Methods of forming a nanosheet field effect transistor (FET) device with reduced source/drain contact resistance are provided herein. In some embodiments, a method of forming an FET device includes: etching a nanosheet stack of the nanosheet FET device to form a plurality of first source/drain regions and a plurality of second source/drain regions, the nanosheet stack comprising alternating layers of nanosheet channel layers and sacrificial nanosheet layers; depositing a silicide layer in the plurality of first source/drain regions at ends of the nanosheet channel layers via a selective silicidation process to control a length of the nanosheet channel layers between the first source/drain regions; and performing a metal fill process to fill the plurality of first source/drain regions, wherein the metal fill extends from a lowermost nanosheet channel layer to above an uppermost nanosheet channel layer to facilitate the reduced source/drain contact resistance.

A change in electrical characteristics of a semiconductor device including an interlayer insulating film over a transistor including an oxide semiconductor as a semiconductor film is suppressed. The structure includes a first insulating film which includes a void portion in a step region formed by a source electrode and a drain electrode over the semiconductor film and contains silicon oxide as a component, and a second insulating film containing silicon nitride, which is provided in contact with the first insulating film to cover the void portion in the first insulating film. The structure can prevent the void portion generated in the first insulating film from expanding outward.

A thin film transistor (TFT) substrate, a manufacturing method thereof, a display panel are disclosed. The TFT substrate includes: a substrate; an active layer disposed above the substrate and including a channel region, a source region, and a drain region, wherein the channel region is made of an oxide semiconductor, the source region and the drain region are made of a conductive oxide semiconductor; a gate insulating layer and a gate sequentially disposed on the channel region; a titanium oxide layer covering the source region and the drain region; and a source and a drain disposed above the titanium oxide layer.

A display device including a plurality of thin film transistors. One of the plurality of thin film transistors includes a gate electrode, a semiconductor layer having a region overlapping the gate electrode, a gate insulating layer between the gate electrode and the semiconductor layer, a source electrode and a drain electrode in contact with a surface of the semiconductor layer opposite to the side of the gate insulating layer, and a first shield electrode arranged in a region where the source electrode and the gate electrode overlap, and a second shield electrode arranged in a region where the drain electrode and the gate electrode overlap. The first shield electrode and the second shield electrode are arranged between the gate electrode and the semiconductor layer, and are insulated from the gate electrode, the semiconductor layer, the source electrode, and the drain electrode.

The impurity concentration in the oxide semiconductor film is reduced, and a highly reliability can be obtained.

A thin film transistor, including: at least one active layer pattern including a first conductive pattern, a second conductive pattern, and a semiconductor pattern; a gate on a side of the active layer pattern; a first electrode and a second electrode on a side of the gate away from the active layer pattern, and respectively electrically connected with the first conductive pattern and the second conductive pattern, a conductive shielding pattern is provided corresponding to the semiconductor pattern in at least one active layer pattern, the conductive shielding pattern is on a side of the semiconductor pattern away from the gate and is electrically connected with the first electrode, and a buffer layer is between the conductive shielding pattern and the semiconductor pattern; an orthographic projection of the conductive shielding pattern on a plane where the semiconductor pattern corresponding thereto is located at least partially covers the semiconductor pattern corresponding.

The present disclosure relates to the field of display technologies, and in particular to a thin film transistor and a method for manufacturing the same, an array substrate and a display device. An active layer of the thin film transistor includes at least two metal oxide semi-conductor layers, the at least two metal oxide semi-conductor layers include a channel layer and a first protection layer, and metals in the channel layer include tin, and at least one of indium, gallium and zinc. The first protection layer includes praseodymium used to absorb photo-generated electrons from at least one of the channel layer and the first protection layer which is under light irradiation and reduce a photo-generated current caused by the light irradiation.

Integrated circuit structures having a dielectric gate wall and a dielectric gate plug, and methods of fabricating integrated circuit structures having a dielectric gate wall and a dielectric gate plug, are described. For example, an integrated circuit structure includes a sub-fin having a portion protruding above a shallow trench isolation (STI) structure. A plurality of horizontally stacked nanowires is over the sub-fin. A gate dielectric material layer is over the protruding portion of the sub-fin, over the STI structure, and surrounding the horizontally stacked nanowires. A conductive gate layer is over the gate dielectric material layer. A conductive gate fill material is over the conductive gate layer. A dielectric gate wall is laterally spaced apart from the sub-fin and the plurality of horizontally stacked nanowires, the dielectric gate wall on the STI structure. A dielectric gate plug is on the dielectric gate wall.

The present disclosure provides a method for manufacturing a semiconductor structure having different filling layers. The method includes forming a multi-layer stack in a semiconductor substrate, wherein the multi-layer stack has a first filling layer and a second layer, the semiconductor substrate has two through vias, and two top portions of the multi-layer stack are respectively exposed through the two through vias. The method further includes recessing the multi-layer stack from the two through vias to respectively form two blind holes in the first filling layer and the second filling layer; selectively etching the second filling layer to form a global cavity between the two blind holes; filling the global cavity and the two blind holes with dielectric filling material to form an air void in the multi-layer stack; and forming a switch device over the semiconductor substrate, wherein the air void is formed under the switch device.

A display device includes a base substrate; an oxide semiconductor layer disposed on the base substrate; a first gate insulating layer disposed on a first channel region of the oxide semiconductor layer and that overlaps the first channel region thereof; a first upper gate electrode disposed on the first gate insulating layer ; and an upper interlayer insulating layer disposed on the first upper gate electrode, the first upper gate electrode, and the oxide semiconductor layer, wherein the upper interlayer insulating layer includes a first upper interlayer insulating layer, a second upper interlayer insulating layer, and a third upper interlayer insulating layer, the first upper interlayer insulating layer includes silicon oxide, each of the second and third upper interlayer insulating layers include silicon nitride, and a hydrogen concentration in the second upper interlayer insulating layer is less than a hydrogen concentration in the third upper interlayer insulating layer.