Ceramic electronic device and wiring substrate

Abstract

A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C.sub.1 and a first inductance L.sub.1 and a second capacity region having a second electrostatic capacity C.sub.2 and a second inductance L.sub.2, wherein the first electrostatic capacity C.sub.1, the first inductance L.sub.1, the second electrostatic capacity C.sub.2 and the second inductance L.sub.2 satisfy (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2)<0.5 or 1.9<(C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2).

Claims

1. A ceramic electronic device comprising: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C.sub.1 and a first inductance L.sub.1 and a second capacity region having a second electrostatic capacity C.sub.2 and a second inductance L.sub.2, wherein the first electrostatic capacity C.sub.1, the first inductance L.sub.1, the second electrostatic capacity C.sub.2, and the second inductance L.sub.2 are adjusted as follows to manifest two resonance frequencies: (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2)<0.5 or 1.9<(C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2), and 200≤C.sub.1/C.sub.2<250 or 950<C.sub.1/C.sub.2, wherein the multilayer chip has a third capacity region of which each thickness of each dielectric layer is different from those of the first capacity region and the second capacity region, the thickness of each dielectric layer of the second and third capacity regions is greater than that of the first capacity region, and the first capacity region is sandwiched between the second and third capacity regions in a planar view against the internal electrode layers.

2. The ceramic electronic device as claimed in claim 1, wherein L.sub.1=α.Math.t.sub.1.Math.s.sub.1 and L.sub.2=α.Math.t.sub.2.Math.s.sub.2 are satisfied, when an interval between an undermost internal electrode layer in the first capacity region and a lower face of the multilayer chip is t.sub.1, an interval between an undermost internal electrode layer of the second capacity region and the lower face of the multilayer chip is t.sub.2, a number of the internal electrode layer in the first capacity region is s.sub.1, a number of the internal electrode layer in the second capacity region is s.sub.2, and a proportional constant is α.

3. The ceramic electronic device as claimed in claim 1, wherein each thickness of each dielectric layer in the first capacity region is different from each thickness of each dielectric layer in the second capacity region.

4. The ceramic electronic device as claimed in claim 1, wherein each overlapped area between each two internal electrode layers next to each other in the first capacity region is different from each overlapped area between each two internal electrode layers next to each other in the second capacity region, in a planar view against the internal electrode layers.

5. The ceramic electronic device as claimed in claim 1, wherein L.sub.1/L.sub.2<0.002 or 0.0095<L.sub.1/L.sub.2 is satisfied.

6. The ceramic electronic device as claimed in claim 1, further comprising a wiring substrate on which the ceramic electronic device is mounted.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 illustrates a perspective view of a multilayer ceramic capacitor in which a cross section of a part of the multilayer ceramic capacitor is illustrated;

(2) FIG. 2 illustrates a cross sectional view taken along a line I-I of FIG. 1;

(3) FIG. 3 illustrates a cross sectional view of a sample used for the experiment;

(4) FIG. 4 illustrates a graph indicating a relationship between a frequency of a high frequency signal and impedance in a case where a sample of FIG. 3 is used;

(5) FIG. 5 illustrates a cross sectional view of a sample used for an experiment;

(6) FIG. 6 illustrates a graph indicating a relationship between a frequency of a high frequency signal and impedance in a case where a sample of FIG. 6 is used;

(7) FIG. 7 illustrates an equivalent circuit diagram of a multilayer ceramic capacitor;

(8) FIG. 8 illustrates a graph indicating a relationship between a frequency of a high frequency signal and impedance obtained with use of values of Table 1;

(9) FIG. 9 illustrates a graph indicating a relationship between a frequency of a high frequency signal and impedance obtained with use of values of data No. 2 of Table 2;

(10) FIG. 10A illustrates a cross sectional view for describing inductance of each capacity region in a case where a second capacity region of a multilayer ceramic capacitor is mounted on a wiring substrate;

(11) FIG. 10B illustrates a cross sectional view for describing inductance of each capacity region in a case where a first capacity region of a multilayer ceramic capacitor is mounted on a wiring substrate;

(12) FIG. 11A schematically illustrates a first sample P1 used for review;

(13) FIG. 11B schematically illustrates a second sample P2 used for review;

(14) FIG. 12 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 3 of Table 4 is used;

(15) FIG. 13 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 4 of Table 4 is used;

(16) FIG. 14 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 5 of Table 5 is used;

(17) FIG. 15 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 6 of Table 5 is used;

(18) FIG. 16 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 7 of Table 5 is used;

(19) FIG. 17 illustrates a graph of a relationship between a frequency of a high frequency signal and impedance obtained when each value of data No. 8 of Table 6 is used;

(20) FIG. 18A schematically illustrate a plan view of a facing area in a first capacity region;

(21) FIG. 18B schematically illustrate a plan view of a facing area in a second capacity region; and

(22) FIG. 19 illustrates a cross sectional view in a case where a multilayer ceramic capacitor has a first capacity region to a third capacity region.

