Encapsulation film

Abstract

Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the encapsulation film, which may form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

Claims

1. An encapsulation film, comprising: a pressure-sensitive adhesive layer comprising a polymer derived from butylene, a monofunctional acrylate satisfying Formula 1 and a multifunctional active energy ray polymerizable compound satisfying Formula 2: ##STR00004## where T is a linear or branched alkyl group, alkenyl group or alkynyl group having 6 to 30 carbon atoms, or U[OW].sub.nOQ, in which U and W are each independently an alkylene group or alkylidene group, Q is an alkyl, alkenyl group, alkynyl group or aryl group, and n is a number from 0 to 10, ##STR00005## where R.sub.1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or higher, and X is a residue derived from a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms, wherein the pressure-sensitive adhesive layer satisfies General Equation 1,
d1 mm,[General Equation 1] wherein d is a creeping distance of the pressure-sensitive adhesive layer creeped when a sample, prepared by forming the pressure-sensitive adhesive layer having a thickness of 50 m on one surface of a metal base, is attached to a glass in an area of 1 cm1 cm, and 500 g of a weight is loaded onto a top surface of the metal base at 85 C. for 1 hour, and wherein the polymer derived from butylene is a copolymer obtained by copolymerizing a butylene monomer with a different monomer capable of being polymerized therewith; a reactive oligomer using a butylene monomer; or a mixture thereof, and wherein the polymer derived from butylene is comprised at 50 to 90 parts by weight, the compound satisfying Formula 1 is comprised at 5 to 35 parts by weight, and the multifunctional active energy ray polymerizable compound of Formula 2 is comprised at 5 to 25 parts by weight.

2. The film of claim 1, wherein the monomer capable of being polymerized with the butylene monomer is isoprene, styrene or butadiene.

3. The film of claim 1, wherein the reactive oligomer using the butylene monomer is a butylene polymer having a reactive functional group, and the butylene polymer binds to a different polymer having another a reactive functional group.

4. The film of claim 1, wherein the polymer derived from butylene is comprised at 60 to 95 parts by weight, and the compound satisfying Formula 1 is comprised at 5 to 40 parts by weight.

5. The film of claim 1, wherein the pressure-sensitive adhesive layer further includes a tackifier.

6. The film of claim 5, wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

7. The film of claim 5, wherein the tackifier is comprised at 5 to 100 parts by weight with respect to 100 parts by weight of the polymer.

8. The film of claim 1, wherein the pressure-sensitive adhesive layer further comprises a radical initiator.

9. The film of claim 8, wherein the radical initiator is a photoinitiator or a thermal initiator.

10. The film of claim 1, wherein the pressure-sensitive adhesive layer further comprises a moisture scavenger.

11. The film of claim 1, wherein the pressure-sensitive adhesive layer has a single layer or a multilayer structure including two or more layers.

12. The film of claim 1, further comprising: a metal layer formed on one surface of the pressure-sensitive adhesive layer.

13. The film of claim 12, wherein the metal layer has a thermal conductivity of 50 W/mK or more.

14. The film of claim 1, wherein the pressure-sensitive adhesive layer has a water vapor transmission rate (WVTR) in a thickness direction of 50 g/m.sup.2.Math.day or less, while formed to a thickness of 100 m.

15. An organic electronic device, comprising: a substrate; an organic electronic element formed on the substrate; and the encapsulation film of claim 1, which encapsulates the entire surfaces of the organic electronic element that are not in contact with the substrate.

16. A method of manufacturing an organic electronic device, comprising: applying the encapsulation film of claim 1 to a substrate on which an organic electronic element is formed to cover the entire surfaces of the organic electronic element that are not in contact with the substrate; and curing the encapsulation film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1 and 2 are cross-sectional views of an encapsulation film according to an exemplary embodiment of the present application; and

(2) FIG. 3 is a cross-sectional view of an OED according to an exemplary embodiment of the present application.

EXPLANATION OF REFERENCE NUMERALS

(3) 11: base film or release film

(4) 12: pressure-sensitive adhesive layer

(5) 12a: first layer

(6) 12b: second layer

(7) 13: metal layer

(8) 21: substrate

(9) 22: organic electronic device

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(10) Hereinafter, the present application will be described in further detail with reference to examples according to the present application and comparative examples not according to the present application, and the scope of the present application is not limited to the following examples.

Example 1

(11) A coating solution was prepared by adding 50 g of butyl rubber (Exxon Butyl 068) as a polymer derived from butylene, 24 g of a hydrogenated hydrocarbon resin (EASTOTAC H-100L) as a tackifier, 15 g of a monofunctional acrylate, i.e., 2-(2-ethoxyethoxy)ethyl acrylate as the compound of Formula 1, 10 g of trimethylolpropane triacrylate as a multifunctional active energy ray polymerizable compound and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Ciba IRGACURE 651) as a radical initiator, and diluting the resultant mixture with toluene to have a solid content of about 15 wt %.

(12) An encapsulation film was formed by forming a pressure-sensitive adhesive layer to a thickness of 50 m by coating a release surface of a release PET with the prepared solution and drying the coated product in an oven at 100 C. for 15 minutes, and laminating the pressure-sensitive adhesive layer with a copper film having a thickness of 20 m. Physical properties of the film sample irradiated with UV rays at 2 J/cm.sup.2 were measured.

Example 2

(13) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was replaced with stearyl acrylate.

Example 3

(14) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was replaced with lauryl acrylate.

Example 4

(15) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was replaced with isodecyl acrylate.

Comparative Example 1

(16) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was not included.

Comparative Example 2

(17) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was replaced with lauryl methacrylate.

Comparative Example 3

(18) An encapsulation film was formed by the same method as described in Example 1, except that the compound of Formula 1 was replaced with isobornyl acrylate.

Experimental Example 1Non-Lamination of Panel

(19) The pressure-sensitive adhesive layer having a thickness of 50 m and a size of 14 cm9 cm, which was formed in any one of Examples and Comparative Examples, was attached to the center of a 0.7 T glass having a size of 150 cm10 cm using a roll laminator. A glass having the same size as the prepared specimen was laminated through vertical pressing using a vacuum laminator at 25 to 100 C. and a vacuum degree of 100 pa under a pressure of 0.5 MPa. A laminating property was determined by the degree of non-lamination or bubble generation on the entire surfaces of a pressure-sensitive adhesive, and thus when non-lamination or generation of at least one bubble having a diameter of 3 mm or more occurred, it was determined as a lamination failure.

Experimental Example 2Creeping Distance

(20) A sample prepared by forming the pressure-sensitive adhesive layer prepared in any one of Examples and Comparative Examples on one surface of a metal base having a thickness of 50 m was attached to a glass at an adhesive area of 1 cm1 cm, 500 g of a weight was loaded to the metal base in a gravity direction at 85 C. for 1 hour, and then a creeping distance of the pressure-sensitive adhesive layer was measured. Here, as the metal base, copper was used. When the weight was loaded, the case in which the adhesive area was all creeped back, the thus the sample was detached was determined as a failure.

(21) TABLE-US-00001 TABLE 1 85 C. retention, Lamination or creeping distance non-lamination (m) of panel Example 1 0 X Example 2 960 X Example 3 500 X Example 4 100 X Comparative Example 1 Failed Lamination failed Comparative Example 2 Failed X Comparative Example 3 Failed Lamination failed