A capacitor includes: a plurality of bottom electrodes; a dielectric layer formed over the bottom electrodes; and a top electrode formed over the dielectric layer, wherein the top electrode includes a carbon-containing material and a germanium-containing material that fill a gap between the bottom electrodes.

A capacitor includes: a plurality of bottom electrodes; a dielectric layer formed over the bottom electrodes; and a top electrode formed over the dielectric layer, wherein the top electrode includes a carbon-containing material and a germanium-containing material that fill a gap between the bottom electrodes.

A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm.sup.3 to 1.26 g/cm.sup.3; and a metal layer on at least one surface of the dielectric resin film.

A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm.sup.3 to 1.26 g/cm.sup.3; and a metal layer on at least one surface of the dielectric resin film.

A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed outside of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion including of the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance, and a cover portion disposed in upper and lower portions of the active portion. The cover portion has a larger number of pores than the dielectric layer of the active portion, and the cover portion includes a ceramic-polymer composite filled with a polymer in the pores of the cover portion.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed outside of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion including of the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance, and a cover portion disposed in upper and lower portions of the active portion. The cover portion has a larger number of pores than the dielectric layer of the active portion, and the cover portion includes a ceramic-polymer composite filled with a polymer in the pores of the cover portion.