DETAILED DESCRIPTION

(23) A description will be given of an embodiment with reference to the accompanying drawings.

(24) (Embodiment) FIG. 1 illustrates a perspective view of a multilayer ceramic capacitor 100 in accordance with an embodiment, in which a cross section of a part of the multilayer ceramic capacitor 100 is illustrated. As illustrated in FIG. 1, the multilayer ceramic capacitor 100 includes a multilayer chip 10 having a rectangular parallelepiped shape, and a pair of external electrodes 20a and 20b that are respectively provided at two end faces of the multilayer chip 10 facing each other.

(25) The multilayer chip 10 has a structure designed to have dielectric layers 11 and internal electrode layers 12 alternately stacked. The dielectric layer 11 includes ceramic material acting as a dielectric material. The internal electrode layers 12 include a base metal material. End edges of the internal electrode layers 12 are alternately exposed to a first end face of the multilayer chip 10 and a second end face of the multilayer chip 10 that is different from the first end face. In the embodiment, the first end face faces with the second end face. The external electrode 20a is provided on the first end face. The external electrode 20b is provided on the second end face. Thus, the internal electrode layers 12 are alternately conducted to the external electrode 20a and the external electrode 20b. Thus, the multilayer ceramic capacitor 100 has a structure in which a plurality of dielectric layers 11 are stacked and each two of the dielectric layers 11 sandwich the internal electrode layer 12. In the multilayer chip 10, the internal electrode layer 12 is positioned at an outermost layer. The upper face and the lower face of the multilayer chip 10 that are the internal electrode layers 12 are covered by cover layers 13. A main component of the cover layer 13 is a ceramic material. For example, a main component of the cover layer 13 is the same as that of the dielectric layer 11.

(26) For example, the multilayer ceramic capacitor 100 may have a length of 0.25 mm, a width of 0.125 mm and a height of 0.125 mm. The multilayer ceramic capacitor 100 may have a length of 0.4 mm, a width of 0.2 mm and a height of 0.2 mm. The multilayer ceramic capacitor 100 may have a length of 0.6 mm, a width of 0.3 mm and a height of 0.3 mm. The multilayer ceramic capacitor 100 may have a length of 1.0 mm, a width of 0.5 mm and a height of 0.5 mm. The multilayer ceramic capacitor 100 may have a length of 3.2 mm, a width of 1.6 mm and a height of 1.6 mm. The multilayer ceramic capacitor 100 may have a length of 4.5 mm, a width of 3.2 mm and a height of 2.5 mm. However, the size of the multilayer ceramic capacitor 100 is not limited.

(27) A main component of the internal electrode layers 12 is a base metal such as nickel (Ni), copper (Cu), tin (Sn) or the like. The internal electrode layers 12 may be made of a noble metal such as platinum (Pt), palladium (Pd), silver (Ag), gold (Au) or alloy thereof. A thickness of the internal electrode layer 12 is, for example, 0.5 μm or less. It is preferable that the thickness of the internal electrode layer 12 is 0.3 μm or less. The dielectric layers 11 are mainly composed of a ceramic material that is expressed by a general formula ABO.sub.3 and has a perovskite structure. The perovskite structure includes ABO.sub.3-α having an off-stoichiometric composition. For example, the ceramic material is such as BaTiO.sub.3 (barium titanate), CaZrO.sub.3 (calcium zirconate), CaTiO.sub.3 (calcium titanate), SrTiO.sub.3 (strontium titanate), Ba.sub.1-x-yCa.sub.xSr.sub.yTi.sub.1-zZr.sub.zO.sub.3 (0≤x≤1, 0≤y≤1, 0≤z≤1) having a perovskite structure.

(28) FIG. 2 illustrates a cross sectional view taken along a line I-I of FIG. 1. As illustrated in FIG. 2, the multilayer chip 10 has a first capacity region 10a and a second capacity region 10b. Thicknesses of the dielectric layers 11 of the first capacity region 10a are different from those of the dielectric layers 11 of the second capacity region 10b. In the embodiment, the thicknesses of the dielectric layers 11 of the first capacity region 10a are smaller than those of the dielectric layers 11 of the second capacity region 10b. And, a first electrostatic capacity C.sub.1 of the first capacity region 10a is larger than a second electrostatic capacity C.sub.2 of the second capacity region 10b.

