This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a surface, the adhesive remaining uncured until activated by application of a threshold pressure. The adhesive comprises a matrix comprising a hardener and a plurality of microcapsules filled with an adhesive resin, the microcapsules being configured to rupture on application of the threshold pressure, thereby exposing the resin to the matrix and allowing the resin to react with the hardener to form an adhesive bond between the decorative element and the surface. The matrix may further comprise a rheology additive such that the matrix has a higher viscosity than the hardener at room temperature. Methods of making an adherable element, and decorative articles comprising the adherable element are also disclosed.

An advanced epoxy resin including a reaction product of (A) at least one epoxy resin; (B) at least one cashew nutshell liquid; and (C) at least one multifunctional carboxylic acid; a curable epoxy resin composition prepared using the above advanced epoxy resin; and the use of the above curable epoxy resin composition to prepare a coating.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

##STR00001##

Where, in the formula (1), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.

Trisubstituted triazines having the formula: ##STR00001## wherein: X is O and n is 0 or 1, Y is OH, NH.sub.2 or CH.sub.2NH.sub.2, Q is P, P═O, CH or N, when Q is P, R is phenyl, when Q is P═O, Z is R or OR, and R is alkyl or phenyl, when Q is CH, Z is PO(R).sub.2 or PO(OR).sub.2, when Q is N, Z is R, and their uses as epoxy and cyclic carbonate polymer curing agents.

Curable compositions are provided comprising (i) at least one epoxy resin as specified (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30 C to about 100 C and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50 C to about 180 C and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10 C and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; and (iii) a filler as specified. Also provided are compositions obtainable by curing the curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.

The present disclosure provides a curable composition that includes an epoxy resin and a curing component comprising a blend of at least two amines. The curable composition may be combined with reinforced fibers and cured to form a composite article which can be used in various applications, such as in wind turbine blades.

An electromagnetic steel sheet coated with an insulating film with excellent hardness and suitable for use as a material for iron cores of large-sized electric-power generators; and a process for producing the electromagnetic steel sheet coated with an insulating film. The purpose is achieved with a coating material for forming insulating films, the coating material including a solvent and components (A) to (C) contained therein in the respective amounts on a solid basis. (A) A water-compatible carboxylated resin; 100 parts by mass. (B) An aluminum-containing oxide; more than 40 parts by mass but less than 300 parts by mass per 100 parts by mass of the component (A). (C) At least one crosslinking agent selected from the group containing of melamine, isocyanates, and oxazoline; 100 parts by mass or more but less than 300 parts by mass per 100 parts by mass of the component (A).

A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.