Glass

Abstract

A glass of the present invention includes as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 12% to 25% of Al.sub.2O.sub.3, 0% to 3% of B.sub.2O.sub.3, 0% to 3% of Li.sub.2O+Na.sub.2O+K.sub.2O, 5% to 25% of MgO+CaO+SrO+BaO, and 0.1% to 10% of P.sub.2O.sub.5, and has a strain point of more than 730 C.

Claims

1. A glass, comprising as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 12% to 25% of Al.sub.2O.sub.3, 0% to less than 1% of B.sub.2O.sub.3, 0% to 3% of Li.sub.2O+Na.sub.2O+K.sub.2O, 8% to 25% of MgO+CaO+SrO+BaO, 0.1% to 10% of P.sub.2O.sub.5, 0.1% to 20% of BaO, and 0.01% to 1% of SnO.sub.2, and having a strain point of more than 730 C., wherein the glass has a molar ratio (MgO+CaO+SrO+BaO)/Al.sub.2O.sub.3 of from 0.7 to 1.

2. The glass according to claim 1, wherein the glass has a content of Li.sub.2O+Na.sub.2O+K.sub.2O of 0.2 mol % or less.

3. The glass according to claim 1, wherein the glass has a strain point of 760 C. or more.

4. The glass according to claim 1, wherein the glass has a difference of (a temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s-strain point) of 980 C. or less.

5. The glass according to claim 1, wherein the glass has a temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s of 1,750 C. or less.

6. The glass according to claim 1, wherein the glass has a flat sheet shape.

7. The glass according to claim 1, wherein the glass is used for a substrate for forming a semiconductor crystal.

Description

DESCRIPTION OF EMBODIMENTS

(1) A glass of the present invention comprises as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 12% to 25% of Al.sub.2O.sub.3, 0% to 3% of B.sub.2O.sub.3, 0% to 3% of Li.sub.2O+Na.sub.2O+K.sub.2O, 5% to 25% of MgO+CaO+SrO+BaO, and 0.1% to 10% of P.sub.2O.sub.5, and has a strain point of more than 730 C. The reasons why the contents of the components are restricted as described above are hereinafter described. The expression % refers to mol % in the descriptions of the components.

(2) The lower limit of the content range of SiO.sub.2 is preferably 60% or more, 63% or more, 65% or more, or 67% or more, particularly preferably 68% or more, and the upper limit of the content range of SiO.sub.2 is preferably 80% or less, 75% or less, or 73% or less, particularly preferably 71% or less. When the content of SiO.sub.2 is too small, a devitrified crystal containing Al.sub.2O.sub.3 is liable to be generated, and the strain point is liable to lower. Meanwhile, when the content of SiO.sub.2 is too large, a viscosity at high temperature increases, and thus meltability is liable to lower. Further, a devitrified crystal containing SiO.sub.2 is liable to be generated.

(3) The lower limit of the content range of Al.sub.2O.sub.3 is preferably 12% or more or 13% or more, particularly preferably 14% or more, and the upper limit of the content range of Al.sub.2O.sub.3 is preferably 25% or less, 20% or less, or 18% or less, particularly preferably 17% or less. When the content of Al.sub.2O.sub.3 is too small, the strain point is liable to lower. Meanwhile, when the content of Al.sub.2O.sub.3 is too large, the devitrified crystal containing Al.sub.2O.sub.3 is liable to be generated.

(4) The upper limit of the content range of B.sub.2O.sub.3 is preferably 3% or less, 1% or less, less than 1%, or 0.5% or less, particularly preferably 0.1% or less. When the content of B.sub.2O.sub.3 is too large, there is a risk in that the strain point may significantly lower.

(5) The upper limit of the content range of Li.sub.2O+Na.sub.2O+K.sub.2O is preferably 3% or less, 1% or less, less than 1%, or 0.5% or less, particularly preferably 0.2% or less. When the content of Li.sub.2O+Na.sub.2O+K.sub.2O is too large, an alkali ion is diffused into a semiconductor substance, and thus the characteristics of a semiconductor are liable to deteriorate. The upper limit of the content range of each of Li.sub.2O, Na.sub.2O, and K.sub.2O is preferably 3% or less, 1% or less, less than 1%, 0.5% or less, or 0.3% or less, particularly preferably 0.2% or less. Each of Li.sub.2O, Na.sub.2O, and K.sub.2O is a component which is inevitably mixed in as a raw material impurity. In consideration of raw material cost, the content of Li.sub.2O+Na.sub.2O+K.sub.2O is restricted to preferably 0.01% or more, particularly preferably 0.02% or more.