(29) The thicknesses of the dielectric layers 11 of the first capacity region 10a and the second capacity region 10b are not limited. The thicknesses of the dielectric layers 11 of the first capacity region 10a may be 0.6 μm to 1.2 μm (for example, 0.9 μm). The thicknesses of the dielectric layers 11 of the second capacity region 10b may be 5.0 μm to 10.0 μm (for example, 7.5 μm). The thicknesses of the dielectric layers 11 of the first capacity region 10a may be equal to each other. The thicknesses of the dielectric layers 11 of the second capacity region 10b may be equal to each other.

(30) When the multilayer ceramic capacitor 100 has the first capacity region 10a and the second capacity region 10b of which the electrostatic capacity is different from each other, it is thought that the multilayer ceramic capacitor 100 has two resonance frequencies according to the first capacity region 10a and the second capacity region 10b. The present inventor performed the following experiment in order to confirm the fact.

(31) FIG. 3 illustrates a cross sectional view of a sample used for the experiment. As illustrated in FIG. 3, in the experiment, the multilayer ceramic capacitor 100 was mounted on a wiring layer 31 of a wiring substrate 30. The external electrodes 20a and the external electrode 20b were connected to the wiring layer 31 through a solder 32. The second capacity region 10b was under the first capacity region 10a. And, the second capacity region 10b was mounted on the wiring substrate 30.

(32) A high frequency signal was input to the multilayer ceramic capacitor 100 from the wiring layer 31. And, a graph of a relationship between a frequency of the high frequency signal and impedance of the multilayer ceramic capacitor 100 was obtained. FIG. 4 illustrates the graph.

(33) A solid line of FIG. 4 indicates the impedance in which contact resistance between the external electrodes 20a and 20b and the wiring layer 31 was ignored. A dotted line indicates a resistance component. For example, the resistance component is a resistance component between the external electrodes 20a and 20b and the wiring layer 31 or a resistance component of a capacitor.

(34) As illustrated in FIG. 4, the graph of the solid line has two local minimum points A and B. It is thought that this was because the multilayer chip 10 has the first capacity region 10a and the second capacity region 10b of which the electrostatic capacity was different from each other. When there are the two local minimum points A and B, the multilayer ceramic capacitor 100 can absorb noise of two frequencies according to the local minimum points A and B.

(35) Next, the present inventor performed an experiment in order to confirm whether the same tendency as FIG. 4 can be seen even if the multilayer ceramic capacitor 100 is turned upside down and is mounted on the wiring substrate 30.

(36) FIG. 5 illustrates a cross sectional view of a sample used for the experiment. As illustrated in FIG. 5, in the experiment, the multilayer ceramic capacitor 100 was turned upside down, in comparison to FIG. 3. The first capacity region 10a was under the second capacity region 10b. And the first capacity region 10a was mounted on the wiring substrate 30. As well as FIG. 3, a high frequency signal was input to the multilayer ceramic capacitor 100 via the wiring layer 31. And a graph of a relationship between the frequency and the impedance was obtained. FIG. 6 illustrates the graph.

(37) As well as FIG. 4, a solid line of FIG. 6 indicates the impedance in which the contact resistance between the external electrodes 20a and 20b and the wiring layer 31 was ignored. A dotted line indicates a resistance component. For example, the resistance component is a contact resistance between the external electrodes 20a and 20b and the wiring layer 31 or a resistance component of a capacitor.

(38) As illustrated in FIG. 6, the graph has only one local minimum point A. Therefore, it is apparent that the multilayer ceramic capacitor 100 cannot absorb noise of two frequencies.

(39) In this manner, the present inventor has found that when the second capacity region 10b is mounted on the wiring substrate 30, the multilayer ceramic capacitor 100 has two resonance frequencies, and when the first capacity region 10a is mounted on the wiring substrate 30, the multilayer ceramic capacitor 100 has one resonance frequency. With respect to the fact, the present inventors reviewed the following matters.

(40) FIG. 7 illustrates an equivalent circuit diagram of the multilayer ceramic capacitor 100. As illustrated in FIG. 7, the first capacity region 10a has a circuit structure which is equivalent to a case where a first inductance L.sub.1 is connected to the first electrostatic capacity C.sub.1 in series. The first inductance L.sub.1 is generated in a current path from the internal electrode layer 12 or the wiring layer 31 (illustrated in FIG. 3) to the first capacity region 10a.

