An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

An automated welding system includes a support structure, a plurality of welding heads, and a controller. The plurality of welding heads are each removably, mechanically coupleable to the support structure. The controller is configured to control welding operations of the automated welding system based on an identity of a particular welding head of the plurality of welding heads that is mechanically coupled to the support structure and operably coupled to the controller.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A soldering iron including an iron main body; and an iron tip having a leading end configured to fuse solder, the iron tip including an iron tip main body of a thermal conductive material; a heater configured to heat the iron tip main body, and a temperature sensor configured to detect a temperature of the leading end side of the iron tip, wherein, a first hole part accommodating the heater and a second hole part accommodating the temperature sensor are formed independent of each other inside the iron tip main body.

A soldering iron system includes a power assembly that provides power to an induction heater at a variable voltage and a variable frequency. A control assembly adjusts the temperature of the heater in accordance with signals from a current detector coupled to the induction heater and a selection made by the user on an operating level selector.

A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at a fixed tip temperature ramp rate during the soldering event; and provided at an adjustable tip temperature ramp rate during the soldering event.

A brazing work assistance method includes: displaying (i) a first reference range indicating a range between an upper value and a lower value obtained from a first temperature waveform that is a model temperature waveform of a brazing portion in the brazing work, and (ii) a measured waveform that is a temperature waveform of the brazing portion brazed during the brazing work conducted by the worker; and displaying a second reference range according to the measured waveform when the measured waveform falls outside the first reference range. The second reference range indicates a range between an upper value and a lower value obtained from a second temperature waveform and is different from the first reference range. The second temperature waveform is a model temperature waveform of the brazing portion in the brazing work, is different from the first temperature waveform.

The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.

An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.