A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

A capacitor module, in particular for use in an inverter of an electrical or a hybrid vehicle, said capacitor module comprising a housing, at least one capacitor element mounted in said housing and at least one busbar at least partially mounted into said housing and being electrically connected to said capacitor element, the housing comprising a bottom wall, a side wall and an upper wall, wherein said upper wall comprises a peripheral portion made of a sealing material and an central portion made of a thermal dissipation material, the thermal conductivity of the thermal dissipation material being bigger than the thermal conductivity of the sealing material.

A capacitor module, in particular for use in an inverter of an electrical or a hybrid vehicle, said capacitor module comprising a housing, at least one capacitor element mounted in said housing and at least one busbar at least partially mounted into said housing and being electrically connected to said capacitor element, the housing comprising a bottom wall, a side wall and an upper wall, wherein said upper wall comprises a peripheral portion made of a sealing material and an central portion made of a thermal dissipation material, the thermal conductivity of the thermal dissipation material being bigger than the thermal conductivity of the sealing material.

In an exemplary embodiment, a passive component which is a surface mounting component, includes: a substrate body 10 having insulation property; an internal conductor 50 embedded in the substrate body 10; and an external electrode 70 provided on the bottom face 12, which is the mounting surface, of the substrate body 10 and electrically connected to the internal conductor 50; wherein the external electrode 70 has a face 86 roughly parallel with the bottom face 12 of the substrate body 10, and a dome-shaped projection 80 that bulges, with reference to the roughly parallel face 86, away from the bottom face 12 of the substrate body 10. The passive component can prevent misalignment problems at mounting.

A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell casing comprises an open-ended ceramic container having a via hole providing an electrically conductive pathway extending through the container. A metal lid closes the open-end of the container. An electrode assembly housed inside the casing comprises an anode current collector deposited on an inner surface of the ceramic container in contact with the electrically conductive pathway in the via hole. An anode active material contacts the current collector and a cathode active material contacts the metal lid. A separator is disposed between the anode and cathode active materials. That way, the electrically conductive pathway serves as a negative terminal, and the lid, electrically isolated from the conductive pathway by the ceramic container, serves as a positive terminal. The negative and positive terminals are configured for electrical connection to a load.

A decoupling capacitor includes a first insulating layer extending in a horizontal direction, a storage plate arranged on the first insulating layer, a top plate facing the storage plate, a second insulating layer interposed between the storage plate and the top plate and having a plurality of through holes, a capacitor block including a plurality of capacitor structures in the plurality of through holes, a wiring structure covering the top plate, a first conductive pad arranged on the wiring structure and configured to be electrically connected to the storage plate through a first conductive path of the wiring structure, and a second conductive pad spaced apart from the first conductive pad in the horizontal direction in the same plane as the first conductive pad and configured to be electrically connected to the top plate through a second conductive path of the wiring structure.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

A capacitor module that includes: a case defining an interior space; a sealing resin in the interior space; one or more capacitors in the sealing resin; a first bus bar and a second bus bar each having a contact portion that is in contact with an electrode of the one or more capacitors, a buried portion in the sealing resin and extending from the contact portion, and an exposed portion that extends from the first buried portion outside the sealing resin, wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are filled with the sealing resin or include one or more protrusions surrounded by the sealing resin.

A capacitor module that includes: a case defining an interior space; a sealing resin in the interior space; one or more capacitors in the sealing resin; a first bus bar and a second bus bar each having a contact portion that is in contact with an electrode of the one or more capacitors, a buried portion in the sealing resin and extending from the contact portion, and an exposed portion that extends from the first buried portion outside the sealing resin, wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are filled with the sealing resin or include one or more protrusions surrounded by the sealing resin.