(6) The lower limit of the content range of MgO+CaO+SrO+BaO is preferably 5% or more, 7% or more, 8% or more, 10% or more, or 12% or more, particularly preferably 14% or more, and the upper limit of the content range of MgO+CaO+SrO+BaO is preferably 25% or less, 20% or less, or 18% or less, particularly preferably 17% or less. When the content of MgO+CaO+SrO+BaO is too small, a liquidus temperature significantly increases, and thus a denitrified crystal is liable to be generated in the glass. Meanwhile, when the content of MgO+CaO+SrO+BaO is too large, the strain point is liable to lower.

(7) When both an increase in strain point and an improvement in meltability are to be achieved, the lower limit of the range of the molar ratio (MgO+CaO+SrO+BaO)/Al.sub.2O.sub.3 is preferably 0.5 or more, 0.6 or more, 0.7 or more, or 0.8 or more, particularly preferably 0.9 or more, and the upper limit of the range of the molar ratio (MgO+CaO+SrO+BaO)/Al.sub.2O.sub.3 is preferably 3 or less, 2 or less, 1.5 or less, 1.2 or less, or 1.1 or less.

(8) The lower limit of the content range of MgO is preferably 0% or more, 1% or more, or 2% or more, particularly preferably 3% or more, and the upper limit of the content range of MgO is preferably 10% or less, 9% or less, or 8% or less, particularly preferably 7% or less. When the content of MgO is too small, the meltability and a Young's modulus are liable to lower. Meanwhile, when the content of MgO is too large, generation of the devitrified crystal containing Al.sub.2O.sub.3 (in particular, mullite) is accelerated, with the result that a liquidus viscosity lowers. Further, the strain point is liable to lower, MgO has an increasing effect on a thermal expansion coefficient so that the thermal expansion coefficient matches the thermal expansion coefficient of a material to be formed into a film, while the effect is the lowest among those of alkaline earth metal oxides.

(9) The lower limit of the content range of CaO is preferably 0% or more, 3% or more, 5% or more, or 7% or more, particularly preferably 9% or more, and the upper limit of the content range of CaO is preferably 25% or less or 20% or less, particularly preferably 15% or less. When the content of CaO is too small, the meltability is liable to lower. Meanwhile, when the content of CaO is too large, the liquidus temperature increases, and thus the devitrified crystal is liable to be generated in the glass.

(10) CaO has high effects of improving the liquidus viscosity and increasing the meltability without lowering the strain point as compared to other alkaline earth metal oxides. In addition, CaO has a higher increasing effect on the thermal expansion coefficient than MgO. Therefore, it is preferred to preferentially introduce CaO among the alkaline earth metal oxides. The lower limit of the range of the molar ratio CaO/(MgO+CaO+SrO+BaO) is preferably 0.5 or more, 0.6 or more, 0.7 or more, or 0.8 or more, particularly preferably 0.9 or more. The molar ratio CaO/(MgO+CaO+SrO+BaO) refers to a value obtained by dividing the content of CaO by the total content of MgO, CaO, SrO, and BaO.

(11) The lower limit of the content range of SrO is preferably 0% or more, 2% or more, or 4% or more, particularly preferably 6% or more, and the upper limit of the content range of SrO is preferably 15% or less or 12% or less, particularly preferably 10% or less. When the content of SrO is too small, the strain point is liable to lower. Meanwhile, when the content of SrO is too large, the liquidus temperature increases, and thus the devitrified crystal is liable to be generated in the glass. In addition, the suitability is liable to lower. SrO has a higher increasing effect on the thermal expansion coefficient than MgO and CaO.

(12) The lower limit of the content range of BaO is preferably 0% or more, 0.1% or more, 1% or more, 3% or more, or 5% or more, particularly preferably 7% or more, and the upper limit of the content range of BaO is preferably 20% or less, 17% or less, 14% or less, or 12% or less, particularly preferably 10% or less. When the content of BaO is too small, the strain point and the thermal expansion coefficient are liable to lower. Meanwhile, when the content of BaO is too large, the liquidus temperature increases, and thus the devitrified crystal is liable to be generated in the glass. In addition, the melt ability is liable to lower. BaO has the highest increasing effects on the thermal expansion coefficient and the strain point among the alkaline earth metal oxides.

(13) The lower limit of the content range of P.sub.2O.sub.5 is preferably 0.1% or more, 1% or more, 2% or more, or 3% or more, particularly preferably 4% or more, and the upper limit of the content range of P.sub.2O.sub.5 is preferably 10% or less or 8% or less, particularly preferably 6% or less. P.sub.2O.sub.5 is effective in suppressing precipitation of a devitrified crystal containing an alkaline earth metal element, and further, is more effective in suppressing a reduction in strain point than the alkaline earth metal oxides. Meanwhile, when P.sub.2O.sub.5 is excessively introduced, the glass is liable to be phase separated, and a devitrified crystal free from the alkaline earth metal element is liable to precipitate.

