A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device.

A device includes a readout circuit coupled between an input node and an output node; a microelectromechanical systems (MEMS) device coupled to the input node; and a first charge controlled clamp circuit coupled between the input node and a first bias node.

In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.

Active surface structures comprise an exposed surface, a controlled group of MEMS (micro-electro-mechanical system) actuators, and a controlled region of the exposed surface corresponding to the controlled group. The controlled region has a first state, and a second state that is less textured than the first state. Active surface structures may be part of an apparatus that includes a controller and/or one or more sensors. The controller, sensors, and the controlled region may form a feedback loop in which the active surface structure is actively controlled.

In an embodiment a sensor device includes a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate and a first pellistor element including a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane, wherein the first cover layer is arranged over or under the first membrane, and wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity.

A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×10.sup.5 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

A semiconductor pressure sensor includes: a first silicon substrate including a first recessed part; and a second silicon substrate including a diaphragm covering a first space in the first recessed part, the second silicon substrate being configured to hermetically seal the first space. In cross-section, a plurality of second spaces are hermetically sealed in a state of being separated away from the first space between the first silicon substrate and the second silicon substrate, and are provided in one of or each of a first end side and a second end side of the first space.

A pressure sensor structure includes a sensor body including a diaphragm plate that functions as a sense electrode, a base electrode that faces the diaphragm plate, and a sidewall layer maintaining a gap between the diaphragm plate and the base electrode, and a conductive guard substrate to support the sensor body. The sidewall layer includes a guard electrode layer and upper and lower electrically insulating layers to electrically insulate the guard electrode layer. An electrically insulating layer is between the guard substrate and the sensor body to electrically insulate the guard substrate. The guard substrate is electrically connected to the guard electrode layer to function as a guard electrode together with the guard electrode layer.

Various embodiments of the present disclosure are directed towards a method for manufacturing a microelectromechanical systems (MEMS) device. The method includes forming a particle filter layer over a carrier substrate. The particle filter layer is patterned while the particle filter layer is disposed on the carrier substrate to define a particle filter in the particle filter layer. A MEMS substrate is bonded to the carrier substrate. A MEMS structure is formed over the MEMS substrate.

A force sensor having a noise shielding layer is disclosed. For a first embodiment, a top noise shielding layer is configured on a top surface of a force sensor to screen noise signals which are caused by human body's touch or approaching from top of the force sensor. For a second embodiment, a bottom noise shielding layer is configured on a bottom surface of the force sensor to screen noise signals which are caused by human body's touch or approaching from bottom of the force sensor.