(41) In this manner, the second capacity region 10b has a circuit structure which is equivalent to a case where a second inductance L.sub.2 is connected to the second electrostatic capacity C.sub.2 in series. The second inductance L.sub.2 is generated in a current path from the internal electrode layer 12 or the wiring layer 31 (illustrated in FIG. 3) to the second capacity region 10b.

(42) The equivalent circuit of the multilayer ceramic capacitor 100 is a circuit in which a contact resistance R is, in series, connected to a circuit in which the first capacity region 10a and the second capacity region 10b are connected in parallel with each other. The contact resistance R is a resistance generated between the wiring layer 31 and the external electrode 20a and 20b. In this case, impedance Za of the first capacity region 10a is expressed by the following formula (1).

(43) $\begin{array}{cc}{Z}_a=\frac{1}{j\omega C_1}+j\omega L_1& \left(1\right)\end{array}$

(44) In the formula (1), “ω” indicates an angular frequency of a high frequency signal. “j” indicates an imaginary unit. In this manner, impedance Zb of the second capacity region 10b is expressed by the following formula (2).

(45) $\begin{array}{cc}{Z}_b=\frac{1}{j\omega C_2}+j\omega L_2& \left(2\right)\end{array}$

(46) Impedance Z of the whole of the equivalent circuit of FIG. 7 is expressed by the following formula (3).

(47) $\begin{array}{cc}.Math.Z.Math.=\sqrt{{\left(R_1+\frac{Z_a.Math.Z_b}{Z_a+Z_b}\right)}^2}& \left(3\right)\end{array}$

(48) As shown in the formulas (1) to (3), the impedance Z of the whole of the multilayer ceramic capacitor 100 is determined by the first electrostatic capacity C.sub.1, the second electrostatic capacity C.sub.2, the first inductance L.sub.1 and the second inductance L.sub.2. Table 1 shows an example of each value of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2.

(49) TABLE-US-00001 TABLE 1 data No R (Ω) L.sub.1 (H) C.sub.1 (F) L.sub.2 (H) C.sub.2 (F) 1 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 1.4 × 10.sup.−9 1.0 × 10.sup.−8

(50) Each value of Table 1 is selected in order to obtain the impedance Z from the formula (3).

(51) The present inventor has obtained a graph indicating a relationship between the frequency of the high frequency signal and the impedance Z by substituting each value of Table 1 to the formula (3). FIG. 8 illustrates the graph. As illustrated in FIG. 8, the graph has two local minimum points A and B. Thus, as illustrated in FIG. 3, the case where two local minimum points appear is reproduced, as well as the case where the first capacity region 10a is mounted on the wiring substrate 30.

(52) Next, a description will be given of a situation in which only one local minimum point appears as illustrated in FIG. 6. A resonance frequency is a frequency at which impedance is zero. It is therefore possible to calculate a resonance frequency of the first capacity region 10a from the formula (4).

(53) $\begin{array}{cc}{Z}_a=0=\frac{1}{j\omega C_1}+j\omega L_1& \left(4\right)\end{array}$

(54) When a solution of ω is calculated from the formula (4), the following formula (5) is obtained.

(55) $\begin{array}{cc}\omega =\sqrt{\frac{1}{C_1.Math.L_1}}& \left(5\right)\end{array}$

(56) In this manner, the resonance frequency of the second capacity region 10b is calculated from the following formula (6).

(57) $\begin{array}{cc}{Z}_b=0=\frac{1}{j\omega C_2}+j\omega L_2& \left(6\right)\end{array}$

(58) When a solution of ω is calculated from the formula (6),the following formula (7) is obtained.

(59) $\begin{array}{cc}\omega =\sqrt{\frac{1}{C_2.Math.L_2}}& \left(7\right)\end{array}$

(60) It is thought that each of local minimum points of the resonance frequency of the multilayer ceramic capacitor 100 corresponds to each of the local minimum points of the first capacity region 10a and the second capacity region 10b. And it is thought that when the local minimum points coincide with each other, the number of the resonance frequency of the multilayer ceramic capacitor 100 is one. And so, it is assumed that the value of the formula (5) is equal to the value of the formula (7), as expressed by the following formula (8).

(61) $\begin{array}{cc}\sqrt{\frac{1}{C_1.Math.L_1}}=\sqrt{\frac{1}{C_2.Math.L_2}}& \left(8\right)\end{array}$

(62) Thus, the following formula (9) is obtained.
C.sub.1.Math.L.sub.1=C.sub.2.Math.L.sub.2  (9)

(63) When the both sides of the formula (9) are divided by C.sub.2.Math.L.sub.2, the following formula (10) is obtained.

