A semiconductor device includes a baseplate and a case which includes an external wall surrounding an internal space and a dividing wall extending in a first direction and separating the space into compartments. The dividing wall has a lower end fixed to the principal surface and includes, on a sidewall, a terrace positioned further away from the principal surface than the lower end and hanging out toward the space compared to the lower end in a second direction parallel to the principal surface and perpendicular to the first direction. A terminal's bonding part, to which a wire is bonded, is disposed on the terrace. A ratio of the wire's diameter to the bonding part's width in the first direction is set to ≤0.15, which prevents a situation where bonding power is not sufficiently applied to the bonding part during ultrasonic bonding of the wire, thus increasing the bonding strength.

A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.

A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

A semiconductor apparatus includes: a first semiconductor chip; a resin enclosure having a space in which the first semiconductor chip is positioned; a lead terminal disposed in the resin enclosure; a second semiconductor chip configured to: control the first semiconductor chip, and be disposed on a first portion of the resin enclosure, the resin enclosure not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal; and a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.

A semiconductor apparatus includes: a first semiconductor chip; a resin enclosure having a space in which the first semiconductor chip is positioned; a lead terminal disposed in the resin enclosure; a second semiconductor chip configured to: control the first semiconductor chip, and be disposed on a first portion of the resin enclosure, the resin enclosure not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal; and a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.

Provided is a semiconductor device including: a lead frame having an upper surface provided with a concave portion and a lower surface provided with a convex portion; a semiconductor chip fixed to the upper surface of the lead frame; a solder layer provided in the concave portion and fixing the semiconductor chip to the upper surface of the lead frame; and a sealing resin for sealing the semiconductor chip and the lead frame. A thickness of the solder layer is larger than a depth of the concave portion. The sealing resin covers at least a part of the lower surface of the lead frame. At least a part of the convex portion of the lead frame is exposed from the sealing resin.

Provided is a semiconductor device including: a lead frame having an upper surface provided with a concave portion and a lower surface provided with a convex portion; a semiconductor chip fixed to the upper surface of the lead frame; a solder layer provided in the concave portion and fixing the semiconductor chip to the upper surface of the lead frame; and a sealing resin for sealing the semiconductor chip and the lead frame. A thickness of the solder layer is larger than a depth of the concave portion. The sealing resin covers at least a part of the lower surface of the lead frame. At least a part of the convex portion of the lead frame is exposed from the sealing resin.

It is an object to provide technology enabling suppression of contact deformation of pin fins during assembly of a semiconductor device and the like. A semiconductor device includes a base plate, a semiconductor element, and a resin member. The base plate has a plurality of pin fins on a lower surface thereof. The semiconductor element is mounted on an upper side of the base plate. The resin member covers at least a side surface of the semiconductor element. The resin member has a rib covering a side surface of the base plate, and a lower end of the rib is located below lower ends of the plurality of pin fins.