(14) In order to achieve an increase in strain point, the content of P.sub.2O.sub.5 is preferably larger than the content of B.sub.2O.sub.3, more preferably larger than the content of B.sub.2O.sub.3 by 1% or more, still more preferably larger than the content of B.sub.2O.sub.3 by 3% or more.

(15) In order to achieve both a reduction in electrical resistivity of molten glass and an increase in strain point, the molar ratio (Li.sub.2O+Na.sub.2O+K.sub.2O)/P.sub.2O.sub.5 is preferably from 0.001 to 0.05, particularly preferably from 0.01 to 0.03. The molar ratio (Li.sub.2O+Na.sub.2O+K.sub.2O)/P.sub.2O.sub.5 refers to a value obtained by dividing the total content of Li.sub.2O, Na.sub.2O, and K.sub.2O by the content of P.sub.2O.sub.5.

(16) In order to achieve an increase in devitrification resistance, the content of P.sub.2O.sub.5 is preferably larger than the content of MgO, more preferably larger than the content of MgO by 1% or more, still more preferably larger than the content of MgO by 3% or more.

(17) In order to achieve an increase in devitrification resistance, the content of P.sub.2O.sub.5 is preferably larger than the content of SrO, more preferably larger than the content of SrO by 1% or more, still more preferably larger than the content of SrO by 3% or more.

(18) Other than the above-mentioned components, the following components may be introduced in the glass composition.

(19) ZnO is a component which increases the meltability. However, when ZnO is contained in a large amount in the glass composition, the glass is liable to devitrify, and the strain point is liable to lower. Therefore, the content of ZnO is preferably from 0% to 5%, front 0% to 3%, from 0% to 0.5%, or from 0% to 0.3%, particularly preferably from 0% to 0.1%.

(20) ZrO.sub.2 is a component which increases the Young's modulus. The content of ZrO.sub.2 is preferably from 0% to 5%, from 0% to 3%, from 0% to 0.5%, or from 0% to 0.2%, particularly preferably from 0% to 0.02%. When the content of ZrO.sub.2 is too large, the liquidus temperature increases, and thus a devitrified crystal of zircon is liable to precipitate.

(21) TiO.sub.2 is a component which lowers the viscosity at high temperature and thus increases the meltability, and is also a component which suppresses solarisation. However, when TiO.sub.2 is contained in a large amount in the glass composition, the glass is liable to be colored. Therefore, the content of TiO.sub.2 is preferably from 0% to 5%, from 0% to 3%, from 0% to 1%, or from 0% to 0.1%, particularly preferably from 0% to 0.02%.

(22) SnO.sub.2 is a component which has a satisfactory fining effect in a high temperature region, and is also a component which lowers the viscosity at high temperature. The content of SnO.sub.2 is preferably from 0% to 1%, from 0.01% to 0.5%, or from 0.01% to 0.3%, particularly preferably from 0.04% to 0.1%. When the content of SnO.sub.2 is too large, a denitrified crystal of SnO.sub.2 is liable to precipitate.

(23) CeO.sub.2, SO.sub.3, C, and metal ponder (for example, of Al, Si, or the like) may be added at up to 1% as a fining agent as long as glass characteristics are not impaired.

(24) Also As.sub.2O.sub.3, Sb.sub.2O.sub.3, F, and Cl act effectively as a fining agent. The glass of the present invention does not exclude the incorporation of those components, but from an environmental viewpoint, the contents of those components are each preferably less than 0.1%, particularly preferably less than 0.05%.

(25) In the case where the content of SnO.sub.2 is from 0.01% to 0.5%, the glass is liable to be colored when the content of Rh.sub.2O.sub.3 is too large. Rh.sub.2O.sub.3 may be mixed in from a manufacturing vessel made of platinum. The content of Rh.sub.2O.sub.3 is preferably from 0% to 0.0005%, particularly preferably from 0.00001% to 0.0001%.

(26) SO.sub.3 is a component which is mixed in from a raw material as an impurity. When the content of SO.sub.3 is too large, bubbles called reboil are generated during melting and forming, and defects may occur in the glass. The lower limit of the content range of SO.sub.3 is preferably 0.0001% or more, and the upper limit of the content range of SO.sub.3 is preferably 0.005% or less, 0.003% or less, or 0.002% or less, particularly preferably 0.001% or less.

