B PERFORMING OPERATIONS; TRANSPORTING
B81 MICROSTRUCTURAL TECHNOLOGY
B81B MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7/00 Microstructural systems;; Auxiliary parts of microstructural devices or systems
B81B7/0032 Packages or encapsulation
B81B7/0045 for reducing stress inside of the package structure
B81B7/0048 between the MEMS die and the substrate