A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface, and third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions. The insulating layer includes an oxide containing Ti. The dielectric layer includes one of BaTiO.sub.3, (Ba.sub.1-xCa.sub.x) TiO.sub.3 (0<x<1) , Ba(Ti.sub.1-yCa.sub.y)O.sub.3 (0<y<1) , (Ba.sub.1-xCa.sub.x) (Ti.sub.1-yZr.sub.y)O.sub.3 (0<x<1, 0<y<1) and Ba(Ti.sub.1-yZr.sub.y)O.sub.3 (0<y<1) as a main component.

A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1≥0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.

Provided is a capacitor module in which a plurality of film capacitor cells and a pair of bus bars are housed in a metal case to be integrated with a resin added in the metal case, and an electrical insulating film is formed at least on an inner surface of the metal case or each of outer surfaces of the pair of bus bars. The capacitor module is provided in an inverter device including an inverter circuit that converts DC power into AC power. The inverter device is provided in a motor module including an AC motor rotationally driven by AC power supplied from the inverter device, and the motor module is provided in a vehicle including an electric drive system.

Provided is a capacitor module in which a plurality of film capacitor cells and a pair of bus bars are housed in a metal case to be integrated with a resin added in the metal case, and an electrical insulating film is formed at least on an inner surface of the metal case or each of outer surfaces of the pair of bus bars. The capacitor module is provided in an inverter device including an inverter circuit that converts DC power into AC power. The inverter device is provided in a motor module including an AC motor rotationally driven by AC power supplied from the inverter device, and the motor module is provided in a vehicle including an electric drive system.