(27) The content of a rare earth oxide is preferably less than 2%, 1% or less, or 0.5% or less, particularly preferably less than 0.1%. When the content of the rare earth oxide is too large, batch cost is liable to increase.

(28) Iron is a component which is mixed in from the raw material as an impurity. When the content of iron is too large, a transmittance, particularly an ultraviolet light transmittance may lower. Therefore, the lower limit of the content range of iron in terms of Fe.sub.2O.sub.3 is preferably 0.001% or more, and the upper limit of the content range of iron in terms of Fe.sub.2O.sub.3 is preferably 0.05% or less, 0.04% or less, 0.03% or less, 0.02% or less, or 0.01% or less, particularly preferably less than 0.01%.

(29) The glass of the present invention preferably has the following characteristics.

(30) The strain point is preferably more than 730 C., 740 C. or more, 750 C. or more, 760 C. or more, 770 C. or more, 780 C. or more, or 790 C. or more, particularly preferably 800 C. or more. As the strain point becomes lower, the heat resistance is more liable to lower.

(31) It is preferred that the thermal expansion coefficient within a temperature range of from 30 C. to 380 C. be close to the thermal expansion coefficient of a material to be formed into a film. Specifically, when a gallium nitride-based semiconductor crystal is formed into a film, the thermal expansion coefficient is preferably 4010.sup.7/ C. or more or 4210.sup.7/ C. or more, particularly preferably 4410.sup.7/ C. or more. Alternatively, when a-Si, p-Si, or the like is formed into a film, the thermal expansion coefficient is desirably 3010.sup.7/ C. or more and less than 4010.sup.7/ C. The thermal expansion coefficient within a temperature range of from 30 C. to 380 C. refers to an average value measured with a dilatometer.

(32) When a glass substrate having formed thereon a semiconductor element is used for an electronic device, also the glass substrate is required to be reduced in weight, because a reduction in weight of the electronic device is important. In order to satisfy such requirement, it is desired to reduce the weight of the glass substrate through a reduction in density. The density is preferably 3.20 g/cm.sup.3 or less, 3.00 g/cm.sup.3 or less, or 2.90 g/cm.sup.3 or less, particularly preferably 2.80 g/cm.sup.3 or less.

(33) A glass having a high strain point is generally hard to melt. Therefore, the enhancement of the meltability is an issue. When the meltability is enhanced, a defective rate attributed to bubbles, foreign matter, or the like is reduced, and hence a high-quality glass substrate can be supplied at low cost in a large number. Therefore, the temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s is preferably 1,750 C. or less, 1,720 C. or less, 1,700 C. or less, or 1,680 C. or less, particularly preferably 1,670 C. or less. The temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s corresponds to a melting temperature. As the temperature becomes lower, the meltability becomes more excellent.

(34) When the glass is formed into a flat sheet shape by a down-draw method or the like, the devitrification resistance is important. In consideration of the forming temperature of the glass system according to the present invention, the liquidus temperature is preferably 1,350 C. or less, 1,300 C. or less, or 1,260 C. or less, particularly preferably 1,230 C. or less. In addition, the liquidus viscosity is preferably 10.sup.3.6 dPa.Math.s or more, 10.sup.4.0 dPa.Math.s or more, or 10.sup.4.5 dPa.Math.s or more, particularly preferably 10.sup.5.0 dPa.Math.s or more. Herein, the liquidus temperature refers to a value obtained by measuring a temperature at which a crystal precipitates when glass powder that passed through a standard 30-mesh sieve (500 m) and remained on a 50-mesh sieve (300 m) is placed in a platinum boat and kept for 24 hours in a gradient heating furnace. The liquidus viscosity refers to a value obtained by measuring the viscosity of the glass at the liquidus temperature by a platinum sphere pull up method.

(35) The glass of the present invention preferably has a formed joined surface in the glass. That is, the glass of the present invention is preferably formed by an overflow down-draw method. The overflow down-draw method refers to a method in which molten glass is caused to overflow from both sides of a wedge-shaped refractory, and the overflowing molten glasses are subjected to down-draw downward at the lower end of the wedge-shaped refractory while being joined, to thereby form a glass in a flat sheet shape. By the overflow down-draw method, surfaces which are to serve as the surfaces of a glass substrate are formed in a state of free surfaces without being brought into contact with the refractory. As a result, a glass substrate having good surface quality can be produced without polishing at low cost, and an increase in area and a reduction in thickness are easily achieved as well.

(36) In addition to the overflow down-draw method, the glass substrate may be formed by, for example, a slot down method, a redraw method, a float method, or a roll-out method.

