A printed wiring board includes a first circuit board having a first surface and a second surface, and a second circuit board having a third surface and a fourth surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board is in contact with the third surface of the second circuit board, the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board, and the first circuit board and the second circuit board are formed such that a ratio H1/h1 is in a range that is greater than 0.75 and smaller than 2.4, where H1 represents a thickness of the first circuit board and h1 represents a thickness of the second circuit board.

A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.

An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on the polymer base layer and the metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.

A method of manufacturing a forceps includes providing first and second jaw members and depositing an electrically-conductive tissue sealing plate atop each jaw member via vapor deposition. The jaw members are then coupled to one another to permit movement of one (or both) of the jaw members relative to the other between a spaced-apart position and an approximated position for grasping tissue between the tissue sealing plates thereof.

The present specification relates to a conductive structure body and a method for manufacturing the same.

A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (5.sub.1) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).