The present disclosure is directed to providing a methacrylic resin composition and a molded article having excellent performances to allow light to be favorably transmitted and sufficiently diffused, and having good heat deformation resistance and long-term use property. A methacrylic resin composition includes 0.5 to 6 parts by mass of a light diffusing filler having an average particle diameter of 0.2 to 10 μm and 0.005 to 0.3 parts by mass of an ultraviolet absorber with respect to 100 parts by mass of a methacrylic resin, and has an intermediate point glass transition temperature of 105° C. or higher.

The present disclosure is directed to providing a methacrylic resin composition and a molded article having excellent performances to allow light to be favorably transmitted and sufficiently diffused, and having good heat deformation resistance and long-term use property. A methacrylic resin composition includes 0.5 to 6 parts by mass of a light diffusing filler having an average particle diameter of 0.2 to 10 μm and 0.005 to 0.3 parts by mass of an ultraviolet absorber with respect to 100 parts by mass of a methacrylic resin, and has an intermediate point glass transition temperature of 105° C. or higher.

A resin composition, including: an ethylene-vinyl acetate copolymer resin as a resin component; an imidazole compound, a phenol compound, and a thioether compound as an antioxidant; and a bromine compound and an antimony compound as a flame retardant, wherein the resin composition has a content of the imidazole compound of 14 to 24 parts by mass, a content of the phenol compound of 1.0 to 2.0 parts by mass, a content of the thioether compound of 0.3 to 0.9 parts by mass, a content of the bromine compound of 15 to 30 parts by mass, and a content of the antimony compound of 5 to 15 parts by mass with respect to 100 parts by mass of a total content of the resin component in the resin composition.

Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 μm or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

The method of producing an optical material of the present disclosure includes a step of mixing a resin monomer for an optical material and an additive to prepare a polymerizable composition for an optical material having a hue specified by L* of 70 or more b* of from −30 to 10 in the CIE 1976 (L*, a*, b*) color space when measured at a thickness of 10 mm, and a step of polymerizing and curing the polymerizable composition for an optical material.

The method of producing an optical material of the present disclosure includes a step of mixing a resin monomer for an optical material and an additive to prepare a polymerizable composition for an optical material having a hue specified by L* of 70 or more b* of from −30 to 10 in the CIE 1976 (L*, a*, b*) color space when measured at a thickness of 10 mm, and a step of polymerizing and curing the polymerizable composition for an optical material.

The method of producing an optical material of the present disclosure includes a step of mixing a resin monomer for an optical material and an additive to prepare a polymerizable composition for an optical material having a hue specified by L* of 70 or more b* of from −30 to 10 in the CIE 1976 (L*, a*, b*) color space when measured at a thickness of 10 mm, and a step of polymerizing and curing the polymerizable composition for an optical material.

The present invention provides a resin composition which has an infrared ray-blocking ability with excellent moist heat resistance while maintaining high transparency. The resin composition of the present invention contains, relative to (A) 100 parts by weight of a polycarbonate resin (component A), (B) 0.0001 to 0.2 part by weight of composite tungsten oxide fine particles (component B) represented by the general formula: MxWyOz (wherein M represents at least one element selected from H, He, an alkali metal, an alkaline earth metal, a rare earth element, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, W represents tungsten, O represents oxygen, 0.001≤x/y≤1, and 2.2≤z/y≤3.0), (C) 0.0001 to 0.1 part by weight of an epoxy resin (component C), and (D) 0.001 to 0.5 part by weight of a release agent which is a fatty acid ester containing as a main component a full ester of a fatty acid and a polyhydric alcohol (component D).

The present invention provides a resin composition which has an infrared ray-blocking ability with excellent moist heat resistance while maintaining high transparency. The resin composition of the present invention contains, relative to (A) 100 parts by weight of a polycarbonate resin (component A), (B) 0.0001 to 0.2 part by weight of composite tungsten oxide fine particles (component B) represented by the general formula: MxWyOz (wherein M represents at least one element selected from H, He, an alkali metal, an alkaline earth metal, a rare earth element, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, W represents tungsten, O represents oxygen, 0.001≤x/y≤1, and 2.2≤z/y≤3.0), (C) 0.0001 to 0.1 part by weight of an epoxy resin (component C), and (D) 0.001 to 0.5 part by weight of a release agent which is a fatty acid ester containing as a main component a full ester of a fatty acid and a polyhydric alcohol (component D).

A thermoplastic polyurethane resin suitable for melt spinning is formed from a reaction mixture via a polymerization reaction. The reaction mixture includes an isocyanate component and a polyol component. The polyol component includes a first polyol that has a first number average molecular weight and a second polyol that has a second number average molecular weight. The first number average molecular weight is between 1,000 g/mol and 1,500 g/mol, and the second number average molecular weight is between 2,500 g/mol and 3,000 g/mol. One resin component formed by the first polyol via the polymerization reaction is defined as a low melting point segment and correspondingly has a first melting point between 170° C. and 185° C. Another resin component formed by the second polyol via the polymerization reaction is defined as a high melting point segment and correspondingly has a second melting point between 195° C. and 210° C.