(64) $\begin{array}{cc}\frac{C_1.Math.L_1}{C_2.Math.L_2}=1& \left(10\right)\end{array}$

(65) In accordance with the formula (10), it is thought that when the ratio of C.sub.1.Math.L.sub.1 with respect to C.sub.2.Math.L.sub.2 gets closer to 1, the resonance frequency of the first capacity region 10a gets closer to the resonance frequency of the second capacity region 10b and the number of the resonance frequency of the multilayer ceramic capacitor 100 is one. In order to confirm the hypothesis, the present inventor adjusts the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 so the ratio of C.sub.1.Math.L.sub.1 with respect to C.sub.2.Math.L.sub.2 becomes 1, as shown in the data No. 2 of Table 2.

(66) TABLE-US-00002 TABLE 2 data No R (Ω) L.sub.1 (H) C.sub.1 (F) L.sub.2 (H) C.sub.2 (F) (C.sub.1 .Math. L.sub.1)/(C.sub.2 .Math. L.sub.2) 1 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 1.4 × 10.sup.−9 1.0 × 10.sup.−8 357 2 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 1.0 × 10.sup.−8 1.0

(67) The data No. 1 of Table 2 is the same as the data of Table 1.

(68) FIG. 9 illustrates a graph indicating a relationship between the frequency of the high frequency signal and the impedance Z obtained by substituting each value of No. 2 of Table 2 into the formula (3). As illustrated in FIG. 9, when the ratio of C.sub.1.Math.L.sub.1 with respect to C.sub.2.Math.L.sub.2 is 1, only one local minimum point appears. And the same situation as FIG. 6 is reproduced.

(69) From the results, it is determined whether the multilayer ceramic capacitor 100 has two resonance frequencies, by determining whether the ratio of C.sub.1.Math.L.sub.1 with respect to C.sub.2.Math.L.sub.2 is close to 1 or not.

(70) Next, a description will be given of the first inductance L.sub.1 of the first capacity region 10a and the second inductance L.sub.2 of the second capacity region 10b.

(71) FIG. 10A illustrates a cross sectional view for describing the first inductance L.sub.1 of the first capacity region 10a and the second inductance L.sub.2 of the second capacity region 10b in a case where the second capacity region 10b is mounted on the wiring substrate 30. In FIG. 10A, an interval between a lower face 10x of the multilayer chip 10 facing with the wiring substrate 30 and the bottom internal electrode layer 12 of the first capacity region 10a is t.sub.1. An interval between the bottom internal electrode layer 12 of the second capacity region 10b and the lower face 10x is t.sub.2.

(72) Moreover, the number of the internal electrode layer 12 in the first capacity region 10a is s.sub.1. The number of the internal electrode layer 12 in the second capacity region 10b is s.sub.2. It is known that an inductance L of a conductor having a circular cross section having a diameter of d (m) and having a length l (m) is expressed by the following formula (11).

(73) 0$\begin{array}{cc}L=1\left(\ln \frac{4l}{d}-1\right).Math.200\times {10}^{-9}& \left(11\right)\end{array}$

(74) As indicated in the formula (11), the inductance L is approximately proportional to the length l of the conductor.

(75) A part of the first capacity region 10a of which the current density is the highest is the bottom internal electrode layer 12 which is the closet to the wiring substrate 30 in the first capacity region 10a. It is thought that the first inductance L.sub.1 of the first capacity region 10a is proportional to the interval t.sub.1 which is a length of a current path to the bottom internal electrode layer 12, on the analogy of the formula (11). Moreover, it is thought that the first inductance L.sub.1 is proportional to a total area of all of the internal electrode layers 12 in the first capacity region 10a, on the analogy of the formula (11). Each area of the internal electrode layers 12 is approximately equal to each other. Therefore, a total area of all of the internal electrode layers 12 in the first capacity region 10a is proportional to the number s.sub.1 of the internal electrode layers 12 in the first capacity region 10a. And so, in the embodiment, the first inductance L.sub.1 of the first capacity region 10a is approximated by the following formula (12).
L.sub.1=α.Math.t.sub.1.Math.s.sub.1  (12)

(76) In this manner, the second inductance L.sub.2 of the second capacity region 10b is approximated by the following formula (13).
L.sub.2=α.Math.t.sub.2.Math.s.sub.2  (13)

(77) In the following formulas, there may be a case where a proportional constant α is 1 in the formula (12) and the formula (13). This is because the embodiment uses a ratio of the first inductance L.sub.1 and the second inductance L.sub.2, and the ratio does not depend on the proportional constant.

