A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.

A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.

Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.

Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.

A device and process for the production and transfer of heating and cooling power are described, in which a resonant electric circuit having at least one capacitor with a dielectric of electrocaloric material connected to an inductor is used. The resonant circuit comprises a variable electrical power supply section with a working frequency corresponding to the resonance frequency of the circuit.

Aspects generally relate to a capacitor formed by a first conductive plate and a second conductive plate with an insulating material located between the first and second conductive plates. A third conductive plate is coupled to the second conductive plate, and a size or an overlap of the third conductive layer to the insulating layer and first conductive plate are adjusted to achieve a desired overall capacitance value of the capacitor.

Aspects generally relate to a capacitor formed by a first conductive plate and a second conductive plate with an insulating material located between the first and second conductive plates. A third conductive plate is coupled to the second conductive plate, and a size or an overlap of the third conductive layer to the insulating layer and first conductive plate are adjusted to achieve a desired overall capacitance value of the capacitor.

A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.