An amplifier for converting a single-ended input signal to a differential output signal. The amplifier comprises a first transistor, a second transistor, a third transistor and a fourth transistor. The first transistor, configured in common-source or common-emitter mode, receives the single-ended input signal and generates a first part of the differential output signal. The second transistor, also configured in common-source or common-emitter mode, generates a second part of the differential output signal. The third and fourth transistors are capacitively cross-coupled. The amplifier further comprises inductive degeneration such that a source or emitter of the first transistor is connected to a first inductor and a source or emitter of the second transistor is connected to a second inductor.

A circuit arrangement is provided which includes an array of stages for photon counting current to voltage conversion. Each stage includes a tunable operational transconductance amplifier and a feedback network forming a feedback loop of the operational transconductance amplifier. Each stage is configured to provide an output signal as a function of an input signal that is provided to the amplifier input of the operational transconductance amplifier, wherein the input signal comprises one or more current pulses and the output signal comprises one or more voltage pulses. With the tunable operational transconductance amplifier the transconductance of a stage can be tuned so that differences in peaking time and gain are avoided. Furthermore, an imaging device and a method for operating a circuit arrangement are provided.

A shaper circuit includes a first amplifier including an input and an output, the input being configured to receive an input signal, which includes one or more current pulses, a feedback component coupled to the output and to the input of the first amplifier thereby forming a feedback loop of the first amplifier, and an RC component coupled to the output of the first amplifier and to a reference potential terminal. Therein the shaper circuit is configured to provide an output signal as a function of the input signal, the output signal including one or more voltage pulses, and the RC component is configured to largely cancel a low frequency pole of the feedback loop of the first amplifier.

High-performance radio frequency analog-to-digital converters (RF ADCs) demand high bandwidth, high linearity, and low noise input amplifiers. A Class-AB amplifier, including common-gate transistor devices and common-source transistor devices operating in parallel, offers high bandwidth and high linearity, while offering lower power operation when compared to Class-A amplifiers. The Class-AB amplifier can be followed by a Class-AB unity gain buffer comprising common-source transistor devices to provide additional isolation for the RF ADC from the circuitry preceding the Class-AB amplifier.

A power amplifier can include an input stage that includes an amplifying transistor having an input node and an output node, such that a signal at the input node has a first power level and an amplified signal at the output node has a second power level. The power amplifier can further include a bias circuit configured to provide a bias signal to the amplifying transistor, and a feedback circuit that couples the output node of the amplifying transistor to the input node of the amplifying transistor. The feedback circuit can include a resistance and a capacitance arranged in series. The power amplifier can further include a gain compensation circuit implemented relative to the input stage such that the second power level is compensated for a variation in temperature associated with the power amplifier.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

Provided is a sensor interface including a first cantilever beam bundle including at least one resonator and a first output terminal, a second cantilever beam bundle including at least one resonator and a second output terminal, and a differential amplifier including a first input terminal electrically connected to the first output terminal of the first cantilever beam bundle and a second input terminal electrically connected to the second output terminal of the second cantilever beam bundle.

High-performance radio frequency analog-to-digital converters (RF ADCs) demand high bandwidth, high linearity, and low noise input amplifiers. A Class-AB amplifier, including common-gate transistor devices and common-source transistor devices operating in parallel, offers high bandwidth and high linearity, while offering lower power operation when compared to Class-A amplifiers. The Class-AB amplifier can be followed by a Class-AB unity gain buffer comprising common-source transistor devices to provide additional isolation for the RF ADC from the circuitry preceding the Class-AB amplifier.

An amplifier for converting a single-ended input signal to a differential output signal. The amplifier comprises a first transistor, a second transistor, a third transistor and a fourth transistor. The first transistor, configured in common-source or common-emitter mode, receives the single-ended input signal and generates a first part of the differential output signal. The second transistor, also configured in common-source or common-emitter mode, generates a second part of the differential output signal. The third and fourth transistors are capacitively cross-coupled. The amplifier further comprises inductive degeneration such that a source or emitter of the first transistor is connected to a first inductor and a source or emitter of the second transistor is connected to a second inductor.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.