(37) In the glass of the present invention, the thickness (in the case of a flat sheet shape, a sheet thickness) is not particularly limited, but is preferably 1.0 mm or less, 0.7 mm or less, or 5.0 mm or less, particularly preferably 0.4 mm or less. As the sheet thickness becomes smaller, the weight of a device can be reduced more easily. The thickness may be adjusted by controlling, for example, a flow rate and a sheet-drawing speed at the time of glass production.

(38) In the glass of the present invention, the strain point can be increased, by reducing a -OH value. The -OH value is preferably 0.40/mm or less, 0.35/mm or less, 0.30/mm or less, 0.25/mm or less, or 0.20/mm or less, particularly preferably 0.15/mm or less. When the -OH value is too large, the strain point is liable to lower. When the -OH value is too small, the meltability is liable to lower. Therefore, the -OH value is preferably 0.01/mm or more, particularly preferably 0.05/mm or more.

(39) A method of reducing the -OH value is exemplified by the following methods: (1) a method involving selecting raw materials having low water contents; (2) a method involving adding a component (such as Cl or SO.sub.3) that reduces the water content in the glass; (3) a method involving reducing the water content in a furnace atmosphere; (4) a method involving performing N.sub.2 bubbling in the molten glass; (5) a method involving adopting a small melting furnace; (6) a method involving increasing the flow rate of the molten glass; and (7) a method involving adopting an electric melting method.

(40) Herein, the -OH value refers to a value determined by using the following equation after measuring the transmittances of the glass with an FT-IR.
-OH value=(1/X)log(T.sub.3/T.sub.2) X: Glass thickness (mm) T.sub.3: Transmittance (%) at a reference wavelength of 3,846 cm.sup.1 T.sub.2: Minimum transmittance (%) at a wavelength around a hydroxyl group absorption wavelength of 3,600 cm.sup.1

(41) As a method of producing the glass of the present invention on an industrial scale, there is preferably given a method of producing a glass comprising as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 12% to 25% of Al.sub.2O.sub.3, 0% to 3% of B.sub.2O.sub.3, 0% to 3% of Li.sub.2O+Na.sub.2O+K.sub.2O, 5% to 25% of MgO+CaO+SrO+BaO, and 0.1% to 10% of P.sub.2O.sub.5, and having a -OH value of 0.40/mm or less and a strain point of more than 730 C., the method comprising: a melting step of supplying a blended glass batch to a melting furnace and heating the blended glass batch through application of a current with a heating electrode to provide molten glass; and a forming step of forming the resultant molten glass into a glass in a flat sheet shape having a sheet thickness of from 0.1 mm to 0.7 mm by an overflow down-draw method.

(42) In general, a production process for the glass substrate comprises a melting step, a fining step, a supplying step, a stirring step, and a forming step. The melting step is a step of melting a glass batch obtained by blending glass raw materials to provide molten glass. The fining step is a step of fining the molten glass obtained in the melting step by an action of a fining agent or the like. The supplying step is a step of transferring the molten glass from one step to another. The stirring step is a step of stirring the molten glass to homogenize the molten glass. The forming step is a step of forming the molten glass into a glass in a flat sheet shape. A step other than the above-mentioned steps, for example, a state adjusting step of adjusting the molten glass to be in a state suitable for forming may be introduced after the stirring step as required.

(43) When the conventional alkali-free glass and low-alkali glass are produced on an industrial scale, the melting has been generally performed by heating with combustion burner flame. A burner is generally arranged at an upper portion of a melting kiln, and uses fossil fuel as its fuel, specifically, for example, liquid fuel, such as heavy oil, or gas fuel, such as LPG. The combustion flame may be obtained by mixing the fossil fuel and oxygen gas. However, such method is liable to entail an increase in -OH value because a large amount of water is mixed in the molten glass during the melting. Therefore, in the production of the glass substrate of the present invention, it is preferred to perform, heating through application of a current with a heating electrode, and it is more preferred to perform the melting by only heating through application of a current with a heating electrode without heating with combustion burner flame. With this, water is less liable to be mixed in the molten glass during the melting, and hence the -OH value is easily controlled to 0.40/mm or less, 0.30/mm or less, or 0.20/mm or less, particularly 0.15/mm or less. Further, when the heating through application of a current with a heating electrode is performed, the amount of energy required for obtaining the molten glass per unit mass is reduced, and the amount of a melt volatile is reduced. As a result, an environmental load can be reduced.

(44) The heating through application of a current with a heating electrode is preferably performed by applying an alternating voltage to a heating electrode arranged at a bottom portion or a side portion of a melting kiln so as to be brought into contact with the molten glass in the melting kiln. A material used for the heating electrode preferably has heat resistance and corrosion resistance to the molten glass. For example, tin oxide, molybdenum, platinum, or rhodium may be used.

