The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

The invention relates to an element in the shape of a sensor, an active electronic component, a switch, a circuit, or an electric conducting path for integration into a surrounding medium. The element is penetrable by the surrounding medium and has a porous, non-conductive substrate and at least one circuit trace made of conductive material present on the substrate. The openings of the substrate are open in an area of the circuit trace. The use and manufacture of the element are also provided.

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Provided is an electronic apparatus including an electronic part, a resin member that covers the electronic part, and a plurality of leads each electrically connected to the electronic part, the resin member including a first resin side surface facing one side in a first direction orthogonal to a thickness direction of the resin member, the plurality of leads including a plurality of first side exposed portions arranged along the first resin side surface, each of the plurality of first side exposed portions being exposed from the first resin side surface, each of the plurality of first side exposed portions including a first tapered portion becoming narrower toward the first resin side surface as viewed in the thickness direction, the first tapered portion including a first front surface that faces the same direction as the first resin side surface in the first direction and is flush with the first resin side surface.

Provided is an electronic apparatus including an electronic part, a resin member that covers the electronic part, and a plurality of leads each electrically connected to the electronic part, the resin member including a first resin side surface facing one side in a first direction orthogonal to a thickness direction of the resin member, the plurality of leads including a plurality of first side exposed portions arranged along the first resin side surface, each of the plurality of first side exposed portions being exposed from the first resin side surface, each of the plurality of first side exposed portions including a first tapered portion becoming narrower toward the first resin side surface as viewed in the thickness direction, the first tapered portion including a first front surface that faces the same direction as the first resin side surface in the first direction and is flush with the first resin side surface.

In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

A power semiconductor module includes an insulating substrate, a first conductive circuit pattern, a second conductive circuit pattern, a first semiconductor device, a second semiconductor device, a sealing member, and a first barrier layer. The sealing member seals the first semiconductor device, the second semiconductor device, the first conductive circuit pattern, and the second conductive circuit pattern. At least one of the first barrier layer and the sealing member includes a first stress relaxation portion. This configuration improves the reliability of the power semiconductor module.

The present invention provides a packaging method and a packaging structure for a cascode power electronic device, in which a hetero-multiple chip scale package is used to replace the traditional die bonding and wire bonding packaging method. The cascode power electronic device can reduce the inductance resistance and thermal resistance of the connecting wires and reduce the size of the package; and increase the switching frequency of power density. The chip scale package of the present invention uses more than one gallium nitride semiconductor die, more than one diode, and more than one metal oxide semiconductor transistor. The package structure can use TO-220, quad flat package or other shapes and sizes; the encapsulation process of the traditional epoxy molding compounds can be used in low-power applications; and the encapsulation process of ceramic material can be used in high-power applications.

An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.