Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/31
Structure, shape, material or disposition of the layer connectors after the connecting process
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H01L2224/33
of a plurality of layer connectors
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H01L2224/3314
Circular array, i.e. array with radial symmetry
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H01L2224/33144
covering only portions of the surface to be connected
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H01L2224/33145
Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
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H01L2224/33145

Adhesive film, preparation method of semiconductor device, and semiconductor device
11021634 · 2021-06-01 · ·

The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

ADHESIVE FILM, PREPARATION METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
20180265758 · 2018-09-20 · ·

The present invention relates to an adhesive film having a thixotropic index at 110 C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.