(78) FIG. 10b illustrates a cross sectional view for describing the first inductance L.sub.1 of the first capacity region 10a and the second inductance L.sub.2 of the second capacity region 10b in a case where the first capacity region 10a is mounted on the wiring substrate 30. In this case, it is also possible to calculate the first inductance L.sub.1 and the second inductance L.sub.2 in accordance with the formula (12) and the formula (13). When the first inductance L.sub.1 and the second inductance L.sub.2 of the formula (12) and the formula (13) are used, a right side of the formula (10) is expressed by the following formula (14).

(79) $\begin{array}{cc}\frac{C_1.Math.L_1}{C_2.Math.L_2}=\frac{C_1.Math.t_1.Math.s_1}{C_2.Math.t_2.Math.s_2}& \left(14\right)\end{array}$

(80) As indicated by the formula (14), the ratio of the C.sub.1.Math.L.sub.1 and C.sub.2.Math.L.sub.2 includes the parameters t.sub.1, t.sub.2, s.sub.1 and s.sub.2 of the multilayer ceramic capacitor 100. These parameters are used for designing the multilayer ceramic capacitor 100. The present inventor has reviewed a relationship between the frequency and the impedance of the multilayer ceramic capacitor 100 as follows, with use of the parameters for design.

(81) FIG. 11A and FIG. 11B schematically illustrate a first sample P1 and a second sample P2 used for the review. In the first sample P1 in FIG. 11A, the second capacity region 10b is mounted on the wiring substrate 30. On the other hand, in the second sample P2 of FIG. 11B, the first capacity region 10a is mounted on the wiring substrate 30. In this manner, although the first sample P1 and the second sample P2 have the same structure, a mounting direction to the wiring substrate 30 is different from each other between the first sample P1 and the second sample P2.

(82) The size of the first sample P1 is the same as that of the second sample P2. In the size, the length is 1.0±0.2 mm. The width is 0.5±0.2 mm. The height is 0.95±0.05 mm.

(83) Table 3 shows parameters t.sub.1, t.sub.2, s.sub.1 and s.sub.2 in the samples P1 and P2.

(84) TABLE-US-00003 TABLE 3 sample t.sub.1 (μm) t.sub.2 (μm) t.sub.1/t.sub.2 s.sub.1/s.sub.2 L.sub.1/L.sub.2 (C.sub.1 .Math. L.sub.1)/(C.sub.2 .Math. L.sub.2) P1 275 25 11.0 10.2 1.1 217 P2 40 680 0.06 10.2 0.006 1.2

(85) The data No. 3 and the data No. 4 of Table 4 are examples of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 achieving the same value of L.sub.1/L.sub.2 as that of Table 3.

(86) TABLE-US-00004 TABLE 4 data No R (Ω) L.sub.1 (H) C.sub.1 (F) L.sub.2 (H) C.sub.2 (F) (C.sub.1 .Math. L.sub.1)/(C.sub.2 .Math. L.sub.2) L.sub.1/L.sub.2 1 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 1.4 × 10.sup.−9 1.0 × 10.sup.−8 357 0.4 2 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 1.0 × 10.sup.−8 1.0 0.001 3 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 .sup. 4.6 × 10.sup.−10 5.0 × 10.sup.−8 217 1.1 4 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 8.6 × 10.sup.−8 5.0 × 10.sup.−8 1.2 0.006

(87) The data No. 1 and the data No. 2 of Table 4 are the same as those of Table 2. On the other hand, the data No. 3 is an example of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 such that the value of L.sub.1/L.sub.2 is equal to that of the first sample P1 of Table 3. The data No. 4 is an example of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 such that the value of L.sub.1/L.sub.2 is equal to that of the second sample P2 in Table 3.

(88) FIG. 12 illustrates a graph of a relationship between the frequency of the high frequency signal and the impedance Z obtained when each value of data No. 3 of Table 4 is substituted to the formula (3). As illustrated in FIG. 12, the graph has two local minimum points A and B. The same tendency as FIG. 4 is seen.

(89) FIG. 13 illustrates a graph of a relationship between the frequency of the high frequency signal and the impedance Z that are obtained in a case where each value of the data No. 4 of Table 4 is substituted to the formula (3). As illustrated in FIG. 13, a single local minimum point A appears in the graph. Therefore, the same situation of FIG. 6 is reproduced.

(90) From the results, it is apparent that the number of the local minimum point is reproduced by approximating the first inductance L.sub.1 and the second inductance L.sub.2 in accordance with the formula (12) and the formula (13), with respect to the multilayer ceramic capacitor 100.

