The present invention discloses a MEMS device and electronic apparatus. The MEMS device comprises: a micro-LED; and a movable member, wherein the micro-LED is mounted on the movable member and is configured for moving with the movable member. According to an embodiment of this invention, the signal detection of a MEMS device can be simplified and/or the contents of signals produced by the MEMS device can be enriched.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A MEMS capacitive pressure sensor is provided. The MEMS capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The capacitive pressure sensor also includes a second dielectric layer having a step surface profile formed on the first dielectric layer, and a first electrode layer having a step surface profile formed on the second dielectric layer. Further, the MEMS capacitive pressure sensor includes an insulation layer formed on the first electrode layer, and a second electrode layer having a step surface profile with a portion formed on the insulation layer in the peripheral region and the rest suspended over the first electrode layer in the device region. Further, the MEMS capacitive pressure sensor also includes a chamber having a step surface profile formed between the first electrode layer and the second electrode layer.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.

A micromechanical sensor device with a movable gate includes a field effect transistor having a drain region, a source region, a channel region arranged between the field effect transistor and the source region and including a first doping type, and a movable gate. The movable gate is separated from the channel region by an interspace. The drain region, the source region, and the channel region are arranged in a substrate. An oxide region is provided in the substrate at least at longitudinal sides of the channel region.

A symmetrical MEMS accelerometer. The accelerometer includes a top half and a bottom half bonded together to form the frame and the mass located within the frame. The frame and the mass are connected through resilient beams. A plurality of hollowed parts and the first connecting parts are formed on the top and bottom side of the mass, respectively. The second connecting parts are formed on the top and bottom side of the frame, respectively. The resilient beams connect the first connecting part with the second connecting part. Several groups of comb structures are formed on top of the hollowed parts. Each comb structure includes a plurality of moveable teeth and fixed teeth. The moveable teeth extend from the first connecting part and the fixed teeth extend from the second connecting part. Capacitance is formed between the movable teeth and the fixed teeth. Since the accelerometer is symmetrical with a large mass, it has a large capacitance with a low damping force.

In one example, an apparatus that is part of a Light Detection and Ranging (LiDAR) module of a vehicle comprises a semiconductor integrated circuit comprising a microelectromechanical system (MEMS) and a substrate. The MEMS comprises an array of micro-mirror assemblies, each micro-mirror assembly comprising: a micro-mirror having a first thickness; and an actuator comprising first fingers and second fingers, the first fingers being connected with the substrate, the second fingers being mechanically connected to the micro-mirror having a second thickness smaller than the first thickness, the actuator being configured to generate an electrostatic force between the first fingers and the second fingers to rotate the micro-mirror to reflect light emitted by a light source out of the LiDAR module or light received by the LiDAR module to a receiver.

In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

A radio frequency micro-electromechanical switch (generally referred to using the acronyms RF MEMS) is described. Also described is a method of producing such an RF MEMS switch.