A method for producing a soldered connection between at least two components is provided, in which the components are heated for melting a solder in a soldering area. The heating of the soldering area and/or the supply of solder to the soldering area is realized depending on the temperature which is determined by non-contact detection of heat radiation emitted from at least one temperature measurement zone of one of the components. In order to improve the method such that the emissivity of the at least one temperature measurement zone can be increased with high process reliability and with at most a slight adverse effect on the electrical connection between the electrical components, it is proposed that the at least one temperature measurement zone be locally heated for increasing its emissivity. Furthermore, an electrical plug-in connector for producing a soldered connection and use of such a plug-in connector are proposed.

An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.

A method of heat shrinking a protective sleeve onto an electrical connection includes an initial step of providing an electrical connection, such as between an electrical wire and an electrical termination device, and a protective sleeve having an inner surface and an outer surface. The inner surface of the protective sleeve has an adhesive material applied thereto and is disposed about the electrical connection. Thermal energy is applied to the outer surface of the protective sleeve so as to increase the temperature thereof. Either before, at the same time, or after this step, the temperature of some or all of the electrical connection disposed within the protective sleeve is increased, such as by induction heating. As a result, the protective sleeve shrinks onto the electrical connection, and the adhesive material forms a tight bond between the protective sleeve and the electrical connection.

A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.

A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90.

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.

A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (P.sub.x,y,z), and/or a first device acceleration (a.sub.x,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (P.sub.x,y,z), and/or a second device acceleration (a.sub.x,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (P.sub.x,y,z), and/or the device acceleration (a.sub.x,y,z).

A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

A method of heat shrinking a protective sleeve onto an electrical connection includes an initial step of providing an electrical connection, such as between an electrical wire and an electrical termination device, and a protective sleeve having an inner surface and an outer surface. The inner surface of the protective sleeve has an adhesive material applied thereto and is disposed about the electrical connection. Thermal energy is applied to the outer surface of the protective sleeve so as to increase the temperature thereof. Either before, at the same time, or after this step, the temperature of some or all of the electrical connection disposed within the protective sleeve is increased, such as by induction heating. As a result, the protective sleeve shrinks onto the electrical connection, and the adhesive material forms a tight bond between the protective sleeve and the electrical connection.