(91) From the comparison among the result of FIG. 12, the result of FIG. 13 and Table 4, the number of the local minimum point may be one or two in accordance with the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) in Table 4. And so, a description will be given of a critical value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) at which the number of the local minimum point is changed from one to two will be reviewed.

(92) Table 5 shows values of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 used by the present inventor in order to find the critical value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2).

(93) TABLE-US-00005 TABLE 5 data No R (Ω) L.sub.1 (H) C.sub.1 (F) L.sub.2 (H) C.sub.2 (F) (C.sub.1 .Math. L.sub.1)/(C.sub.2 .Math. L.sub.2) L.sub.1/L.sub.2 1 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 1.4 × 10.sup.−9 1.0 × 10.sup.−8 357 0.4 2 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 1.0 × 10.sup.−8 1.0 0.001 3 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 .sup. 4.6 × 10.sup.−10 5.0 × 10.sup.−8 217 1.1 4 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 8.6 × 10.sup.−8 5.0 × 10.sup.−8 1.2 0.006 5 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 5.0 × 10.sup.−8 0.2 0.001 6 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−8 5.0 × 10.sup.−8 2.0 0.01

(94) The data No. 5 and the data No. 6 of Table 5 indicate the values of the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 which are thought to be around the critical point at which the number of the local minimum point is changed from one to two.

(95) FIG. 14 illustrates a graph of a relationship between the frequency of the high frequency signal and the impedance Z in a case where each value of the data No. 5 of Table 5 is substituted to the formula (3). The value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is 0.2 in the data No. 5. In this case, as illustrated in FIG. 14, another small local minimum point B appears near the local minimum point A.

(96) FIG. 15 illustrates a graph of a relationship between the frequency of the high frequency signal and the impedance Z obtained in a case where each value of the data No. 6 of Table 5 is substituted to the formula (3). In the data No. 6, the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is 2.0. In this case, as illustrated in FIG. 15, another local minimum point B appears near the local minimum point A.

(97) Therefore, it is apparent that two local minimum points appear even if the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is 0.2 or 2.0.

(98) The present inventor researched the critical value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) by using the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2 of Table 5. Table 6 shows the parameters C.sub.1, C.sub.2, L.sub.1 and L.sub.2.

(99) TABLE-US-00006 TABLE 6 data No R (Ω) L.sub.1 (H) C.sub.1 (F) L.sub.2 (H) C.sub.2 (F) (C.sub.1 .Math. L.sub.1)/(C.sub.2 .Math. L.sub.2) L.sub.1/L.sub.2 1 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 1.4 × 10.sup.−9 1.0 × 10.sup.−8 357 0.4 2 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 1.0 × 10.sup.−8 1.0 0.001 3 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 .sup. 4.6 × 10.sup.−10 5.0 × 10.sup.−8 217 1.1 4 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 8.6 × 10.sup.−8 5.0 × 10.sup.−8 1.2 0.006 5 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−7 5.0 × 10.sup.−8 0.2 0.001 6 5.0 × 10.sup.−3 5.0 × 10.sup.−10 1.0 × 10.sup.−5 5.0 × 10.sup.−8 5.0 × 10.sup.−8 2.0 0.01 7 5.0 × 10.sup.−3 1.0 × 10.sup.−10 1.0 × 10.sup.−6 .sup. 5.0 × 10.sup.−11 1.0 × 10.sup.−6 2.0 2.0 8 5.0 × 10.sup.−3 1.0 × 10.sup.−10 1.0 × 10.sup.−6 .sup. 2.5 × 10.sup.−10 1.0 × 10.sup.−6 0.4 0.4

(100) FIG. 16 illustrates a relationship between the frequency of the high frequency signal and the impedance Z obtained in a case where each value of the data No. 7 of Table 6 is substituted to the formula (3). In the data No. 7, the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is 2.0. In this case, as illustrated in FIG. 16, the two local minimum points A and B appeared.

(101) FIG. 17 illustrates a graph of a relationship between the frequency of the high frequency signal and the impedance Z obtained in a case where each value of the data No. 8 of Table 6 is substituted to the formula (3). In the data No. 8, the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is 0.4. In this case, as illustrated in FIG. 17, the two local minimum points A and B appear.

(102) From the results, it is apparent that the multilayer ceramic capacitor 100 has two resonance frequencies when the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) satisfies the formula (15).

