Semiconductor packages with electromagnetic interference (EMI) shielding and a method of manufacture therefor is disclosed. The semiconductor packages may house single electronic component or may be a system in a package (SiP) implementation. The EMI shielding may be provided on top of and along the periphery of the semiconductor package. The EMI shielding on the periphery may be formed of cured conductive ink or cured conductive paste disposed on sidewalls of molding that encapsulates the electronic component(s) provided on the semiconductor package. The vertical portions of the EMI shielding, including EMI shielding on the periphery may be formed by filling conductive ink in trenches formed in-situ with curing the molding. The top portion of the EMI shielding and the may additionally be cured conductive ink.

A stretchable conductor of the present invention includes: a mixture which is configured of a stretchable portion made of an elastomer, and at least one type of conductive particles dispersed in the stretchable portion; and a conducting portion in which the conductive particles are aggregated in a higher concentration at one or a plurality of positions on an interface of the mixture than that at positions located in an inner portion of the mixture.

An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.

A low resistance metal is charged into holes formed in a semiconductor substrate to thereby form through electrodes. Post electrodes of a wiring-added post electrode component connected together by a support portion thereof are simultaneously fixed to and electrically connected to connection regions formed on an LSI chip. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. On the back face side, the semiconductor substrate is grounded so as to expose tip ends of the through electrodes. The front face wiring traces exposed to the front face side and the tip ends of the through electrodes exposed to the back face side are used as wiring for external connection.

A method of forming a wafer level chip scale package interconnect may include: forming a post-passivation interconnect (PPI) layer over a substrate; forming an interconnect over the PPI layer; and releasing a molding compound material over the substrate, the molding compound material flowing to laterally encapsulate a portion of the interconnect.

The present invention includes composition and methods for a core matrix comprising a dissolved cellulose fiber of, e.g., high molecular weight (DP>5000) or microcrystalline cellulose of low molecular weight (DP: 150-300), printed into a two or three dimensional pattern; a conductive material comprising a carbon nanotube or graphene oxide disposed on or about the cellulose fiber or microcrystalline cellulose; and an enhancer or stabilizer that stabilizes the dissolved cellulose or microcrystalline cellulose disrupted during a printing process, wherein the conductive material and the cellulose or microcrystalline cellulose forms one or more features in or on the cellulose fiber or microcrystalline cellulose.

A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.

A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.

This present invention provides a flexible LED display by utilizing flexible wirings and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on the transparent flexible substrate, and this flexible LED display which characterizes in separating the wirings crossing over with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.