A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) which contains a repeating unit (a1) having a specific ring structure, a compound (B) which generates an acid by an irradiation with an actinic ray or a radiation, and a specific compound (C) which is decomposed by an irradiation with an actinic ray or a radiation so that an acid-trapping property is lowered; an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.

A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar.sup.1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R.sup.1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L.sup.1 represents a divalent linking group; R.sup.2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X.sup.+ represents a monovalent radiation-sensitive onium cation.

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The disclosure provides an improved process for preparing oleophobic fluoropolymers. The resulting fluropolymers were found to be effective in imparting hydrophobic and oleophobic properties to porous polymeric membranes such as PTFE. The treated PTFE membrane can reach an oleophobic level of 6 or above, (according to the AATCC-118-1997 oil repellency test method) with a low air flux loss.

The disclosure provides an improved process for preparing oleophobic fluoropolymers. The resulting fluropolymers were found to be effective in imparting hydrophobic and oleophobic properties to porous polymeric membranes such as PTFE. The treated PTFE membrane can reach an oleophobic level of 6 or above, (according to the AATCC-118-1997 oil repellency test method) with a low air flux loss.

A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R.sup.1 represents a hydrogen atom, or the like; R.sup.2 represents a hydrogen atom or the like; and R.sup.3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar.sup.1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R.sup.4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R.sup.5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.

##STR00001##

A polymeric surfactant for use in chemical enhanced oil recovery, including a terpolymer of a first non-ionic monomer, a second non-ionic monomer, and an ionic monomer, the first non-ionic monomer being a hydrophilic monomer and the second non-ionic monomer being a hydrophobic monomer, the ionic monomer being in a lower proportion than the first and second non-ionic monomers. A method of preparation of polymeric surfactants.

A polymeric surfactant for use in chemical enhanced oil recovery, including a terpolymer of a first non-ionic monomer, a second non-ionic monomer, and an ionic monomer, the first non-ionic monomer being a hydrophilic monomer and the second non-ionic monomer being a hydrophobic monomer, the ionic monomer being in a lower proportion than the first and second non-ionic monomers. A method of preparation of polymeric surfactants.