(45) Each of the alkali-free glass and the low-alkali glass, which has a small content of an alkali metal oxide, has a high electrical resistivity. Therefore, when the heating through application of a current with a heating electrode is applied to such glass, there is a risk in that the current flows not only in the molten glass but also in a refractory constituting the melting kiln, with the result that the refractory constituting the melting kiln is damaged early. In order to prevent such situation, it is preferred to use, as a refractory in a furnace, a zirconia-based refractory having a high electrical resistivity, particularly zirconia electrocast bricks. In addition, it is preferred to introduce a component which lowers the electrical resistivity (Li.sub.2O, Na.sub.2O, K.sub.2O, Fe.sub.2O.sub.3, or the like) in the molten glass (glass composition) in a small amount. In particular, it is preferred to introduce Li.sub.2O, Na.sub.2O, and K.sub.2O at a total content of from 0.01 mol % to 1 mol %, from 0.02 mol % to 0.5 mol %, from 0.03 mol % to 0.4 mol %, or from 0.05 mol % to 0.3 mol %, particularly from 0.07 mol % to 0.2 mol %. Further, the content of ZrO.sub.2 in the zirconia-based refractory is preferably 85 mass % or more, particularly preferably 90 mass % or more. When the introduction amount of Li.sub.2O, Na.sub.2O, and K.sub.2O in terms of the total content is 0.2 mol % or less, there is no risk of contamination of a semiconductor substance by diffusion of an alkali ion.

EXAMPLES

(46) The present invention is hereinafter described in detail by way of Examples. However, Examples below are merely examples. The present invention is by no means limited to Examples below.

(47) Examples of the present invention (Sample Nos. 1 to 22) are shown in Table 1.

