H01L2224/294

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTORS CONTAINING THE SAME, AND THEIR USE IN METHODS AND SYSTEMS FOR TREATING CELL PROLIFERATION DISORDERS

An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, particularly medical uses for treatment of cell proliferation disorders.

ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS

An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, including various adhesives applications.

ENERGY AUGMENTATION STRUCTURES AND THEIR USE IN SOLAR CELLS AND OTHER ENERGY CONVERSION DEVICES

An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, especially in the field of solar cells and other energy conversion devices.

ELECTRONIC DEVICE
20220084982 · 2022-03-17 · ·

An electronic device includes a substrate, a first pad disposed on the substrate and having a first conductive layer and a second conductive layer disposed on the first conductive layer, a first insulating layer disposed on the first conductive layer and having at least one opening exposing a portion of the first conductive layer, and a second pad disposed opposite to the first pad. The second conductive layer is disposed on the first conductive layer in the at least one opening and extends over the at least one opening to be disposed on a portion of the insulating layer. A bottom of the least one opening of the first insulating layer has an arc edge in a top view of the electronic device.

ELECTRONIC DEVICE
20220084982 · 2022-03-17 · ·

An electronic device includes a substrate, a first pad disposed on the substrate and having a first conductive layer and a second conductive layer disposed on the first conductive layer, a first insulating layer disposed on the first conductive layer and having at least one opening exposing a portion of the first conductive layer, and a second pad disposed opposite to the first pad. The second conductive layer is disposed on the first conductive layer in the at least one opening and extends over the at least one opening to be disposed on a portion of the insulating layer. A bottom of the least one opening of the first insulating layer has an arc edge in a top view of the electronic device.

SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH MAGNETIC LAYER, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME
20220102579 · 2022-03-31 · ·

A semiconductor light emitting element can include an n-type semiconductor layer, a p-type semiconductor layer in a first region on the n-type semiconductor layer, a p-type electrode on the p-type semiconductor layer, an n-type electrode in a second region different from the first region on the n-type semiconductor layer, a magnetic layer under the n-type semiconductor layer, a reflective layer between the n-type semiconductor layer and the magnetic layer, and a passivation layer surrounding the n-type semiconductor layer, the p-type semiconductor layer, the p-type electrode, the n-type electrode, and the magnetic layer.

SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH MAGNETIC LAYER, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME
20220102579 · 2022-03-31 · ·

A semiconductor light emitting element can include an n-type semiconductor layer, a p-type semiconductor layer in a first region on the n-type semiconductor layer, a p-type electrode on the p-type semiconductor layer, an n-type electrode in a second region different from the first region on the n-type semiconductor layer, a magnetic layer under the n-type semiconductor layer, a reflective layer between the n-type semiconductor layer and the magnetic layer, and a passivation layer surrounding the n-type semiconductor layer, the p-type semiconductor layer, the p-type electrode, the n-type electrode, and the magnetic layer.

Electronic device having integrated circuit chip connected to pads on substrate with curved corners
11302622 · 2022-04-12 · ·

The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.

Electronic device having integrated circuit chip connected to pads on substrate with curved corners
11302622 · 2022-04-12 · ·

The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.

Anisotropic conductive film and connected structure
11139265 · 2021-10-05 · ·

Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.