon dioxide in a liquid state greatly fluctuates, a supply amount of the carbon dioxide changed to the supercritical state right before the processing chamber 500 or inside the processing chamber 500 also greatly fluctuates.

(21) Thus, in the present embodiment, the extended heat transfer tube part 10 and the heating means 20 are provided to the branching flow path 3.

(22) The extended heat transfer tube part 10 is configured by a spiral tube 11 connected in series to the branching flow path 3 in order to increase the heat transfer area per unit volume greater than that of a normal straight tube.

(23) The spiral tube 11 is provided with pipe joints 12, 15 at a lower end portion and an upper end portion, respectively, and is connected in series to the branching flow path 3 by these pipe joints 12, 15.

(24) A tube 13 constituting the spiral tube 11 is formed of a metal material such as stainless steel, for example. A diameter of the tube 13 is 6.35 mm, a total length L of a spiral part 14 is 280 mm, a diameter D1 of the spiral part 14 is about 140 mm, a number of turns of the spiral part 14 is 22, and a total length of the tube 13 is about 9,800 mm. The present invention is not necessarily limited thereto, and includes a helical tube, a corrugated tube, and the like in addition to the spiral tube. The spiral or helical shape need not be circular, and may be square. Further, the extended heat transfer tube 10 may be a plate type or multi-tube type tube, similar to that used in a heat exchanger.

(25) The heating means 20 heats the extended heat transfer tube part 10, but may be provided so as to cover the extended heat transfer tube part 10 in its entirety or may be provided so as to cover an outer peripheral surface of the spiral tube 11. In short, the heating means 20 may be configured to be capable of heating at least a portion of the extended heat transfer part 10, that is, a portion or all of the spiral tube 11.

(26) The spiral tube 11 of the extended heat transfer tube part 10 is filled with carbon dioxide in a liquid state (the state indicated by P3 in FIG. 2: 20° C., 20 MPa) pressure-fed from the pump 150 when the heating means 20 not operating. Here, when the heating means 20 is operated to heat the liquid in the spiral tube 11, because the heat transfer area is increased, the temperature of the liquid instantaneously rises and at least a portion of the liquid in the spiral tube 11 changes to a supercritical state such as indicated by P4 (60° C., 20 MPa) illustrated in FIG. 2. Carbon dioxide in a supercritical state has high compressibility, and therefore absorbs the pulsation of the liquid discharged from the pump 150. As a result, a supercritical fluid can be stably supplied to the processing chamber 500.

Second Embodiment

(27) FIG. 4A illustrates another embodiment of the extended heat transfer tube part.

(28) In an extended heat transfer tube part 10B illustrated in FIG. 4A, the spiral tube 11 is connected in parallel to the branching flow path 3, and an orifice 30 is provided between the branching flow path 3 and the spiral tube 11.

(29) Even with such a configuration, in the same way as in the first embodiment, it is possible to suppress the pulsation (periodic pressure fluctuation) of the liquid discharged from the pump 150, and stabilize the supply amount of carbon dioxide changed to a supercritical state right before the processing chamber 500 or inside the processing chamber 500.

Third Embodiment

(30) FIG. 4B illustrates yet another embodiment of the extended heat transfer tube part.

(31) In an extended heat transfer tube part 10C illustrated in FIG. 4B, two of the spiral tubes 11 are connected in parallel and inserted into the branching flow path 3, and the orifice 30 is provided between the branching flow path 3 and one of the spiral tubes 11.

(32) Even with such a configuration, in the same way as in the first embodiment, it is possible to suppress the pulsation (periodic pressure fluctuation) of the liquid discharged from the pump 150, and stabilize the supply amount of carbon dioxide changed to a supercritical state right before the processing chamber 500 or inside the processing chamber 500.

(33) FIG. 5 illustrates a fluid supply device 1A according to another embodiment of the present invention. It should be noted that, in FIG. 5, the same components as those in FIG. 1A are denoted using the same reference numerals.

(34) In the fluid supply device 1A, the extended heat transfer tube part 10 does not exist, and the heating means 20 heats the liquid in the branching flow path 3 to partially change the liquid to a supercritical fluid.

(35) According to such a configuration, the extended heat transfer tube part 10 is not required, and the device configuration can be simplified.

(36) While a case in which the extended heat transfer tube part 10 and the heating means 20 are provided to the branching flow path 3 is given as an example in each of both embodiments described above, the present invention is not necessarily limited thereto, and the extended heat transfer tube part 10 can be provided in a middle of the main flow path 2 on the discharge side of the pump 150 as well.

(37) While carbon dioxide is illustrated as the fluid pressurized and fed to the processing chamber by the pump in the above-described embodiments, the present invention is not necessarily limited thereto and is applicable as long as the fluid is one that can be changed to a supercritical state, such as water, methane, ethane, propane, methanol, or ethanol, for example.

DESCRIPTIONS OF REFERENCE NUMERALS

(38) 1, 1A Fluid supply device 2 Main flow path 3 Branching flow path 10, 10B, 10C Extended heat transfer tube part 11 Spiral tube 20 Heating means 30 Orifice 100 CO.sub.2 supply source 110 Switch valve 120 Check valve 121 Filter 130 Condenser 140 Tank 150 Pump 160 Automatic switch valve 170 Back pressure valve 500 Processing chamber