A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Disclosed in the present application are a base with an electronic element and a voice coil motor. The base with an electronic element comprises an electronic element, a metal circuit, a first plastic member, and a second plastic member. The metal circuit is connected to the electronic element and comprises a plurality of branches, a first end of the plurality of branches being connected on a one-to-one basis with pins of the electronic element; the first plastic member is positioned at the connecting position of the metal circuit and the electronic element, and is configured to integrally connect all of the branches of the metal circuit, and limit each branch of the metal circuit; and the second plastic member covers the metal circuit, a second end of the branches of the metal circuit furthest from the electronic element extending out from the second plastic member.

A tamper resistance wall structure on a circuit board includes a wall body formed of a laminated board, and a tamper detection wiring provided in the wall body. An outer through hole is provided in an outer surface of the wall body, which is a side surface away from a protective area on the circuit board, and is formed perpendicular to a longitudinal direction of the outer surface and perpendicular to the circuit board. An inner through hole is provided in an inner surface of the wall body, which is a side surface close to the protective area on the circuit board, and is formed perpendicular to a longitudinal direction of the inner surface and perpendicular to the circuit board. A recess is formed on the inner surface, and the inner through hole is formed in the recess and is a part of the tamper detection wiring.

A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.

Aspects of the current subject matter relate to methods and system for protecting a battery cell and/or a /pack of multiple battery cells serving as a power source of a vaporizer device from developing a short-circuit in a vaporizer device. In one aspect, a vaporizer device is provided. The vaporizer device may include a power source including a battery and a power source lead extending outward from a distal end of the battery. The vaporizer device may further include a printed circuit board (PCB) electrically coupled to the power source via the power source lead extending outward from the battery. The vaporizer device may further include an insulator at least partially surrounding the power source lead. The insulator may be mechanically coupled to at least one of the power source and the PCB.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

Disclosed is a system, a hearing device and a method for encapsulating one or more electronic components on a substrate. The method comprises providing a dam on the substrate, the dam is provided around the one or more electronic components, the dam comprises a dam material comprising an electrically conducting material. The method comprises providing a liquid fill encapsulation material within the dam on the substrate, the fill encapsulation material encapsulates the one or more electronic components, the fill encapsulation material is configured to solidify, the solidified fill encapsulating material comprises a first surface exposed to surroundings. The method comprises applying a cover material on the first surface of the solidified fill encapsulation material, the cover material comprising an electrically conducting material, whereby the one or more electronic components are encapsulated and electromagnetically shielded.

A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.