A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm.sup.−1 to 2350 cm.sup.−1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm.sup.−1 to 1800 cm.sup.−1 is 0.08 to 1.15.

There is provided a high dielectric film including amorphous hydrocarbon of which a dielectric constant is 10 or more. A leakage current of the high dielectric film is 1 A/cm.sup.2 or less, and an insulation level is 1 MV/cm or more. Rms surface roughness of the high dielectric film is 20 nm or less.

A dielectric film includes a substrate being a film including a resin material, and a plurality of microscopic members on a first surface of the substrate. Each of the plurality of microscopic members includes a first portion spaced from the first surface, and a second portion extending from the first surface and supporting the first portion.

A dielectric film includes a substrate being a film including a resin material, and a plurality of microscopic members on a first surface of the substrate. Each of the plurality of microscopic members includes a first portion spaced from the first surface, and a second portion extending from the first surface and supporting the first portion.

In an embodiment a capacitor includes a dielectric layer including a polyamideimide, the dielectric layer being uniform and a first electrode disposed directly adjacent to the dielectric layer.

A polypropylene film which is capable of suppressing blocking in a rolled polypropylene film. The polypropylene film has a first surface and a second surface, contains a polypropylene resin as a main component, and is configured such that: the Svk value (SvkA) of the first surface is 0.005 μm or more and 0.030 μm or less; the Spk value (SpkA) of the first surface is more than 0.035 μm and 0.080 μm or less; the Svk value (SvkB) of the second surface is 0.005 μm or more and 0.030 μm or less; and the Spk value (SpkB) of the second surface is 0.015 μm or more and 0.035 μm or less.

A polypropylene film which is capable of suppressing blocking in a rolled polypropylene film. The polypropylene film has a first surface and a second surface, contains a polypropylene resin as a main component, and is configured such that: the Svk value (SvkA) of the first surface is 0.005 μm or more and 0.030 μm or less; the Spk value (SpkA) of the first surface is more than 0.035 μm and 0.080 μm or less; the Svk value (SvkB) of the second surface is 0.005 μm or more and 0.030 μm or less; and the Spk value (SpkB) of the second surface is 0.015 μm or more and 0.035 μm or less.

There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is α.sub.P and a thermal expansion coefficient of the metal layer is α.sub.M, a value of α.sub.P/α.sub.M is 5.1 or less.