(48) TABLE-US-00001 TABLE 1 No. No. No. No. No. No. No. 1 2 3 4 5 6 7 Glass SiO.sub.2 69.9 69.9 66.9 63.9 66.9 63.9 67.9 com- Al.sub.2O.sub.3 15.0 15.0 15.0 15.0 15.0 15.0 15.0 po- B.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 0.0 0.0 sition P.sub.2O.sub.3 3.0 6.0 3.0 6.0 3.0 6.0 2.0 (mol Li.sub.2O 0.0 0.0 0.0 0.0 0.0 0.0 0.0 %) Na.sub.2O 0.0 0.0 0.0 0.0 0.0 0.0 0.0 K.sub.2O 0.0 0.0 0.0 0.0 0.0 0.0 0.0 MgO 4.0 3.0 0.0 0.0 5.0 5.0 0.0 CaO 8.0 6.0 0.0 0.0 5.0 5.0 10.0 SrO 0.0 0.0 7.5 7.5 5.0 5.0 0.0 BaO 0.0 0.0 7.5 7.5 0.0 0.0 5.0 SnO.sub.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Fe.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 0.0 0.0 Li.sub.2O + Na.sub.2O + 0.0 0.0 0.0 0.0 0.0 0.0 0.0 K.sub.2O MgO + CaO + 12.0 9.0 15.0 15.0 15.0 15.0 15.0 SrO + BaO (Mg + Ca + 0.80 0.60 1.00 1.00 1.00 1.00 1.00 Sr + Ba)/Al [g/cm.sup.3] 2.45 2.38 2.79 2.76 2.55 2.53 2.65 [10.sup.7/ C.] 30.7 25.7 46.5 46.9 36.4 36.4 41.9 Ps [ C.] 767 772 788 763 758 740 785 Ta [ C.] 827 837 852 825 816 798 844 Ts [ C.] 1.072 1.105 1.098 1.074 1.048 1.037 1.073 10.sup.4.0 dPa .Math. s 1.396 1.457 1.430 1.406 1.364 1.361 1.387 [ C.] 10.sup.3.0 dPa .Math. s 1.561 1.628 1.595 1.572 1.523 1.523 1.548 [ C.] 10.sup.2.5 dPa .Math. s 1.666 1.735 1.697 1.677 1.624 1.625 1.651 [ C.] TL [ C.] 1.362 1.461 1.328 <1.226 1.271 1.353 1.289 logTL 4.3 4.7 4.8 >5.6 4.8 4.1 4.8 [dPa .Math. s] 10.sup.2.5 dPa .Math. 899 963 909 914 866 885 866 s Ps [ C.] -OH 0.15 Not Not Not Not Not Not value mea- mea- mea- mea- mea- mea- sured sured sured sured sured sured No. No. No. No. No. 8 9 10 11 12 Glass SiO.sub.2 65.9 69.9 65.9 66.9 66.9 com- Al.sub.2O.sub.3 15.0 15.0 15.0 15.0 15.0 po- B.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 sition P.sub.2O.sub.3 4.0 1.0 4.0 3.0 3.0 (mol Li.sub.2O 0.0 0.0 0.0 0.0 0.0 %) Na.sub.2O 0.0 0.0 0.0 0.0 0.0 K.sub.2O 0.0 0.0 0.0 0.0 0.0 MgO 0.0 0.0 0.0 0.0 0.0 CaO 10.0 14.0 15.0 15.0 10.0 SrO 0.0 0.0 0.0 0.0 0.0 BaO 5.0 0.0 0.0 0.0 5.0 SnO.sub.2 0.1 0.1 0.1 0.1 0.1 Fe.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 Li.sub.2O + Na.sub.2O + 0.0 0.0 0.0 0.0 0.0 K.sub.2O MgO + CaO + 15.0 14.0 15.0 15.0 15.0 SrO + BaO (Mg + Ca + 1.00 0.93 1.00 1.00 1.00 Sr + Ba)/Al [g/cm.sup.3] 2.63 2.76 2.49 2.50 2.64 [10.sup.7/ C.] 42.0 41.0 39.3 39.0 42.0 Ps [ C.] 769 804 782 789 778 Ta [ C.] 828 861 838 845 837 Ts [ C.] 1.061 1.079 1.055 1.059 1.066 10.sup.4.0 dPa .Math. s [ C.] 1.380 1.378 1.359 1.359 1.383 10.sup.3.0 dPa .Math. s [ C.] 1.541 1.537 1.516 1.513 1.541 10.sup.2.5 dPa .Math. s [ C.] 1.643 1.640 1.616 1.613 1.643 TL [ C.] <1.139 1.362 1.311 1.314 1.233 logTL [dPa .Math. s] >6.4 4.1 4.4 4.4 5.4 10.sup.2.5 dPa .Math. s Ps 874 836 834 824 865 [ C.] -OH 0.09 Not Not Not Not value mea- mea- mea- mea- sured sured sured sured No. No. No. No. No. 13 14 15 16 17 Glass SiO.sub.2 65.9 66.9 66.9 64.9 68.9 compo- Al.sub.2O.sub.3 16.0 15.0 15.0 16.0 14.0 sition B.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 (mol P.sub.2O.sub.3 3.93 3.0 3.0 3.0 3.0 %) Li.sub.2O 0.0 0.0 0.0 0.0 0.0 Na.sub.2O 0.07 0.0 0.0 0.0 0.0 K.sub.2O 0.0 0.0 0.0 0.0 0.0 MgO 0.0 2.0 0.0 0.0 0.0 CaO 10.0 10.0 12.0 11.0 14.0 SrO 0.0 0.0 0.0 0.0 0.0 BaO 4.0 3.0 3.0 5.0 0.0 SnO.sub.2 0.1 0.1 0.1 0.1 0.1 Fe.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 Li.sub.2O + 0.0 0.0 0.0 0.0 0.0 Na.sub.2O + K.sub.2O MgO + CaO + 14.0 15.0 15.0 16.0 14.0 SrO + BaO (Mg + Ca + 0.88 1.00 1.00 1.00 1.00 Sr + Ba)/Al [g/cm.sup.3] 2.59 2.58 2.58 2.66 2.47 [10.sup.7/ C.] 39.8 38.6 40.8 43.1 37.9 Ps [ C.] 776 767 781 778 791 Ta [ C.] 838 825 838 836 849 Ts [ C.] 1.069 1.055 1.063 1.056 1.073 10.sup.4.0 dPa .Math. s 1.384 1.370 1.372 1.357 1.385 [ C.] 10.sup.3.0 dPa .Math. s 1.542 1.527 1.531 1.512 1.547 [ C.] 10.sup.2.5 dPa .Math. s 1.640 1.627 1.631 1.609 1.651 [ C.] TL [ C.] 1.195 1.239 1.285 1.287 1.343 logTL 5.8 5.2 4.8 4.6 4.5 [dPa .Math. s] 10.sup.2.5 dPa .Math. s Ps 864 860 850 831 860 [ C.] -OH value 0.10 Not Not Not Not mea- mea- mea- mea- sured sured sured sured No. No. No. No. No. 18 19 20 21 22 Glass SiO.sub.2 66.9 66.9 66.9 66.9 67.3 compo- Al.sub.2O.sub.3 15.0 15.0 15.0 15.0 13.9 sition B.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.0 (mol P.sub.2O.sub.3 3.0 3.0 3.0 3.0 1.6 %) Li.sub.2O 0.0 0.0 0.0 0.0 0.0 Na.sub.2O 0.0 0.0 0.0 0.0 0.0 K.sub.2O 0.05 0.0 0.0 0.0 0.0 MgO 4.95 3.0 3.0 1.0 6.0 CaO 8.0 10.0 8.0 10.0 7.4 SrO 0.0 0.0 0.0 0.0 0.3 BaO 2.0 2.0 4.0 4.0 3.4 SnO.sub.2 0.0 0.0 0.0 0.0 0.1 Fe.sub.2O.sub.3 0.0 0.0 0.0 0.0 0.005 Li.sub.2O + Na.sub.2O + K.sub.2O 0.0 0.0 0.0 0.0 0.0 MgO + CaO + 15.0 15.0 15.0 15.0 17.1 SrO + BaO (Mg + Ca + 1.00 1.00 1.00 1.00 0.81 Sr + Ba)/Al [g/cm.sup.3] 2.54 2.55 2.60 2.61 2.61 [10.sup.7/ C.] 35.6 37.8 38.7 40.6 39.1 Ps [ C.] 756 762 760 771 754 Ta [ C.] 814 819 819 829 810 Ts [ C.] 1.045 1.050 1.054 1.061 1.034 10.sup.4.0 dPa .Math. s [ C.] 1.356 1.360 1.372 1.378 1.343 10.sup.3.0 dPa .Math. s [ C.] 1.514 1.521 1.532 1.537 1.500 10.sup.2.5 dPa .Math. s [ C.] 1.614 1.621 1.632 1.638 1.598 TL [ C.] 1.280 1.254 1.202 1.238 1.209 logTL [dPa .Math. s] 4.7 4.9 5.6 5.3 5.2 10.sup.2.5 dPa .Math. s Ps 858 859 872 867 844 [ C.] -OH value 0.16 Not Not Not 0.09 mea- mea- mea- sured sured sured

