A method and apparatus for reducing dynamic switching current in high speed logic. The apparatus may include a CMOS logic circuit, which in turn includes an NMOS FinFET, a first PMOS FinFET, and a second PMOS FinFET. A gate of the NMOS FinFET is connected to a gate of the first PMOS FinFET, a drain of the NMOS FinFET is connected to a drain of the first PMOS FinFET, and the second PMOS FinFET is connected to the first PMOS FinFET to create a capacitor between a source and the drain of the first PMOS FinFET. In one embodiment, the second PMOS FinFET is contained in and positioned at an edge of a cell that also contains the first PMOS FinFET and the NMOS FinFET.

The semiconductor layout structure includes an active region surrounded by an isolation structure, at least one first gate structure disposed over the active region and the isolation structure, at least one second gate structure disposed over the active region and the isolation structure, and a plurality of source/drain regions disposed in the active region. The active region includes two first regions, a second region disposed between the two first regions, a third region disposed between one of the first region and the second region, and a fourth region disposed between the other first region and the second region.

A power semiconductor device including a first conductivity type semiconductor substrate, a drain metal electrode, a first conductivity type semiconductor drift region, and a second conductivity type semiconductor body region. The second conductivity type semiconductor body region includes a first conductivity type semiconductor source region and anti-punch-through structure; the anti-punch-through structure is a second conductivity type semiconductor body contact region or metal structure; the lower surface of the anti-punch-through structure coincides with the upper surface of the first conductivity type semiconductor drift region or the distance between the two is less than 0.5 m, so that make the device avoid from punch-through. An anti-punch-through structure is introduced at the source end of the device to avoid punch-through breakdown caused by short channel and light-doped body region.

The present disclosure provides a transistor device and a semiconductor layout structure. The transistor device includes an active region disposed in a substrate, a gate structure disposed over the active region, and a source/drain region disposed at two opposite sides of the gate structure. The active region includes a first region including a first length, a second region including a second length less than the first length, and a third region between the first region and the second region. The gate structure includes a first portion extending in a first direction and a second portion extending in a second direction perpendicular to the first direction. The first portion is disposed over at least the third region of the active region, and the second portion is disposed over at least a portion of the third region and a portion of the second region.

A transistor includes a first gate electrode and a second gate electrode over a substrate and on opposite sides of a drain region, a first source region and the drain region on opposite sides of the first gate electrode, a second source region and the drain region on opposite sides of the second gate electrode, a first doped well formed under the first source region, a second doped well formed under the first source region, wherein the first doped well is embedded in the second doped well, and wherein a doping density of the first doped well is greater than a doping density of the second doped well and a body contact region adjacent to the first source region, wherein sidewalls of the body contact region are aligned with sidewalls of the first source region from a top view.

A semiconductor device includes a source region. A drain region has a first conductivity type and a second dopant concentration spaced apart from the source region. A first drift region is located between the source region and the drain region and has the first conductivity type and a first dopant concentration that is lower than the second dopant concentration of the drain region. An oxide structure includes a first portion on or over the first drift region and a tapered portion between the first portion and the drain region. A substrate surface extension is between the tapered portion and the drain region. A buffer region has the first conductivity type between the first drift region and the drain region and under the tapered portion of the oxide structure. The buffer region has a third dopant concentration between the second dopant concentration and the first dopant concentration.

Provided are: injection control regions of a second conductivity type provided on a charge transport region of a first conductivity type; main electrode regions of the first conductivity type provided on the injection control regions; insulated gate electrode structures going through the main electrode region and the injection control regions in the depth direction; an injection suppression region going through the main electrode regions and the injection control regions in the depth direction so as to form a pn junction in a path leading to the charge transport region, the injection suppression region including a semiconductor material with a narrower bandgap than a material of the charge transport region; and a contact protection region of the second conductivity type contacting the bottom surface of the injection suppression region.

A power semiconductor device including a first conductivity type semiconductor substrate, a drain metal electrode, a first conductivity type semiconductor drift region, and a second conductivity type semiconductor body region. The second conductivity type semiconductor body region includes a first conductivity type semiconductor source region and anti-punch-through structure; the anti-punch-through structure is a second conductivity type semiconductor body contact region or metal structure; the lower surface of the anti-punch-through structure coincides with the upper surface of the first conductivity type semiconductor drift region or the distance between the two is less than 0.5 m, so that make the device avoid from punch-through. An anti-punch-through structure is introduced at the source end of the device to avoid punch-through breakdown caused by short channel and light-doped body region.

A method includes forming a first isolation region in a substrate, wherein a top surface of the first isolation region is lower than a top surface of the substrate, depositing a gate electrode layer over the substrate and patterning the gate electrode layer to form a first gate electrode region and a second gate electrode region, wherein the second gate electrode region is vertically aligned with the first isolation region and the first gate electrode region is immediately adjacent to the second gate electrode region.

A semiconductor component includes gate structures extending into a silicon carbide body from a first surface. A width of the gate structures along a first horizontal direction parallel to the first surface is less than a vertical extent of the gate structures perpendicular to the first surface. Contact structures extend into the silicon carbide body from the first surface. The gate structures and the contact structures alternate along the first horizontal direction. Shielding regions in the silicon carbide body adjoin a bottom of the contact structures and are spaced apart from the gate structures along the first horizontal direction. Corresponding methods for producing the semiconductor component are also described.