According to an aspect, an array substrate includes a first scan line, a second scan line, and a signal line. A semiconductor film has a coupling portion coupling one end of a first linear portion to one end of a second linear portion. Another end of the first linear portion of the semiconductor film and another end of the second linear portion of the semiconductor film are coupled to the signal line. In a plan view, the semiconductor film is disposed between the first scan line and the second scan line, the first linear portion intersects two first gate electrodes, and the second linear portion intersects two second gate electrodes.

A semiconductor structure that includes at least one lateral diffusion field effect transistor is described. The structure includes a source contact and a gate shield that enables the line width of an ohmic region that electrically connects the source/body region to the gate shield to be smaller than the minimum contact feature size. The gate shield defines a bottom recess for forming a narrower bottom portion of the source contact, and a section that flares outward with distance from the ohmic region to extend above and laterally beyond the ohmic region. By providing a wider area for the source contact, the flared portion of the gate shield allows the portion of the gate shield that contacts the ohmic region to be narrower than the minimum contact feature size. As a result, the cell pitch of the lateral diffusion field effect transistor can be reduced.

A thin film transistor is disclosed. The thin film transistor comprises an active layer, and a gate electrode overlapped with the active layer, wherein the active layer includes a channel portion overlapped with the gate electrode, and the channel portion includes a source boundary portion, a drain boundary portion, and a main channel portion, wherein at least a part of the drain boundary portion have a relatively smaller thickness in comparison to a thickness of the main channel portion. Also, according to one embodiment of the present disclosure, a display apparatus comprising the thin film transistor is provided.

A LDMOS device includes a semiconductor layer on an insulation layer and a ring shape gate on the semiconductor layer. The ring shape gate includes a first gate portion, a second gate portion, and two third gate portions connecting the first gate portion and the second gate portion. The semiconductor device further includes a first drain region and a second drain region formed in the semiconductor layer at two sides of the ring shape gate, a plurality of source regions formed in the semiconductor layer surrounded by the ring shape gate, a plurality of body contact regions formed in the semiconductor layer and arranged between the source regions, and a first body implant region and a second body implant region formed in the semiconductor layer, respectively underlying part of the first gate portion and part of the second gate portion, and being connected by the body contact regions.

A thin film transistor is disclosed. The thin film transistor comprises an active layer, and a gate electrode overlapped with the active layer, wherein the active layer includes a channel portion overlapped with the gate electrode, and the channel portion includes a source boundary portion, a drain boundary portion, and a main channel portion, wherein at least a part of the drain boundary portion have a relatively smaller thickness in comparison to a thickness of the main channel portion. Also, according to one embodiment of the present disclosure, a display apparatus comprising the thin film transistor is provided.

A LDMOS device includes a semiconductor layer on an insulation layer and a ring shape gate on the semiconductor layer. The ring shape gate includes a first gate portion, a second gate portion, and two third gate portions connecting the first gate portion and the second gate portion. The semiconductor device further includes a first drain region and a second drain region formed in the semiconductor layer at two sides of the ring shape gate, a plurality of source regions formed in the semiconductor layer surrounded by the ring shape gate, a plurality of body contact regions formed in the semiconductor layer and arranged between the source regions, and a first body implant region and a second body implant region formed in the semiconductor layer, respectively underlying part of the first gate portion and part of the second gate portion, and being connected by the body contact regions.

A thin film transistor includes an active layer including a channel portion; a gate electrode spaced apart from the active layer and overlapping at least a part of the active layer; and source and drain electrodes connected with the active layer and spaced apart from each other, wherein the channel portion includes, a first boundary portion connected with one of the source and drain electrodes; a second boundary portion connected with the other one of the source and drain electrodes; and a main channel portion interposed between the first boundary portion and the second boundary portion, and wherein at least a part of the second boundary portion has a thickness smaller than a thickness of the main channel portion.

According to an aspect, an array substrate includes a first scan line, a second scan line, and a signal line. A semiconductor film has a coupling portion coupling one end of a first linear portion to one end of a second linear portion. Another end of the first linear portion of the semiconductor film and another end of the second linear portion of the semiconductor film are coupled to the signal line. In a plan view, the semiconductor film is disposed between the first scan line and the second scan line, the first linear portion intersects two first gate electrodes, and the second linear portion intersects two second gate electrodes.

According to an aspect, an array substrate includes a first scan line, a second scan line, and a signal line. A semiconductor film has a coupling portion coupling one end of a first linear portion to one end of a second linear portion. Another end of the first linear portion of the semiconductor film and another end of the second linear portion of the semiconductor film are coupled to the signal line. In a plan view, the semiconductor film is disposed between the first scan line and the second scan line, the first linear portion intersects two first gate electrodes, and the second linear portion intersects two second gate electrodes.

A method for manufacturing a semiconductor device includes forming a plate structure over an isolation region. A drain electrode electrically connected to a drift region underlying the isolation region is formed, wherein the drain electrode is separated from a first location of the plate structure by a first distance along a central axis of an active area of the semiconductor device in a direction of a current flow between a source and a drain of the semiconductor device, the drain electrode is separated from a second location of the plate structure by a second distance along a line parallel to the central axis and within the active area. The first distance is less than the second distance.