(49) Each sample was produced in the following manner. First, a glass batch prepared by blending glass raw materials so that each glass composition listed in the tables was attained was placed in a platinum crucible, and then melted at from 1,600 C. to 1,750 C. for 24 hours. When the glass batch was dissolved, molten glass was stirred to be homogenized by using a platinum stirrer. Next, the molten glass was poured on a carbon sheet and formed into a glass having a flat sheet shape. Each of the resultant samples was evaluated for its density , thermal expansion coefficient , strain point Ps, annealing point Ta, softening point Ts, temperature at a viscosity at high temperature of 10.sup.4.8 dPa.Math.s, temperature at a viscosity at high temperature of 10.sup.3.0 dPa.Math.s, temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s, liquidus temperature TL, liquidus viscosity log TL, and -OH value.

(50) The density is a value obtained by measurement by a well-known Archimedes method.

(51) The thermal expansion coefficient is an average value measured in the temperature range of from 30 C. to 380 C. with a dilatometer.

(52) The strain point Ps, the annealing point Ta, and the softening point Ts are values obtained by measurement in conformity with ASTM C336 or ASTM C338.

(53) The temperature at a viscosity at high temperature of 10.sup.4.0 dPa.Math.s, the temperature at a viscosity at high temperature of 10.sup.3.0 dPa.Math.s, and the temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s are values obtained by measurement by a platinum sphere pull up method.

(54) The liquidus temperature TL is a temperature at which devitrification (a devitrified crystal) was observed in the glass when each of the samples was pulverized, and glass powder that passed through a standard 30-mesh sieve (500 m) and remained on a 50-mesh sieve (300 m) was placed in a platinum boat and kept for 24 hours in a gradient heating furnace, followed by taking the platinum boat out of the gradient heating furnace. The liquidus viscosity log TL is a value obtained by measuring the viscosity of the glass at the liquidus temperature TL by a platinum sphere pull up method.

(55) The -OH value is a value calculated by using the above-mentioned equation.

(56) As is apparent from Table 1, each of Sample Nos. 1 to 22 has high heat resistance, and has devitrification resistance enough to be formed into a flat sheet shape. Therefore, each of Sample Nos. 1 to 22 is considered to be suitable as a glass substrate for forming a semiconductor crystal for an LED at high temperature.

INDUSTRIAL APPLICABILITY

(57) The glass of the present invention has high heat resistance, and has devitrification resistance enough to be formed into a flat sheet shape. Therefore, the glass of the present invention is suitable for a glass substrate for forming a semiconductor crystal for an LED at high temperature. Further, other than the above-mentioned applications, the glass of the present, invention is also suitable for a substrate for a display of a liquid crystal display or the like, particularly for a substrate for a display driven by an LTPS or oxide TFT.