An array substrate structure is provided, which includes a substrate with a first surface and a second surface opposite to the first surface. A first TFT is on the first surface of the substrate, and a second TFT is on the second surface of the substrate. A through via passes through the substrate, and the first TFT is electrically connected to the second TFT through the through via.

A display device is disclosed. The display device includes a display area and a wiring area. The display area is disposed with a first thin film transistor which is an oxide thin film transistor and a second thin film transistor which is a low temperature poly-silicon thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor includes first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove includes a first sub-groove and a second sub-groove that are stacked, and depths of the second vias are substantially equal to a depth of the second sub-groove.

An electronic device including a first substrate, a semiconductor layer, a second substrate and a color filter is disclosed. The first substrate has a peripheral region. The semiconductor layer is disposed on the first substrate in the peripheral region. The second substrate is opposite to the first substrate. The color filter is disposed between the first substrate and the second substrate and in the peripheral region of the first substrate, and the color filter overlaps the semiconductor layer.

A thin film transistor includes an active layer including a first portion having a first thickness and a second portion having a second thickness greater than the first thickness, a capping layer filling a thickness difference between the first portion and the second portion and arranged on the first portion, a gate insulating layer arranged on the capping layer, a gate electrode on the active layer, wherein the gate insulating layer and the capping layer are disposed between the gate electrode and the active layer, and a source electrode and a drain electrode connected to the active layer.

A method of producing a reduced-defect density crystalline silicon film includes forming a first intrinsic silicon film on a substrate, forming a doped film including silicon or germanium on the first intrinsic silicon film, forming a second intrinsic silicon film on the doped film, and annealing to crystallize the doped film, the second intrinsic silicon film, and the first intrinsic silicon, wherein each film is amorphous at formation, wherein crystallization initiates within the doped film. A method of forming a thin film transistor includes forming an active layer in the crystallized second intrinsic silicon layer by doping the crystallized second intrinsic silicon layer in selected areas to form source and drain regions separated by a channel portion, forming a gate insulator layer on the crystallized second intrinsic silicon layer, and forming a gate electrode pattern over the gate insulator layer.

A display device includes a first polyimide layer, a first silicon oxide layer located above and in direct contact with the first polyimide layer, an amorphous silicon layer located above and in direct contact with the first silicon oxide layer, a second polyimide layer located above and in direct contact with the amorphous silicon layer, a plurality of light-emitting elements located above the second polyimide layer, a transistor array located above the second polyimide layer, the transistor array being configured to control light emission of the plurality of light-emitting elements, a transparent conductive layer located between the transistor array and the second polyimide layer, and a second silicon oxide layer located between and in direct contact with the transparent conductive layer and the second polyimide layer.

A manufacturing method of a display apparatus including preparing a substrate, forming an amorphous silicon layer on the substrate, cleaning the amorphous silicon layer with hydrofluoric acid, crystallizing the amorphous silicon layer into a polycrystalline silicon layer, and forming a metal layer directly on the polycrystalline silicon layer.

An organic light-emitting display apparatus includes an organic light-emitting diode, a switching transistor, a first light emission control transistor, and a driving transistor. The organic light-emitting diode includes an anode and a cathode for receiving a reference voltage. The switching transistor includes a gate electrode for receiving an nth scan signal and a source electrode for receiving a data signal, and is an NMOS transistor. The first light emission control transistor includes a gate electrode for receiving a light emission control signal, and is configured to turn on upon receiving the light emission control signal to determine a timing of flow of a driving current to the organic light-emitting diode, and is a PMOS transistor. The driving transistor is connected to the switching transistor and the first light emission control transistor and provides the driving current to the organic light-emitting diode.

A display device and a method of manufacturing a display device are provided. A display device includes a lower conductive pattern disposed on a substrate, a lower insulating layer disposed on the lower conductive pattern, the lower insulating layer including a first lower insulating pattern including an overlapping region overlapping the lower conductive pattern, and a protruding region. The display device includes a semiconductor pattern disposed on the first lower insulating pattern and having a side surface, the side surface being aligned with a side surface of the first lower insulating pattern or disposed inward from the side surface of the first lower insulating pattern, a gate insulating layer disposed on the semiconductor pattern, a gate electrode disposed on the gate insulating layer, and an empty space disposed between the substrate and the protruding region of the first lower insulating pattern.

A pixel includes a light emitting element, a driving switching element and a first compensation switching element and a second compensation switching element. The driving switching element is which applies a driving current to the light emitting element. The first compensation switching element and the second compensation switching element are connected between a control electrode of the driving switching element and an output electrode of the driving switching element. The first compensation switching element and the second compensation switching element are connected to each other in series. The driving switching element is a P-type transistor. The first compensation switching element is an N-type transistor. The second compensation switching element is a P-type transistor.