An electrode foil having high capacitance per unit volume is provided. The electrode foil is an electrode foil for an electrolytic capacitor. The electrode foil is an electrode foil extending in a longitudinal direction and having a width direction orthogonal to the longitudinal direction, the electrode foil including an enlarged surface portion on a surface of the electrode foil, wherein a crack is formed in the enlarged surface portion in a direction oblique to the width direction.

To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

Some embodiments include an integrated assembly having first electrodes with top surfaces, and with sidewall surfaces extending downwardly from the top surfaces. The first electrodes are solid pillars. Insulative material is along the sidewall surfaces of the first electrodes. Second electrodes extend along the sidewall surfaces of the first electrodes and are spaced from the sidewall surfaces by the insulative material. Conductive-plate-material extends across the first and second electrodes, and couples the second electrodes to one another. Leaker-devices electrically couple the first electrodes to the conductive-plate-material and are configured to discharge at least a portion of excess charge from the first electrodes to the conductive-plate-material. Some embodiments include methods of forming integrated assemblies.

Some embodiments include an integrated assembly having first electrodes with top surfaces, and with sidewall surfaces extending downwardly from the top surfaces. The first electrodes are solid pillars. Insulative material is along the sidewall surfaces of the first electrodes. Second electrodes extend along the sidewall surfaces of the first electrodes and are spaced from the sidewall surfaces by the insulative material. Conductive-plate-material extends across the first and second electrodes, and couples the second electrodes to one another. Leaker-devices electrically couple the first electrodes to the conductive-plate-material and are configured to discharge at least a portion of excess charge from the first electrodes to the conductive-plate-material. Some embodiments include methods of forming integrated assemblies.

A film capacitor includes: a main body portion including dielectric films and metal films which are laminated; external electrodes; and an insulating layer disposed on a surface of the main body portion. The main body portion includes a pair of first faces, a pair of first side faces and a pair of second side faces, the first side faces and the second side faces connecting the first faces. The external electrodes are disposed on the first side faces, respectively. The metal films each include a plurality of first segments into which the metal films are divided by a plurality of first grooves extending in a first direction. The insulating layer is disposed between the main body portion and parts of the external electrodes within first regions which are regions of the first side faces that are distant from the second side faces, respectively, by a distance of P or less.

A film capacitor includes: a main body portion including dielectric films and metal films which are laminated; external electrodes; and an insulating layer disposed on a surface of the main body portion. The main body portion includes a pair of first faces, a pair of first side faces and a pair of second side faces, the first side faces and the second side faces connecting the first faces. The external electrodes are disposed on the first side faces, respectively. The metal films each include a plurality of first segments into which the metal films are divided by a plurality of first grooves extending in a first direction. The insulating layer is disposed between the main body portion and parts of the external electrodes within first regions which are regions of the first side faces that are distant from the second side faces, respectively, by a distance of P or less.

An integrated circuit (IC) includes a substrate and a first capacitor on the substrate. The first capacitor has a first width. A first dielectric layer is provided on a side of the first capacitor opposite the substrate. Further, a second capacitor is present on a side of the first dielectric layer opposite the first capacitor. The second capacitor has a second width that is smaller than the first width. The IC also has a second dielectric layer and a first metal layer. The second dielectric layer is on a side of the second capacitor opposite the first dielectric layer. The first metal layer is on a side of the second dielectric layer opposite the second capacitor.

A semiconductor assembly, comprising: a first semiconductor die including processing circuitry and pads, said first semiconductor die having a first surface and a second surface opposite the first surface; a second semiconductor die including memory circuitry and pads, said second semiconductor die being arranged on one of the first surface and the second surface of said first semiconductor die, and pads of said second semiconductor die being coupled to pads of said first semiconductor die; and at least a first capacitor having terminals, said first capacitor being arranged on one of the first surface and the second surface of said first semiconductor die and the terminals of said capacitor being coupled to pads of said first semiconductor die.

A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4.

A multilayer capacitor includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body to be connected to the internal electrode, wherein the dielectric layer includes a plurality of grains having a core-shell structure having a pore in a core, and the dielectric layer includes 20% to 40% of grains having two or less pores, among the plurality of grains.