A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of the electrically conductive material, and the second pattern comprises at least a second pair of overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.

An inkjet ink that contains a functional particle having a BET-equivalent particle diameter of 50 to 1000 nm, a rheology-controlling particle having a BET-equivalent particle diameter of 4 to 40 nm, and an organic vehicle. The ink has a viscosity of 1 to 50 mPa.Math.s at a shear rate of 1000 s.sup.−1. At a shear rate of 0.1 s.sup.−1, the ink has a viscosity equal to or higher than a viscosity η calculated using the following equation: η=(D).sup.2×ρ/10.sup.4/2+80 [where η is the viscosity (mPa.Math.s) at a shear rate of 0.1 s.sup.−1, D is the BET-equivalent particle diameter (nm) of the functional particle, and ρ is the specific gravity of the functional particle].

A capacitive energy storage module (CESM) is provided under a floor panel of an electric vehicle. The CESM is a pack of capacitive energy storage cells (CESCs) which are themselves one or more capacitive energy storage devices (CESDs) comprising one or more metacapacitors. The CESM is arranged between a pair of right and left side members. The CESM is provided with a CESM case. The CESM case includes a tray member and cover member. Electric components are contained in the CESM case. Beam members made of metal are attached to the tray member. Both end portions of these beam members are supported by the side members. The tray member includes a resin and insert members made of metal provided inside the resin. The insert members include metal plates arranged on the front side and rear side of the electric components.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

Structures, including a capacitor, and methods for forming the structures are provided. One such structure may include a first conductor a second conductor above the first conductor, and a dielectric between the first conductor and the second conductor. The dielectric does not cover a portion of the first conductor; and the second conductor does not cover the portion of the first conductor not covered by the dielectric. Other structures and methods are disclosed.

Structures, including a capacitor, and methods for forming the structures are provided. One such structure may include a first conductor a second conductor above the first conductor, and a dielectric between the first conductor and the second conductor. The dielectric does not cover a portion of the first conductor; and the second conductor does not cover the portion of the first conductor not covered by the dielectric. Other structures and methods are disclosed.

An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

The present invention discloses an electrostatic energy storage device and a preparation method thereof. The device comprises at least one electrostatic energy storage unit, wherein each electrostatic energy storage unit is provided with a five-layer structure and comprises two metal film electrodes which form a capacitor, composite nano insulating film layers attached to the inner sides of the two metal film electrodes, and a ceramic nano crystalline film arranged between the composite nano insulating film layers. Based on the electrostatic parallel-plate induction capacitor principle, the metal film electrodes with a nano microstructure and the ceramic nano crystalline film sandwiched between the metal film electrodes and having an ultrahigh dielectric constant form an electrostatic induction plate capacitor to store electrostatic energy.

A capacitor structure and a method of manufacturing the same, and a memory are provided. The method includes the following operations. A substrate is provided. A first conductive structure with a shape of column is formed on the substrate. A second conductive structure is formed on the substrate. The second conductive structure surrounds the first conductive structure and is spaced with the first conductive structure. The first conductive structure and the second conductive structure together form a bottom electrode. A capacitor dielectric layer is formed. The capacitor dielectric layer covers the surface of the substrate and the surface of the bottom electrode. A top electrode covering the surface of the capacitor dielectric layer is formed.