(103) $\begin{array}{cc}\frac{C_1.Math.L_1}{C_2.Math.L_2}<0.5,\mathrm{or}1.9<\frac{C_1.Math.L_1}{C_2.Math.L_2}& \left(15\right)\end{array}$

(104) On the other hand, 0.5≤(C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2)≤1.9 is satisfied, the value of (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) gets closer to 1. In this case, as indicated by the formula (10) or as illustrated in FIG. 9, the number of the resonance frequency of the multilayer ceramic capacitor 100 is one.

(105) (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2)<0.5 or 1.9<(C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) is satisfied as mentioned above, in order to absorb the noise of the two frequencies of the multilayer ceramic capacitor 100.

(106) In the samples P1 and P2, the first electrostatic capacity C.sub.1 of the first capacity region 10a is 200 to 250 times as much as the second electrostatic capacity C.sub.2 of the second capacity region 10b. And, the value of C.sub.1/C.sub.2 is 200 to 250 or the like.

(107) When C.sub.1/C.sub.2=250 is satisfied in a first inequality of the formula (15) and C.sub.1/C.sub.2=200 is satisfied in a second inequality of the formula (15), the following formula (16) is obtained.

(108) $\begin{array}{cc}\frac{L_1}{L_2}<0.002,\mathrm{or}0.0095<\frac{L_1}{L_2}& \left(16\right)\end{array}$

(109) The formula (16) is inequality satisfied by L.sub.1/L.sub.2 when the value of C.sub.1/C.sub.2 is within 200 to 250. In the multilayer ceramic capacitor 100 in which the first electrostatic capacity C.sub.1 is 200 to 250 times as large as the second electrostatic capacity C.sub.2, two resonance frequencies appear when L.sub.1/L.sub.2 satisfies the formula (16).

(110) (Modified embodiment) In the above-mentioned embodiment, as illustrated in FIG. 2, the thicknesses of the dielectric layers 11 of the first capacity region 10a are different from those of the dielectric layers 11 of the second capacity region 10b. Thereby, the first electrostatic capacity C.sub.1 of the first capacity region 10a is larger than the second electrostatic capacity C.sub.2 of the second capacity region 10b.

(111) The structure is not limited. For example, a facing area of the internal electrode layers 12 next to each other may be changed. Thereby, the first electrostatic capacity C.sub.1 may be larger than the second electrostatic capacity C.sub.2.

(112) FIG. 18A and FIG. 18B schematically illustrate plan views of the facing area of the internal electrode layers 12. FIG. 18A schematically illustrates a plan view of a facing area X.sub.1 in the first capacity region 10a. FIG. 18B schematically illustrates a plan view of a facing area X.sub.2 in the second capacity region 10b.

(113) As illustrated in FIG. 18A and FIG. 18B, when the facing area X.sub.1 is larger than the facing area X.sub.2, the first electrostatic capacity C.sub.1 is larger than the second electrostatic capacity C.sub.2.

(114) In the above-mentioned embodiment, as illustrated in FIG. 2, the multilayer ceramic capacitor 100 has the two capacity regions (the first capacity region 10a and the second capacity region 10b). However, the number of the capacity regions is not limited to two. The multilayer ceramic capacitor 100 may have three or more of capacity regions.

(115) FIG. 19 illustrates a cross sectional view of the multilayer ceramic capacitor 100 having the first capacity region 10a, the second capacity region 10b and a third capacity region 10c. The third capacity region 10c has a structure in which each of the dielectric layers 11 and the internal electrode layers 12 are alternately stacked, as well as the first capacity region 10a or the second capacity region 10b. In the third capacity region 10c, at least one of the facing area of the internal electrode layers 12 next to each other and the thickness of the dielectric layer 11 is different from those of the first capacity region 10a and the second capacity region 10b. With the structure, the third capacity region 10c has a third electrostatic capacity C.sub.3 and a third inductance L.sub.3.

(116) In this case, two capacity regions are selected from the first capacity region 10a, the second capacity region 10b and the third capacity region 10c. And electrostatic capacities and inductances of the selected two capacity regions are referred to as C.sub.1, C.sub.2, L.sub.1 and L.sub.2. When (C.sub.1.Math.L.sub.1)/(C.sub.2.Math.L.sub.2) satisfies the formula (15), it is expected that the multilayer ceramic capacitor 100 has two resonance frequencies.

(117) Although the embodiments of the present invention have been described in detail, it is to be understood that the various change, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. In the embodiments, the multilayer ceramic capacitor is described as an example of ceramic electronic devices. However, the embodiments are not limited to the multilayer ceramic capacitor. For example, the embodiments may be applied to another electronic device such as varistor or thermistor.