A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.

An embodiment of a device includes a package body having a first sidewall, a top surface, and a bottom surface, and multiple pads that are exposed at the first sidewall and that are electrically coupled to one or more electrical components embedded within the package body. The device also includes a package surface conductor coupled to the first sidewall. The package surface conductor extends between and electrically couples the multiple pads, and the package surface conductor is formed from a first surface layer and a second surface layer formed on the first surface layer. The first surface layer directly contacts the multiple pads and the first sidewall and is formed from one or more electrically conductive first materials, and the second surface layer is formed from one or more second materials that are significantly more resistive to materials that can be used to remove the first materials.

The present invention includes composition and methods for a core matrix comprising a dissolved cellulose fiber of, e.g., high molecular weight (DP>5000) or microcrystalline cellulose of low molecular weight (DP: 150-300), printed into a two or three dimensional pattern; a conductive material comprising a carbon nanotube or graphene oxide disposed on or about the cellulose fiber or microcrystalline cellulose; and an enhancer or stabilizer that stabilizes the dissolved cellulose or microcrystalline cellulose disrupted during a printing process, wherein the conductive material and the cellulose or microcrystalline cellulose forms one or more features in or on the cellulose fiber or microcrystalline cellulose.

An ink contains particles containing metal that reacts during sintering to produce an electrically conductive line or area having a diffusivity that is less than the diffusivity of the metal before the reaction. Resulting electronic circuits therefore exhibit longer useful lives, compared to conventionally inkjet printed circuits.

A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

A semiconductor device and a method of manufacturing the same, the device including a through-hole electrode structure extending through a substrate; a redistribution layer on the through-hole electrode structure; and a conductive pad, the conductive pad including a penetrating portion extending through the redistribution layer; and a protrusion portion on the penetrating portion, the protrusion portion protruding from an upper surface of the redistribution layer, wherein a central region of an upper surface of the protrusion portion is flat and not closer to the substrate than an edge region of the upper surface of the protrusion portion.

A semiconductor device includes an interconnect substrate, an interconnect trace disposed on an upper surface of the interconnect substrate, a semiconductor chip mounted on the upper surface of the interconnect substrate, an adhesive resin layer disposed between the upper surface of the interconnect substrate and a lower surface of the semiconductor chip to bond the interconnect substrate and the semiconductor chip, the adhesive resin layer including an opening at a bottom of which an upper surface of the interconnect trace is situated, a barrier layer covering a sidewall of the opening, and conductive paste disposed inside the opening, wherein an electrode terminal of the semiconductor chip situated at the lower surface thereof is disposed inside the opening, with the conductive paste filling a space between the barrier layer and the electrode terminal.

This application provides a LED display by utilizing flexible wires and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on a transparent substrate, and this LED display is characterized in separating the wires crossing with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

An ink contains particles containing metal that reacts during sintering to produce an electrically conductive line or area having a diffusivity that is less than the diffusivity of the metal before the reaction. Resulting electronic circuits therefore exhibit longer useful lives, compared to conventionally inkjet printed circuits.

A stretchable conductor of the present invention includes: a mixture which is configured of a stretchable portion made of an elastomer, and at least one type of conductive particles dispersed in the stretchable portion; and a conducting portion in which the conductive particles are aggregated in a higher concentration at one or a plurality of positions on an interface of the mixture than that at positions located in an inner portion of the mixture.