Patent classifications
H01G4/258
Capacitive voltage transformer
The present invention provides a capacitive voltage transformer, including: a capacitive voltage-dividing component and an electromagnetic unit. The capacitive voltage-dividing component comprises: one or more levels of stacks, and each stack is a coupling capacitor. The coupling capacitor includes: an upper cover plate, a lower cover plate, an insulating sleeve, a capacitor core, squirrel cage electrodes, volume matching devices, a high voltage lead, and a low voltage lead. The lowermost coupling capacitor is provided with a medium voltage lead and a lead terminal. The low voltage lead of the lowermost coupling capacitor is led out through a low-voltage leading-out tube arranged in the lead terminal, and the medium voltage lead of the lowermost coupling capacitor is led out through a medium-voltage leading-out post arranged in the lead terminal. The medium-voltage leading-out post passes through and out of the low-voltage leading-out tube and is arranged coaxially with the low-voltage leading-out tube.
Capacitive voltage transformer
The present invention provides a capacitive voltage transformer, including: a capacitive voltage-dividing component and an electromagnetic unit. The capacitive voltage-dividing component comprises: one or more levels of stacks, and each stack is a coupling capacitor. The coupling capacitor includes: an upper cover plate, a lower cover plate, an insulating sleeve, a capacitor core, squirrel cage electrodes, volume matching devices, a high voltage lead, and a low voltage lead. The lowermost coupling capacitor is provided with a medium voltage lead and a lead terminal. The low voltage lead of the lowermost coupling capacitor is led out through a low-voltage leading-out tube arranged in the lead terminal, and the medium voltage lead of the lowermost coupling capacitor is led out through a medium-voltage leading-out post arranged in the lead terminal. The medium-voltage leading-out post passes through and out of the low-voltage leading-out tube and is arranged coaxially with the low-voltage leading-out tube.
ELECTRONIC COMPONENT DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structurethe thermal expansion coefficient of the adjustment regionthe thermal expansion coefficient of the inner electrode.
ELECTRONIC COMPONENT DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structurethe thermal expansion coefficient of the adjustment regionthe thermal expansion coefficient of the inner electrode.
Multilayer electronic component including a composite body and method of manufacturing the same
A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.
Multilayer electronic component including a composite body and method of manufacturing the same
A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.
Capacitor for inverter of electrified vehicle and associated method
An electrified vehicle according to an exemplary aspect of the present disclosure includes, among other things, an electric machine electrically coupled to a battery pack through an inverter. Further, the inverter includes a capacitor with an internal cooling channel. A method is also disclosed.
Capacitor for inverter of electrified vehicle and associated method
An electrified vehicle according to an exemplary aspect of the present disclosure includes, among other things, an electric machine electrically coupled to a battery pack through an inverter. Further, the inverter includes a capacitor with an internal cooling channel. A method is also disclosed.
Power Capacitor Module With Cooling Arrangement
A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.
Power Capacitor Module With Cooling Arrangement
A power capacitor unit including a casing, first and second layers of capacitor elements wherein the first layer of capacitor elements are stacked on the second layer of capacitor elements, a first busbar assembly connected to the capacitor elements of the first layer, a second busbar assembly connected to the capacitor elements of the second layer, wherein the first busbar assembly and the second busbar assembly are arranged between the first layer of capacitor elements and the second layer of capacitor elements, a heat conducting layer provided between the first busbar assembly and the second busbar assembly, wherein the heat conducting layer is in thermal contact with the casing, thereby conducting heat from the first busbar assembly and the second busbar assembly to the casing, and wherein the casing is electrically insulated from the first busbar assembly and the second busbar assembly.