Exemplary embodiments provide a complex device including a laminate and two or more functional layers disposed in the laminate and having functions different from each other, wherein each of the two or more functional layers contains at least a portion of a material of another functional layer adjacent thereto, and an electronic device including the same.

A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.

A capacitor that includes a lower common electrode having a first region and a second region, a first upper electrode opposing the first region, a first dielectric layer between the first region and the first upper electrode, a second upper electrode located in a layer in which the first upper electrode is located and opposing the second region, a second dielectric layer between the second region and the second upper electrode, a first connection electrode electrically connected to the first upper electrode, a second connection electrode located in a layer in which the first connection electrode is located and electrically connected to the second upper electrode, and auxiliary electrodes located in a layer different from a layer in which the lower common electrode is located and that connect the first region and the second region of the lower common electrode.

A capacitor that includes a lower common electrode having a first region and a second region, a first upper electrode opposing the first region, a first dielectric layer between the first region and the first upper electrode, a second upper electrode located in a layer in which the first upper electrode is located and opposing the second region, a second dielectric layer between the second region and the second upper electrode, a first connection electrode electrically connected to the first upper electrode, a second connection electrode located in a layer in which the first connection electrode is located and electrically connected to the second upper electrode, and auxiliary electrodes located in a layer different from a layer in which the lower common electrode is located and that connect the first region and the second region of the lower common electrode.

An electronic component includes a component base body and first and second outer electrodes covering respective end faces of the component base body. The component base body includes an element main body and a magnetic body portion covering the element main body. The element main body includes a linear inner conductor, a dielectric layer covering the periphery of part of the inner conductor, and a conductor layer formed to cover the dielectric layer.

An electronic component includes a component base body and first and second outer electrodes covering respective end faces of the component base body. The component base body includes an element main body and a magnetic body portion covering the element main body. The element main body includes a linear inner conductor, a dielectric layer covering the periphery of part of the inner conductor, and a conductor layer formed to cover the dielectric layer.

The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.

A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.