H01L27/1218

Composite oxide semiconductor and transistor

A novel material and a transistor including the novel material are provided. One embodiment of the present invention is a composite oxide including at least two regions. One of the regions includes In, Zn and an element M1 (the element M1 is one or more of Al, Ga, Si, B, Y, Ti, Fe, Ni, Ge, Zr, Mo, La, Ce, Nd, Hf, Ta, W, Mg, V, Be, and Cu) and the other of the regions includes In, Zn, and an element M2 (the element M2 is one or more of Al, Ga, Si, B, Y, Ti, Fe, Ni, Ge, Zr, Mo, La, Ce, Nd, Hf, Ta, W, Mg, V, Be, and Cu). In an analysis of the composite oxide by energy dispersive X-ray spectroscopy, the detected concentration of the element M1 in a first region is less than the detected concentration of the element M2 in a second region, and a surrounding portion of the first region is unclear in an observed mapping image of the energy dispersive X-ray spectroscopy.

Array substrate, manufacturing method thereof, and display device

An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes: a base substrate; a first thin film transistor located on the base substrate and including a first active layer; and a second thin film transistor located on the base substrate and including a second active layer; a matrix material of the first active layer is the same as that of the second active layer, and the first active layer and the second active layer satisfy at least one of the following conditions: a carrier mobility of the first active layer is greater than that of the second active layer, and a carrier concentration of the first active layer is greater than that of the second active layer. The array substrate is employed to compensate a difference in threshold voltage caused by a difference in channel width-to-length ratio of different thin film transistors.

Flexible display panel and manufacturing method thereof

A flexible display panel and a manufacturing method thereof are provided. The flexible display panel includes a display region and a non-display region. A part of the flexible display panel disposed in the non-display region includes a flexible substrate, a multi-barrier layer, and a planarization layer. A cutting track is defined at a peripheral edge of the non-display region, and a groove is defined in the cutting track. An end of the planarization layer extends to at least an interface formed between the multi-barrier layer and the flexible substrate through a sidewall of the groove.

Alkali-Free Aluminoborosilicate Glass

Provided is alkali-free aluminoborosilicate glass. The glass is prepared by the following raw materials in percentage by weight: 60-72% SiO.sub.2, 13-18% of Al.sub.2O.sub.3, 8.5-10% of B.sub.2O.sub.3, 1-4.5% of MgO, 3-8% of CaO, 1-5% of SrO, 0.5-2% of ZrO.sub.2, 1-5% of P.sub.2O.sub.5, and 0.1-0.5% of SnO.sub.2, wherein SiO.sub.2+Al.sub.2O.sub.3 is 76-85%; (MgO+CaO+SrO)/Al.sub.2O.sub.3 is 0.4-0.7; the total amount of alkaline earth metal oxide is 5-11.5%; B.sub.2O.sub.3/(B.sub.2O.sub.3+ZrO.sub.2+P.sub.2O.sub.5) is 0.6-0.9; and (ZrO.sub.2+P.sub.2O.sub.5)/(MgO+CaO+SrO) is 0.15-0.8. The glass has the characteristics such as higher strain point, high Young modulus, high hardness, high specific modulus, proper thermal expansion coefficient, and low thermal shrinkage; the boron volatilization rate is as low as 5.6-10.5%, so that the phenomenon of component nonuniformity due to boron volatilization can be effectively controlled; and the glass is suitable for a float forming process, does not contain toxic substances such as As.sub.2O.sub.3 and Sb.sub.2O.sub.3, is environment-friendly, is suitable for large-scale industrial production, and is particularly suitable for glass substrates for LCD/OLED displays.

ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE

An array substrate having a light-emitting unit region, a bonding region, and a bending region located between the light-emitting unit region and the bonding region. The light-emitting unit region is configured to be provided with light-emitting units. The bonding region is configured to bond a control circuit. The array substrate includes a base substrate located in the light-emitting unit region and the bonding region, a first organic material layer, a metal intermediate layer, and a second organic material layer. The first organic material layer is disposed on a side of the base substrate. The metal intermediate layer is disposed on a side of the first to organic material layer away from the base substrate. The second organic material layer is disposed on a side of the metal intermediate layer away from the base substrate.

MOTHER PANEL FOR DISPLAY PANEL
20220384400 · 2022-12-01 ·

A mother panel for a display panel includes: a mother substrate including a display panel area and a dummy area surrounding the display panel area, the mother substrate having a cutting line defined thereon, wherein the cutting line is configured to be irradiated by a laser along a boundary between the display panel area and the dummy area; and a first heat dissipation pattern on the mother substrate, extending from the display panel area to the dummy area to overlap the cutting line, and including a first rod portion including a plurality of lower rods spaced apart from each other and a first body portion in the dummy area and contacting the first rod portion.

Display panel and method of fabricating the same

A display panel includes a base layer having a first region and a bent second region. An inorganic layer is disposed on the base layer. A lower groove is formed within the inorganic layer and overlaps the second region. A first thin-film transistor is disposed on the inorganic layer and includes a silicon semiconductor pattern overlapping the first region. A second thin-film transistor is disposed on the inorganic layer and includes an oxide semiconductor pattern overlapping the first region. Insulating layers overlap the first and second regions. An upper groove is formed within the insulating layers. A signal line electrically connects the second thin-film transistor. An organic layer overlaps the first and second regions and is disposed in the lower and upper grooves. A luminescent device is disposed on the organic layer and overlaps the first region.

Display device with overlapping auxiliary lines in non-display area surrounding transmission area
11515380 · 2022-11-29 · ·

A display device includes a first data line extending in a first direction, arranged in a display area, and connected to a first display element; a second data line extending in the first direction, arranged in the display area, and connected to a second display element; an auxiliary line arranged in a first non-display area and connecting the first data line to the second data line; and a plurality of patterns arranged apart from the auxiliary line in surroundings of the auxiliary line in the first non-display area.

Display panel and display device

A display panel and a display device are provided. The display panel has a display area including a conventional display region and a translucent display region; and a non-display area. First sub-pixels, second sub-pixels and third sub-pixels are provided in the conventional display region, the first sub-pixels are arranged in a first density, and the second and third sub-pixels are arranged in a second density. Fourth sub-pixels, fifth sub-pixels and sixth sub-pixels are provided in the translucent display region, the fourth sub-pixel has a same color as the first sub-pixel, the fifth sub-pixel has a same color as the second sub-pixel, and the sixth sub-pixel has a same color as the third sub-pixel. The fourth sub-pixels are arranged in a third density equal to the first density, the fifth and sixth sub-pixels are arranged in a fourth density. The second density is greater than the fourth density.

ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL

An array substrate, a manufacturing method thereof, and a display panel are provided. The array substrate includes a bending area and a non-bending area, and further includes an inorganic stacked layer disposed on a substrate layer. A recess is formed on the inorganic stacked layer in the bending area. A plurality of first metal lines are disposed in the inorganic stacked layer at two sides of the bending area. A filling layer is filled in the recess. The array substrate further includes a second metal line disposed on the inorganic stacked layer and the filling layer, and the first metal lines at the two sides of the bending area form a lap joint by the second metal line.