A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.

A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

A dielectric fluid is provided comprising an oil and one or more compounds selected from the group consisting of phosphite compounds. It has been discovered that addition of one or more compounds selected from the group consisting of phosphite compounds to dielectric fluids comprising oil impart a stabilizing effect that reduces, inhibits or prevents formation of stray gases in the dielectric fluid during ordinary use.

A dielectric fluid is provided comprising an oil and one or more compounds selected from the group consisting of phosphite compounds. It has been discovered that addition of one or more compounds selected from the group consisting of phosphite compounds to dielectric fluids comprising oil impart a stabilizing effect that reduces, inhibits or prevents formation of stray gases in the dielectric fluid during ordinary use.

A dielectric fluid is provided comprising a natural bio-sourced oil and one or more compounds selected from the group consisting of phosphite compounds. It has been discovered that addition of one or more compounds selected from the group consisting of phosphite compounds to dielectric fluids comprising oil impart a stabilizing effect that reduces, inhibits or prevents formation of stray gases in the dielectric fluid during ordinary use.

A dielectric fluid is provided comprising a natural bio-sourced oil and one or more compounds selected from the group consisting of phosphite compounds. It has been discovered that addition of one or more compounds selected from the group consisting of phosphite compounds to dielectric fluids comprising oil impart a stabilizing effect that reduces, inhibits or prevents formation of stray gases in the dielectric fluid during ordinary use.

Aspects generally relate to multilayer capacitor structures formed in vias in a substrate of an integrated circuit. The multilayer cylindrical capacitor includes multiple cylindrical conductive layers formed in the via and separated by multiple cylindrical insulating layers between the plurality of cylindrical conductive layers. The cylindrical conductive layers form plates of the multilayer cylindrical capacitor.

Aspects generally relate to multilayer capacitor structures formed in vias in a substrate of an integrated circuit. The multilayer cylindrical capacitor includes multiple cylindrical conductive layers formed in the via and separated by multiple cylindrical insulating layers between the plurality of cylindrical conductive layers. The cylindrical conductive layers form plates of the multilayer cylindrical capacitor.

A back-end-of-the-line (BEOL) metal-insulator-metal (MIM) capacitor is provided that includes three electrode plates in which the first electrode plate of the MIM capacitor is an electrically conductive interconnect structure embedded in a first interconnect dielectric material layer. The other two electrode plates are located in a second interconnect dielectric material layer that is located above the first interconnect dielectric material layer. A first contact structure is present in the second interconnect dielectric material layer and contacts a surface of the first interconnect dielectric material layer, wherein the first contact structure passes through the second electrode plate. A second contact structure is also present in the second interconnect dielectric material layer and contacts a surface of the first electrode plate, wherein the second contact structure passes through the third electrode plate. Capacitor dielectric materials are located between each of the electrode plates.

A back-end-of-the-line (BEOL) metal-insulator-metal (MIM) capacitor is provided that includes three electrode plates in which the first electrode plate of the MIM capacitor is an electrically conductive interconnect structure embedded in a first interconnect dielectric material layer. The other two electrode plates are located in a second interconnect dielectric material layer that is located above the first interconnect dielectric material layer. A first contact structure is present in the second interconnect dielectric material layer and contacts a surface of the first interconnect dielectric material layer, wherein the first contact structure passes through the second electrode plate. A second contact structure is also present in the second interconnect dielectric material layer and contacts a surface of the first electrode plate, wherein the second contact structure passes through the third electrode plate. Capacitor dielectric materials are located between each of the electrode plates.