A photoelectric sensor includes: a placement table configured to allow a workpiece to be placed thereon; a light projecting device including a light emitting element configured to emit light and a converging element configured to converge the light emitted from the light emitting element toward a detection area; and a light receiving device configured to receive the light passing through the detection area from the converging element at a position located on a same plane as the placement table in a direction along an optical axis of the light. The optical axis of the light projected from the light projecting device is set such that the light is incident in a direction perpendicular to an incident surface of the light receiving device and focused on the incident surface of the light receiving device.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A method for connecting first and second plastic parts by a laser transmission bonding wherein the first plastic part absorbs laser light and the second plastic part is made of transparent plastic. The method includes the following steps: positioning the first plastic part in a first tool, positioning the second plastic part in a second tool so that the first plastic part and the second plastic part are spaced from each other thereby preventing mutual heat exchange between the parts, directing laser light through the second plastic part onto a connection zone of the first plastic part whereby the first plastic part is heated at least within the connection zone, after heating the first plastic part, moving the second plastic part into contact with the first plastic part, so that the second plastic part is firmly bonded to the first plastic part.

A system for joining at least two workpieces of thermoplastic material by laser transmission welding, the system comprising at least one device for generating laser radiation and an imaging optics having a first optical axis, wherein laser radiation emitted by the device for generating laser radiation is guided into a joining zone and wherein the imaging optics is configured for optical imaging from a joining plane in the joining zone to a detection plane of a radiation detecting device. According to an aspect, a deflection mirror is arranged at a coupling point on a second optical axis running parallel to the first optical axis for deflecting the laser radiation from an entrance axis enclosing a non-zero angle, preferably a right angle, with the second optical axis into a direction along the second optical axis.

A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

The invention relates to a method for welding a connection between a first joining surface of a first molded part and a second joining surface of a second molded part, which by means of a clamping device are moved and braced with their joining surfaces in contact with one another, wherein the first molded part is at least partially transparent for a primary beam of a first radiation source and at least partially absorbent for a secondary beam of a second radiation source, and the second molded part is at least partially absorbent for the primary beam, wherein sequentially the second molded part is irradiated with the primary beam and the first molded part is irradiated with the secondary beam.

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

A description is given of a method for joining a first and a second film web (2, 2′) of a transfer film or laminating film, wherein the film webs (2, 2′) comprise a thermoplastic carrier film (21) and a decorative layer (23). Formed between the first and second film webs (2, 2′) is a common joining portion (3), in which the first and second film webs (2, 2′) are joined to each other by a welding process. A device for carrying out the method is also described.