A low resistance metal is charged into holes formed in a semiconductor substrate to thereby form through electrodes. Post electrodes of a wiring-added post electrode component connected together by a support portion thereof are simultaneously fixed to and electrically connected to connection regions formed on an LSI chip. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. On the back face side, the semiconductor substrate is grounded so as to expose tip ends of the through electrodes. The front face wiring traces exposed to the front face side and the tip ends of the through electrodes exposed to the back face side are used as wiring for external connection.

An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure comprises at least one two-dimensional (2D) conductive structure; a dielectric structure disposed on the 2D conductive structure; and at least one interconnect structure disposed in the dielectric layer and extending into the 2D conductive structure. The interconnect structure laterally contacts the 2D conductive structure.

To provide an electroconductive thin film, containing: a metal oxide containing indium and tin; and gold.

An apparatus for manufacturing a thermoelectric module is provided. The thermoelectric module includes thermoelectric pellets, first electrodes, second electrodes, and an insulating substrate. The apparatus includes a fixing tray to which the thermoelectric module is fixed, a first die including a first heating member configured to heat a first adhesive layer, which is interposed between the thermoelectric pellets and the first electrodes. The fixing tray is mounted on the first die such that the insulating substrate faces the first heating member. A second die includes a second heating member configured to heat a second adhesive layer, which is interposed between the thermoelectric pellets and the second electrodes, the second die facing the second electrodes. A transfer unit is configured to transfer at least one of the first die and the second die to adjust a distance between the first die and the second die.

Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor.

The present invention relates to conductive pastes, suitable for use in solar cells, a method for the manufacture of a light receiving surface electrode of a solar cell, a light receiving electrode for a solar cell and a solar cell. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive metal, and mixed oxide, wherein the mixed oxide is a tellurium-bismuth-cerium mixed oxide and is substantially lead-free and substantially silicon-free.

This application provides a LED display by utilizing flexible wires and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on a transparent substrate, and this LED display is characterized in separating the wires crossing with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200 C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.