A film capacitor including a first dielectric film, a second dielectric film, a first internal electrode, a second internal electrode, a first external electrode, and a second external electrode. The first internal electrode includes a first connection portion, a first main electrode portion contiguous with the first connection portion and thinner than the first connection portion, and a first thin film portion extending from the first main electrode portion and thinner than the first main electrode portion. The second internal electrode includes a second connection portion and a second main electrode portion contiguous with the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion with the first dielectric film interposed therebetween and does not oppose the second connection portion, and the first thin film portion opposes the second connection portion with the first dielectric film interposed therebetween.

A film capacitor including a first dielectric film, a second dielectric film, a first internal electrode, a second internal electrode, a first external electrode, and a second external electrode. The first internal electrode includes a first connection portion, a first main electrode portion contiguous with the first connection portion and thinner than the first connection portion, and a first thin film portion extending from the first main electrode portion and thinner than the first main electrode portion. The second internal electrode includes a second connection portion and a second main electrode portion contiguous with the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion with the first dielectric film interposed therebetween and does not oppose the second connection portion, and the first thin film portion opposes the second connection portion with the first dielectric film interposed therebetween.

There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

There is provided a polypropylene film that has excellent reliability and withstand voltage characteristics in high temperature environments when used in high voltage capacitors, that has a structure with excellent stability against heat and is suitable for applications in capacitors or the like to be used at high temperatures and high voltages, and that has excellent processability and does not wrinkle during a conveyance process including a vapor deposition process. The polypropylene film has an absolute value of a difference between a crystallite size obtained by scanning an a crystal (110) plane by wide angle X-ray diffraction in a main alignment direction and a crystallite size obtained by scanning an a crystal plane in a direction orthogonal to the main alignment direction is 3.0 nm or less, and a shrinkage stress in a machine direction (SF 135 MD) is 2.0 MPa or less at 135° C. in a heating process at a temperature elevation rate of 10° C./min in thermomechanical analysis (TMA).

A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.

The present invention provides monomers, analogs, and/or derivatives of bisphenols substituted with one or more fluoromethyl groups. These monomers, analogs, and/or derivatives can be used to form oligomers and/or polymers, which in turn can be used to make compounds with dielectric properties suitable for dielectric materials, including for example, use in energy dense capacitors. In a preferred embodiment, the compounds can comprise a polycarbonate of a homopolymer, copolymer, and/or terpolymer of a bisphenol with one or more fluoromethyl substitution groups. In an aspect of the invention the compounds chosen can be selected based on various desired characteristics, including, for example, their energy density, glass transition temperature, dielectric loss, and/or dipole density.

The present invention provides monomers, analogs, and/or derivatives of bisphenols substituted with one or more fluoromethyl groups. These monomers, analogs, and/or derivatives can be used to form oligomers and/or polymers, which in turn can be used to make compounds with dielectric properties suitable for dielectric materials, including for example, use in energy dense capacitors. In a preferred embodiment, the compounds can comprise a polycarbonate of a homopolymer, copolymer, and/or terpolymer of a bisphenol with one or more fluoromethyl substitution groups. In an aspect of the invention the compounds chosen can be selected based on various desired characteristics, including, for example, their energy density, glass transition temperature, dielectric loss, and/or dipole density.

A capacitor can include a dielectric layer including a polymer matrix and ceramic particles dispersed with the polymer matrix. The polymer matrix can include epoxy. The ceramic powders can include composition modified barium titanate ceramic powders. In an embodiment, the capacitor can include a plurality of layers. In another embodiment, the dielectric layer can have a thickness of 0.1 microns to 100 microns.

A capacitor can include a dielectric layer including a polymer matrix and ceramic particles dispersed with the polymer matrix. The polymer matrix can include epoxy. The ceramic powders can include composition modified barium titanate ceramic powders. In an embodiment, the capacitor can include a plurality of layers. In another embodiment, the dielectric layer can have a thickness of 0.1 microns to 100 microns.

A self-healing capacitor comprises a first electrode, a second electrode, and a dielectric layer disposed between said first and second electrodes and having first surface faced the first electrode and second surface faced the second electrode. At least one of the electrodes can include metal foam. The dielectric layer can have electrically conductive channels that each has an exit point located on the first surface of the dielectric layer and another exit point located on the second surface of the dielectric layer. The electrodes can include local contact breakers each of which is located within the electrode at an interface between the dielectric layer and the electrode and opposite at least one exit point of each electrically conductive channel in the dielectric layer. The local contact breakers can prevent electric current through the conductive channels in dielectric layer.