Patent classifications
H01L27/1262
Method of fabricating stretchable electronic device, stretchable electronic device, and stretchable display apparatus
The present application provides a method of fabricating a stretchable electronic device. The method includes forming an elastomer polymer layer on a base substrate; selectively stiffening the elastomer polymer layer in a plurality of defined regions of the elastomer polymer layer, thereby forming a modified elastomer polymer layer having a plurality of stiffened portions respectively in a plurality of stiffened regions spaced apart by one or more elastomeric portions in one or more elastomeric regions, the plurality of stiffened portions having a Young's modulus greater than a Young's modulus of the one or more elastomeric portions; and forming a plurality of electronic devices respectively in the plurality of stiffened regions, each of the plurality of electronic devices formed on a side of one of the plurality of stiffened portions distal to the base substrate.
DISPLAY PANEL AND FABRICATION METHOD THEREOF
A display panel and a fabrication method thereof are provided. The display panel includes: an array substrate including a display portion and a bending portion connected to a side of the display portion; a functional film layer at a side of the display portion; and a protective layer covering the bending portion. The protective layer and the functional film layer are at the same side of the array substrate. The protective layer includes a first bending portion arranged adjacent to the functional film layer, and a second bending portion connected to a side of the first bending portion away from the functional film layer. A distance between an edge of the second bending portion away from the first bending portion and the functional film layer in a first direction perpendicular to an interface between the display portion and the bending portion is the largest in the protective layer.
Positive photoresist composition, via-forming method, display substrate and display device
The present disclosure provides a positive photoresist composition including a major adhesive material and a photosensitizer, wherein the photoresist composition further includes a photoisomerizable compound which would be converted into an ionic structure with an increased degree of molecular polarity after ultraviolet irradiation. The formation of the ionic structure with increased polarity of the molecule reduces the adhesion between the positive photoresist and the organic film layer, facilitates stripping after formation of the via, and improves the product rate of pass. Further, the present disclosure provides a via-forming method using the positive resist composition, a display substrate including the via formed by the via-forming method, and a display device including the display substrate.
Flexible display panel and manufacturing method thereof
A flexible display panel and a manufacturing method thereof are provided. The flexible display panel includes a display region and a non-display region. A part of the flexible display panel disposed in the non-display region includes a flexible substrate, a multi-barrier layer, and a planarization layer. A cutting track is defined at a peripheral edge of the non-display region, and a groove is defined in the cutting track. An end of the planarization layer extends to at least an interface formed between the multi-barrier layer and the flexible substrate through a sidewall of the groove.
METHOD FOR MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
Disclosed are an array substrate and a fabricating method therefor, a display panel, and a display device, and relating to the technical field of display. The method comprises: forming a patterned film layer on one side of a substrate, the patterned film layer comprising a plurality of recesses; and palcing a first precursor structure in the recesses, and the material of the first precursor structure comprises a first precursor; and placeing in the environment of a gaseous second precursor the substrate having the first precursor structure formed thereon to cause the reaction between the gaseous second precursor and the first precursor structure to form a perovskite crystal structure, wherein one of the first precursor and the second precursor comprises a metal halide, and the other comprises one of a formamidine halide, a methylamine halide, a cesium halide, and hydrogen sulfide, thereby achieving the manufacture of a perovskite microarray structure.
DISPLAY DEVICE
A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
Display panel and method of fabricating the same
A display panel includes a base layer having a first region and a bent second region. An inorganic layer is disposed on the base layer. A lower groove is formed within the inorganic layer and overlaps the second region. A first thin-film transistor is disposed on the inorganic layer and includes a silicon semiconductor pattern overlapping the first region. A second thin-film transistor is disposed on the inorganic layer and includes an oxide semiconductor pattern overlapping the first region. Insulating layers overlap the first and second regions. An upper groove is formed within the insulating layers. A signal line electrically connects the second thin-film transistor. An organic layer overlaps the first and second regions and is disposed in the lower and upper grooves. A luminescent device is disposed on the organic layer and overlaps the first region.
Method of manufacturing flexible display
A method of manufacturing a flexible display is disclosed. In one aspect, the method includes attaching a protective film to a flexible display panel. The flexible display panel includes a bending region along which the flexible display panel is configured to be bent. The method also includes removing a portion of the protective film that corresponds to the bending region and bending the flexible display panel along the bending region.
Flat panel substrate with integrated antennas and wireless power transmission system
A flat panel substrate with integrated antennas and wireless power transmission system for delivering power to a receiving device is presented herein. A method can comprise depositing, onto a flat panel substrate, an antenna layer comprising multiple adaptively phased antennas elements; and depositing, onto the flat panel substrate, respective thin film transistor (TFT)-based antenna management circuits for the multiple adaptively phased antenna elements—the respective TFT-based antenna management circuits being operable to measure respective first phases at which first signals are received at the multiple adaptively phased antenna elements, and based on the respective first phases, control respective second phases at which second signals are transmitted from the multiple adaptively phased antenna elements to facilitate delivery, via the second signals, of power to the receiving device. Further, the method comprises forming traces communicatively coupling the multiple adaptively phased antenna elements to the respective TFT-based antenna management circuits.
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
A display panel and a manufacturing method thereof are provided. In the manufacturing method of the display panel, a corner-cutting area of a to-be-cut display panel is provided with a cutting groove. The cutting groove penetrates a buffer layer and extends into a flexible substrate. Furthermore, the cutting groove is provided with an inorganic encapsulation layer and a sacrificial layer. Therefore, when cutting the to-be-cut display panel along the cutting groove, cracks generated during a process can be reduced, thereby alleviating a problem of micro-cracks affecting a packaging effect of conventional display panels during a secondary cutting process.