Provided is a method for machining a workpiece including a substrate that has front and back surfaces and a ductile material layer that contains a ductile material and is disposed on the front or back surface. The method includes a tape bonding step of bonding a tape on a side of the substrate of the workpiece, a holding step of holding the workpiece by a holding table via the tape, and a cutting step of relatively moving the holding table and a cutting blade to cause the cutting blade to cut into the ductile material layer and the substrate. In the cutting step, the cutting blade is rotated such that a portion of the cutting blade, the portion being located on a forward side in a moving direction of the cutting blade relative to the holding table, cuts into the workpiece from the ductile material layer toward the substrate.

A technology for processing (and/or working) a gemstone is provided, and specifically, a method for, and an apparatus for manufacturing a high-hardness diamond simulant by cutting a gemstone into a 100-sided body are provided.

Method for cutting crystal boules using diamond wire, wherein this boule is driven about a main axis, a cutting wire is held taut and driven through a temporary drum immobilising each boule in position with respect to the main axis throughout the entire cutting operation, this temporary drum being made by overmoulding a coating material on at least one boule bonded onto a sacrificial core, the cutting being followed by the slicing of cut rings from which are detached, particularly using heat, crystalline plates with parallel faces.

Provided is a method for machining a workpiece including a substrate that has front and back surfaces and a ductile material layer that contains a ductile material and is disposed on the front or back surface. The method includes a tape bonding step of bonding a tape on a side of the substrate of the workpiece, a holding step of holding the workpiece by a holding table via the tape, and a cutting step of relatively moving the holding table and a cutting blade to cause the cutting blade to cut into the ductile material layer and the substrate. In the cutting step, the cutting blade is rotated such that a portion of the cutting blade, the portion being located on a forward side in a moving direction of the cutting blade relative to the holding table, cuts into the workpiece from the ductile material layer toward the substrate.

A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line.

A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.

A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line.

Method for cutting crystal boules using diamond wire, wherein this boule is driven about a main axis, a cutting wire is held taut and driven through a temporary drum immobilising each boule in position with respect to the main axis throughout the entire cutting operation, this temporary drum being made by overmoulding a coating material on at least one boule bonded onto a sacrificial core, the cutting being followed by the slicing of cut rings from which are detached, particularly using heat, crystalline plates with parallel faces.

A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.

The present subject matter relates to an indexing unit for a gemstone processing machine. The indexing unit may include a base plate that may comprise a plurality of plates. Further, the base plate may be coupled to an indexing mechanism such that the indexing mechanism may impart rotational, translational, and tilting motion to the base plate. Further, the plurality of plates may include axially extending concentric holes in which a plurality of holders may be disposed. Further, the plurality of holes may hold the gemstone for processing. In one implementation, the plurality of holders may be coupled to one or more actuating mechanisms that may impart rotational, translational, and tilting motion to the individual holders.