H01L29/78678

Image display device and electronic appliance

An image display device includes: a pixel array part formed of first to fourth scanning lines arranged in rows, signal lines arranged in columns, pixel circuits in a matrix connected to the scanning lines and signal lines, and a plurality of power source lines which supplies first to third potentials necessary for the operations of pixel circuit; a signal part which supplies a video signal to the signal lines; and a scanner part which supplies a control signal to the first to fourth scanning lines, and in turn scans the pixel circuit for every row, wherein the pixel circuits include a sampling transistor, a drive transistor, first to third switching transistors, a pixel capacitance, and a light emitting device, and a channel length of the drive transistor is made longer than a channel length of the switching transistors to suppress fluctuations in threshold voltage.

HIGH EFFICIENCY THIN FILM TANDEM SOLAR CELLS AND OTHER SEMICONDUCTOR DEVICES
20170271622 · 2017-09-21 · ·

Architectures for tandem solar cell including two thin films forming a top layer and a bottom layer. Such cells can be bi-facial. Exemplary materials used for the top layer are CIGS (CGS), perovskites (Sn and Ge), amorphous silicon (a-Si), copper oxide, tin sulfide, CZTS and III-V materials. For the bottom layer an inorganic film such as either silicon or germanium may be used. In general, the architecture includes of a glass, plastic or metal substrate and a buffer layer, either an oxide insulator or nitride conductor.

Liquid crystal display device

A method of manufacturing, with high mass productivity, liquid crystal display devices having highly reliable thin film transistors with excellent electric characteristics is provided. In a liquid crystal display device having an inverted staggered thin film transistor, the inverted staggered thin film transistor is formed as follows: a gate insulating film is formed over a gate electrode; a microcrystalline semiconductor film which functions as a channel formation region is formed over the gate insulating film; a buffer layer is formed over the microcrystalline semiconductor film; a pair of source and drain regions are formed over the buffer layer; and a pair of source and drain electrodes are formed in contact with the source and drain regions so as to expose a part of the source and drain regions.

Manufacturing method of array substrate with reduced number of patterning processes array substrate and display device

An array substrate, a manufacturing method thereof and a display device are disclosed. Patterns comprising a gate, a gate insulating layer and a polysilicon active layer are formed on a base substrate by single patterning process. A passivation layer is formed on the substrate surface formed with the patterns, and patterns of a first via and a second via are formed on a surface of the passivation layer by single patterning process. Patterns of a source, a drain and a pixel electrode are formed on the substrate surface formed with the patterns by single patterning process. The source is electrically connected with the polysilicon active layer through the first via, and the drain is electrically connected with the polysilicon active layer through the second via. A pattern of pixel defining layer is formed on the substrate surface formed with the patterns by single patterning process.

LOW TEMPERATURE POLY-SILICON TFT SUBSTRATE AND MANUFACTURING METHOD THEREOF
20170256651 · 2017-09-07 ·

The present invention provides a LTPS TFT substrate and a manufacturing method thereof. The LTPS TFT substrate of the present invention includes a metal layer formed on a channel zone so that the metal layer, a source electrode, and a drain electrode can be used as a mask to form LDD zones in a poly-silicon layer in order to save the mask needed for separately forming the LDD zones; further, due to the addition of the metal layer that is connected to the channel zone of the poly-silicon layer, the electrical resistance of the channel zone can be effectively reduced to increase a TFT on-state current. The LTPS TFT substrate manufacturing method of the present invention forms a metal layer on a channel zone at the same time of forming a source electrode and a drain electrode and uses the metal layer, the source electrode, and the drain electrode as a mask to form LDD zones in a poly-silicon layer so as to save the mask needed for separately forming the LDD zones thereby reducing the manufacturing cost and increasing throughput.

THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE, AND DISPLAY DEVICE

The present disclosure provides a TFT, its manufacturing method, an array substrate and a display device. The method includes steps of: forming a pattern of a gate electrode on a base substrate; forming a gate insulation layer with an even surface; forming a pattern of a polysilicon semiconductor layer; and forming patterns of a source electrode and a drain electrode. The step of forming the pattern of the polysilicon semiconductor layer includes: crystallizing the amorphous silicon layer, so as to form the polysilicon semiconductor layer.

CMOS STRUCTURE AND METHOD FOR MANUFACTURING CMOS STRUCTURE
20220045054 · 2022-02-10 ·

The disclosure relates to a CMOS structure and a manufacturing method thereof. The CMOS structure includes a substrate and an N-type TFT and a P-type TFT on the substrate. The N-type TFT includes a first gate electrode, a first active layer, and a first gate dielectric layer therebetween. The first active layer includes a first semiconductor layer, a second semiconductor layer of the N-type, and a third semiconductor layer of the N-type which are located at opposite ends of the first semiconductor layer and sequentially stacked in a direction away from the first gate dielectric layer. An N-type doping concentration of the second semiconductor layer is smaller than that of the third semiconductor layer. The P-type TFT includes a fifth semiconductor layer and a sixth semiconductor layer. A P-type doping concentration of the fifth semiconductor layer is smaller than that of the sixth semiconductor layer.

ARRAY SUBSTRATE AND METHOD OF MANUFACTURING SAME
20210408063 · 2021-12-30 ·

An array substrate and a method of manufacturing the same are provided. The array substrate includes a base substrate, a buffer layer, an active layer, a dielectric insulating layer, and a source/drain layer stacked in sequence. A trench is provided on a surface of the base substrate facing the buffer layer, and the trench is sunk to another surface of the base substrate. The array substrate further includes a gate layer. The gate layer is disposed in the trench of the base substrate. The buffer layer is disposed on the base substrate and totally covers the gate layer.

ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
20210408074 · 2021-12-30 ·

The present disclosure relates to an array substrate and a method for manufacturing the array substrate. The array substrate includes a substrate having a display region and a peripheral region surrounding the display region, the display region including sub-pixels arranged in an array, and a plurality of thin film transistors located on the substrate, including a plurality of first thin film transistors located within the peripheral region and a second thin film transistor located within each sub-pixel of the display region, wherein there is a first distance in a row and/or column direction between first active layers of the first thin film transistors and second active layers of nearest neighbor second thin film transistors, and there is a second distance in a row and/or column direction between adjacent second active layers, wherein the first distance is substantially equal to the second distance.

Display apparatus
11211443 · 2021-12-28 · ·

A display apparatus includes: a substrate including a display area where a plurality of pixels are arranged to display an image, and a non-display area around the display area; an opposite electrode commonly provided to the plurality of pixels; a driving voltage supply line extending in a first direction to correspond to one of sides of the display area in the non-display area, and configured to supply a driving voltage to the plurality of pixels; and a common voltage supply line comprising a bent portion that is bent to correspond to one corner of the driving voltage supply line in the non-display area, and configured to supply a common voltage by being connected to the opposite electrode.