A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.

The present invention relates to a flash memory cell with only four terminals and decoder circuitry for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.

A memory array that includes a plurality of memory blocks and a plurality of source switches is introduced. Each of the source switches corresponds to one of the memory blocks, and each of the source switches is coupled to a common source line of the corresponding one of the memory blocks. A selected source switch, which corresponds to a selected memory block among the memory blocks for a program operation, is configured to bias the common source line of the selected memory block to a reference voltage during a program period of the program operation. An unselected source switch, which corresponds to an unselected memory block among the memory blocks for the program operation, is configured to float the common source line of the unselected memory block during the program period of the program operation.

The present invention relates to a flash memory cell with only four terminals and a high voltage row decoder for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.

A disturb management technique for a non-volatile memory including first and second memory cells includes programming the first memory cell by applying a first voltage to a first word line coupled to the first memory cell and a second voltage to a terminal, such as a source terminal, shared by the first memory cell and the second memory cell. A non-zero third voltage having the same sign as the second voltage is applied to a second word line coupled to the second memory cell. The applied non-zero third voltage reduces a tunnel current across a gate oxide that insulates the second word line from a substrate of the second memory cell. This results in the second memory cell having a lower likelihood of being disturbed when programming the first memory cell.

A memory device and method including a semiconductor substrate with memory and logic device areas. A plurality of memory cells are formed in the memory area, each including first source and drain regions with a first channel region therebetween, a floating gate disposed over a first portion of the first channel region, a control gate disposed over the floating gate, a select gate disposed over a second portion of the first channel region, and an erase gate disposed over the source region. A plurality of logic devices formed in the logic device area, each including second source and drain regions with a second channel region therebetween, and a logic gate disposed over the second channel region. The substrate upper surface is recessed lower in the memory area than in the logic device area, so that the taller memory cells have an upper height similar to that of the logic devices.

A nonvolatile memory device includes a nonvolatile memory cell, a sensing circuit coupled between a sensing input line coupled to a bit line of the nonvolatile memory cell and a sensing output line, a sensing output grounding portion fixing an output signal of the sensing circuit at a low level if the output signal of the sensing circuit has a low level, and a bit line grounding portion fixing a bit line voltage at a ground voltage if the output signal of the sensing circuit is fixed at a low level.

Disclosed herein are related to a memory device including a memory cell and a bias supply circuit providing a bias voltage to the memory cell. In one aspect, the bias supply circuit includes a bias memory cell coupled to the memory cell, where the bias memory cell and the memory cell may be of a same semiconductor conductivity type. The memory cell may include at least two gate electrodes, and the bias memory cell may include at least two gate electrodes. In one configuration, the bias memory cell includes a drain electrode coupled to one of the at least two gate electrodes of the bias memory cell. In this configuration, the bias voltage provided to the memory cell can be controlled by regulating or controlling current provided to the drain electrode of the bias memory cell.

Numerous embodiments are disclosed for converting neuron current output by a vector-by-matrix multiplication (VMM) array into neuron current-based time pulses and providing such pulses as an input to another VMM array within an artificial neural network. Numerous embodiments are disclosed for converting the neuron current-based time pulses into analog current or voltage values if an analog input is needed for the VMM array.

For erasing four-terminal semiconductor Non-Volatile Memory (NVM) devices, we apply a high positive voltage bias to the control gate with source, substrate and drain electrodes tied to the ground voltage for moving out stored charges in the charge storage material to the control gate. For improving erasing efficiency and NVM device endurance life by lowering applied voltage biases and reducing the applied voltage time durations, we engineer the lateral impurity profile of the control gate near dielectric interface such that tunneling occurs on the small lateral region of the control gate near the dielectric interface. We also apply the non-uniform thickness of coupling dielectric between the control gate and the storage material for the NVM device such that the tunneling for the erase operation occurs within the small thin dielectric areas, where the electrical field in thin dielectric is the strongest for tunneling erase operation.