A smoke and dust treatment apparatus for welding, said apparatus comprising a polishing and dust extraction module and a smoke and dust purification module. The polishing and dust extraction module comprises a double-layer dust extraction cover (3), a protective cover (2), an industrial brush (4), a first air guide portion, a second air guide portion (24) and a drive motor (22), the drive motor (22) driving the industrial brush (4) to rotate at high speed to perform polishing. During welding and polishing, a mechanical arm (6) drives the double-layer dust extraction cover (3), and a suction hole (20) of the double-layer dust extraction cover (3) and a suction guide hole (19) on the industrial brush (4) simultaneously take in toxic gas and debris such as iron filings.

A wiping object cleaning device for a floor mopping machine belongs to the technical field of cleaning appliances. The wiping object cleaning device includes a bucket body, and further includes a water conveying mechanism for conveying water to a wiping object of a floor mopping machine. The water conveying mechanism conveys water during cleaning, and stops conveying water during water removal. The wiping object cleaning device is able to clean a mop of a floor mopping machine efficiently, wide in application range, suitable for different wiping objects of floor mopping machines, and low in production cost.

A wiping object cleaning device for a floor mopping machine belongs to the technical field of cleaning appliances. The wiping object cleaning device includes a bucket body, and further includes a water conveying mechanism for conveying water to a wiping object of a floor mopping machine. The water conveying mechanism conveys water during cleaning, and stops conveying water during water removal. The wiping object cleaning device is able to clean a mop of a floor mopping machine efficiently, wide in application range, suitable for different wiping objects of floor mopping machines, and low in production cost.

The present invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, which are improved in terms of both performance and throughput. The substrate cleaning apparatus (16) includes: a cleaning tool (77) configured to clean a substrate (W) held by a substrate holder (71, 72, 73, 74); a surface-property measuring device configured to obtain surface data of the cleaning tool (77); and a controller (30) configured to determine a replacement time of the cleaning tool (77) based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool (77) at at least two measurement points (PA, PB) of the cleaning tool (77) each time a predetermined number of substrates (W) are scrubbed, and the controller (30) is configured to determine the replacement time of the cleaning tool (77) based on a difference in the surface data obtained.

The present invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, which are improved in terms of both performance and throughput. The substrate cleaning apparatus (16) includes: a cleaning tool (77) configured to clean a substrate (W) held by a substrate holder (71, 72, 73, 74); a surface-property measuring device configured to obtain surface data of the cleaning tool (77); and a controller (30) configured to determine a replacement time of the cleaning tool (77) based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool (77) at at least two measurement points (PA, PB) of the cleaning tool (77) each time a predetermined number of substrates (W) are scrubbed, and the controller (30) is configured to determine the replacement time of the cleaning tool (77) based on a difference in the surface data obtained.

There is provided a peeling apparatus including an ingot holding unit that has a holding surface for holding an ingot, a wafer holding unit that is capable of approaching and separating from the ingot holding unit and has a holding surface for holding under suction a wafer to be produced, and a cleaning brush that cleans peel-off surfaces at which the wafer to be produced has been peeled off from the ingot and thereby removes peeling swarf.

There is provided a peeling apparatus including an ingot holding unit that has a holding surface for holding an ingot, a wafer holding unit that is capable of approaching and separating from the ingot holding unit and has a holding surface for holding under suction a wafer to be produced, and a cleaning brush that cleans peel-off surfaces at which the wafer to be produced has been peeled off from the ingot and thereby removes peeling swarf.

The technology relates to a system for clearing a sensor cover. The system may comprise a wiper comprising a wiper support, a wiper blade, and a sensor cover. The wiper blade may be configured to clear the sensor cover of debris, and the sensor cover may be configured to house one or more sensors. A wiper motor may rotate the wiper and a sensor motor may rotate the sensor cover. The system wiper blade may comprise a first edge attached to the wiper support and a second edge which may be configured to be in contact with the sensor cover. The wiper blade may extend in a corkscrew shape around the wiper support. The wiper motor may be configured to rotate the wiper in a first direction and the sensor motor may be configured to rotate the sensor cover in a second direction opposite the first direction.

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

Methods and apparatuses associated with surface cleaning are described. Examples can include detecting at a processing resource of a robot and via a temperature sensor of the robot, a temperature of a surface on which the robot is located. Examples can include the processing resource shutting down the robot in response to the temperature being at or above a particular threshold temperature, and the processing resource instructing the robot to clean the surface following a particular cleaning path using a vacuum, a scrubber, or both in response to the temperature being below a particular threshold temperature.