A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device.

An electromechanical microsystem including an electromechanical transducer, a deformable diaphragm, a first cavity hermetically containing a deformable medium keeping a substantially constant volume under the action of an external pressure change and a second cavity. The deformable diaphragm forms a wall of the cavity and has at least one area freely deformable elastically. The free area also forms a wall of the second cavity. The electromechanical transducer is configured so that its movement depends on the external pressure change, and vice versa. A change in the external pressure in the first cavity induces a variation of the volume of the second cavity, or vice versa. Thus, the proposed electromechanical microsystem enables gripping of an object obstructing the opening of the second cavity and forms a microbarometer capable of converting at least one ambient pressure change into an electrical signal.

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

A method of transferring a micro device using a micro device transfer head is provided. The micro device transfer head includes a base arm, a first side arm and a second side arm, and the micro device is fabricated on a substrate. The method includes moving the first side arm within a sensing range of the micro device, charging the first side arm for drawing the micro device away from the substrate to move towards a space between the first side arm and the second side arm, and shortening a distance between the first side arm and the second side arm for clamping the micro device.

First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

The invention relates to a method of assembling mobile micro-machines comprising a main body and at least one actuating element, wherein the method comprises the steps of defining a 3D-shape of elements of the mobile micro-machines, the elements comprising components such as the main body and/or the at least one actuating element; fabricating said elements, said step of fabrication comprising at least the fabrication of the main body, the main body comprising one or more edges; and assembling said mobile micro-machines by applying an external electric field, wherein said external electric field forms electric field gradients at said one or more edges and wherein said gradients attract said actuating element so that the main body and the at least one actuating element self-assemble into a micro-machine at said one or more edges. The invention further relates to a mobile micro-machine.

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.